SG11201907780UA - Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device - Google Patents

Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device

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Publication number
SG11201907780UA
SG11201907780UA SG11201907780UA SG11201907780UA SG11201907780UA SG 11201907780U A SG11201907780U A SG 11201907780UA SG 11201907780U A SG11201907780U A SG 11201907780UA SG 11201907780U A SG11201907780U A SG 11201907780UA SG 11201907780U A SG11201907780U A SG 11201907780UA
Authority
SG
Singapore
Prior art keywords
laser irradiation
semiconductor device
manufacturing semiconductor
irradiation apparatus
laser
Prior art date
Application number
SG11201907780UA
Inventor
Hiroaki Imamura
Takahiro Fuji
Yoshihiro Yamaguchi
Original Assignee
Japan Steel Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Steel Works Ltd filed Critical Japan Steel Works Ltd
Publication of SG11201907780UA publication Critical patent/SG11201907780UA/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02587—Structure
    • H01L21/0259—Microstructure
    • H01L21/02592—Microstructure amorphous
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02656—Special treatments
    • H01L21/02664—Aftertreatments
    • H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Abstract

A l a s e r i r r a d i a t i o n a p p a r a t u s ( 1 ) a c c o r d i n g t o a n e m b o d i m e n t i n c l u d e s a l a s e r g e n e r a t i o n d e v i c e ( 1 4 ) c o n f i g u r e d t o g e n e r a t e l a s e r l i g h t , a l e v i t a t i o n u n i t ( 1 0 ) c o n f i g u r e d t o l e v i t a t e a n o b j e c t t o b e 5 p r o c e s s e d ( 1 6 ) t o w h i c h t h e l a s e r l i g h t i s a p p l i e d , a n d a c o n v e ya n c e u n i t ( 1 1 ) c o n f i g u r e d t o c o n v e y t h e l e v i t a t e d o b j e c t t o b e p r o c e s s e d ( 1 6 ) . T h e c o n v e y a n c e u n i t ( 1 1 ) i n c l u d e s a h o l d i n g m e c h a n i s m ( 1 2 ) f o r h o l d i n g t h e o b j e c t t o b e p r o c e s s e d ( 1 6 ) b y a b s o r b i n g t h e o b j e c t t o b e p r o c e s s e d ( 1 6 ) , a n d a m o v i n g m e c h a n i s m ( 1 3 ) f o r m o v i n g t h e h o l d i n g 1 0 m e c h a n i s m ( 1 2 ) i n a c o n v e y a n c e d i r e c t i o n . T h e h o l d i n g m e c h a n i s m ( 1 2 ) i n c l u d e s a b a s e ( 1 5 3 ) i n c l u d i n g a p l u r a l i t y o f t h r o u g h h o l e s ( 1 5 2 ) , a p l u r a l i t y o f p i p e s ( 1 4 5 ) e a c h o f w h i c h i s c o n n e c t e d t o a r e s p e c t i v e o n e o f t h e p l u r a l i t y o f t h r o u g h h o l e s ( 1 5 2 ) , a v a c u u m g e n e r a t i o n d e v i c e ( 1 4 4 ) c o n f i g u r e d t o e v a c u a t e a i r f r o m t h e p l u r a l i t y o f p i p e s ( 1 4 5 ) , a n d 1 5 a p l u r a l i t y o f a b s o r p t i o n a s s i s t a n c e v a l v e s ( 1 5 0 ) e a c h o f w h i c h i s d i s p o s e d i n t h e m i d d l e o f a r e s p e c t i v e o n e o f t h e p l u r a l i t y o f p i p e s ( 1 4 5 ) , e a c h o f t h e p l u r a l i t y o f a b s o r p t i o n a s s i s t a n c e v a l v e s ( 1 5 0 ) b e i n g c o n f i g u r e d t o b e c l o s e d w h e n a f l o w r a t e o f a g a s f l o w i n g i n t o t h e p i p e ( 1 4 5 ) t h r o u g h t h e t h r o u g h h o l e ( 1 5 2 ) b e c o m e s e q u a l t o o r h i g h e r t h a n a 2 0 t h r e s h o l d . [ F i g . 9 ]
SG11201907780UA 2017-03-16 2017-08-18 Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device SG11201907780UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017050811A JP6829118B2 (en) 2017-03-16 2017-03-16 Laser irradiation device, laser irradiation method, and manufacturing method of semiconductor device
PCT/JP2017/029617 WO2018168002A1 (en) 2017-03-16 2017-08-18 Laser irradiation apparatus, laser irradiation method, and semiconductor device manufacturing method

Publications (1)

Publication Number Publication Date
SG11201907780UA true SG11201907780UA (en) 2019-09-27

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Country Status (7)

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US (2) US10950474B2 (en)
JP (1) JP6829118B2 (en)
KR (1) KR20190129871A (en)
CN (2) CN110418691B (en)
SG (1) SG11201907780UA (en)
TW (1) TW201843000A (en)
WO (1) WO2018168002A1 (en)

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Publication number Publication date
US20200006096A1 (en) 2020-01-02
US20210159100A1 (en) 2021-05-27
US11676831B2 (en) 2023-06-13
JP6829118B2 (en) 2021-02-10
KR20190129871A (en) 2019-11-20
US10950474B2 (en) 2021-03-16
CN114393295A (en) 2022-04-26
CN110418691B (en) 2022-02-15
WO2018168002A1 (en) 2018-09-20
TW201843000A (en) 2018-12-16
JP2018157000A (en) 2018-10-04
CN110418691A (en) 2019-11-05

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