SG11201906918SA - Method and Device for Aligning Two Optical Partial Systems - Google Patents

Method and Device for Aligning Two Optical Partial Systems

Info

Publication number
SG11201906918SA
SG11201906918SA SG11201906918SA SG11201906918SA SG11201906918SA SG 11201906918S A SG11201906918S A SG 11201906918SA SG 11201906918S A SG11201906918S A SG 11201906918SA SG 11201906918S A SG11201906918S A SG 11201906918SA SG 11201906918S A SG11201906918S A SG 11201906918SA
Authority
SG
Singapore
Prior art keywords
aligning
partial systems
optical partial
optical
systems
Prior art date
Application number
SG11201906918SA
Inventor
Boris Povazay
Original Assignee
Ev Group E Thallner Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ev Group E Thallner Gmbh filed Critical Ev Group E Thallner Gmbh
Publication of SG11201906918SA publication Critical patent/SG11201906918SA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70516—Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G03F7/706—Aberration measurement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67282—Marking devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
    • H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

Abstract

Method and Device for Aligning Two Optical Partial Systems A method and a device for aligning two lenses is proposed. Figure 1a
SG11201906918SA 2017-03-16 2018-02-22 Method and Device for Aligning Two Optical Partial Systems SG11201906918SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017105697.1A DE102017105697A1 (en) 2017-03-16 2017-03-16 Method and device for aligning two optical subsystems
PCT/EP2018/054433 WO2018166772A1 (en) 2017-03-16 2018-02-22 Method and apparatus for aligning two optical subsystems

Publications (1)

Publication Number Publication Date
SG11201906918SA true SG11201906918SA (en) 2019-08-27

Family

ID=61557254

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201906918SA SG11201906918SA (en) 2017-03-16 2018-02-22 Method and Device for Aligning Two Optical Partial Systems

Country Status (9)

Country Link
US (1) US11209739B2 (en)
EP (1) EP3596751B1 (en)
JP (1) JP7143314B2 (en)
KR (1) KR102546940B1 (en)
CN (1) CN110366773B (en)
DE (1) DE102017105697A1 (en)
SG (1) SG11201906918SA (en)
TW (1) TWI714833B (en)
WO (1) WO2018166772A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11136202B2 (en) * 2020-01-06 2021-10-05 Asm Technology Singapore Pte Ltd Direct transfer apparatus for electronic components
JP2023183276A (en) * 2022-06-15 2023-12-27 キオクシア株式会社 Bonding apparatus, bonding method, and manufacturing method of semiconductor device

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3442583A (en) * 1966-12-19 1969-05-06 Ibm Mask alignment system using coherent fiber bundle
US3752589A (en) * 1971-10-26 1973-08-14 M Kobayashi Method and apparatus for positioning patterns of a photographic mask on the surface of a wafer on the basis of backside patterns of the wafer
JPS5636566B2 (en) * 1973-06-18 1981-08-25
US4417123A (en) * 1981-07-06 1983-11-22 The United States Of America As Represented By The Secretary Of The Navy Laser formed video tube calibration markers
JPH0723933B2 (en) * 1985-08-20 1995-03-15 株式会社ニコン Optical path length compensation optical system
JPS62262426A (en) 1986-05-09 1987-11-14 Canon Inc Exposure device
JP2658051B2 (en) 1987-05-15 1997-09-30 株式会社ニコン Positioning apparatus, projection exposure apparatus and projection exposure method using the apparatus
US5260771A (en) * 1988-03-07 1993-11-09 Hitachi, Ltd. Method of making semiconductor integrated circuit, pattern detecting method, and system for semiconductor alignment and reduced stepping exposure for use in same
NL8900991A (en) * 1989-04-20 1990-11-16 Asm Lithography Bv DEVICE FOR IMAGING A MASK PATTERN ON A SUBSTRATE.
JP3109852B2 (en) * 1991-04-16 2000-11-20 キヤノン株式会社 Projection exposure equipment
JPH08264427A (en) * 1995-03-23 1996-10-11 Nikon Corp Method and device for alignment
JP2994232B2 (en) * 1995-07-28 1999-12-27 ウシオ電機株式会社 Mask-to-mask or mask-to-work alignment method and apparatus
US5767523A (en) * 1997-04-09 1998-06-16 Svg Lithography Systems, Inc. Multiple detector alignment system for photolithography
AT405775B (en) 1998-01-13 1999-11-25 Thallner Erich Method and apparatus for bringing together wafer-type (slice-type, disk-shaped) semiconductor substrates in an aligned manner
JP3472120B2 (en) * 1998-01-30 2003-12-02 株式会社東芝 How to place measurement marks
US6222198B1 (en) * 1998-11-20 2001-04-24 Mems Optical Inc. System and method for aligning pattern areas on opposing substrate surfaces
JP2003303865A (en) 2002-04-08 2003-10-24 Tokyo Seimitsu Co Ltd Positioning device and prober device
EP1547780A4 (en) * 2002-09-30 2012-01-25 Sony Corp Method and device for positioning electronic components
US7333175B2 (en) * 2004-09-13 2008-02-19 Asml Netherlands, B.V. Method and system for aligning a first and second marker
DE102005013755C5 (en) * 2005-03-22 2013-03-07 Trioptics Gmbh Method for producing systems of composite lenses
FR2894685A3 (en) * 2005-12-09 2007-06-15 6115187 Canada Inc METHOD AND DEVICE FOR IDENTIFICATION AND CALIBRATION OF PANORAMIC OPTICS
US7433038B2 (en) 2006-04-27 2008-10-07 Asml Netherlands B.V. Alignment of substrates for bonding
US20080292177A1 (en) * 2007-05-23 2008-11-27 Sheets Ronald E System and Method for Providing Backside Alignment in a Lithographic Projection System
WO2009139189A1 (en) * 2008-05-15 2009-11-19 株式会社ニコン Position detecting device, substrate overlapping apparatus, and optical axis aligning method
EP2299472B1 (en) 2009-09-22 2020-07-08 EV Group E. Thallner GmbH Device for aligning two substrates
JP4831842B2 (en) * 2009-10-28 2011-12-07 三菱重工業株式会社 Joining device control device and multilayer joining method
JP5600952B2 (en) * 2010-02-01 2014-10-08 株式会社ニコン Position detection apparatus, substrate bonding apparatus, position detection method, substrate bonding method, and device manufacturing method
JP2011250366A (en) * 2010-05-31 2011-12-08 Hitachi Kokusai Electric Inc Positioning apparatus for imaging element
EP2463892B1 (en) * 2010-12-13 2013-04-03 EV Group E. Thallner GmbH Device, assembly and method for detecting alignment errors
CN102944978B (en) 2011-08-15 2014-08-06 中山新诺科技股份有限公司 Exposure system, calibration system, optical engines, exposure method, and production method
US9001305B2 (en) * 2011-10-11 2015-04-07 Wenhui Mei Ultra-large size flat panel display maskless photolithography system and method
JP5875335B2 (en) * 2011-11-15 2016-03-02 キヤノン株式会社 Position detection apparatus and exposure apparatus
WO2013182562A1 (en) * 2012-06-04 2013-12-12 Micronic Mydata AB Optical writer for flexible foils
TWI543328B (en) * 2012-08-01 2016-07-21 天鈺科技股份有限公司 Semiconductor device having alignment mark and display device using same
DE102013004738A1 (en) * 2013-03-12 2014-10-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for the targeted adjustment of optical components to a reference axis
CN104133350B (en) * 2013-05-03 2017-02-08 上海微电子装备有限公司 Aligning system and aligning method for photolithographic device
CN105283950B (en) 2013-06-17 2018-03-13 Ev 集团 E·索尔纳有限责任公司 Device and method for substrate alignment
CN103412428B (en) * 2013-07-24 2016-01-27 北京京东方光电科技有限公司 A kind of alignment system
US9851645B2 (en) * 2013-12-06 2017-12-26 Ev Group E. Thallner Gmbh Device and method for aligning substrates
JP6305887B2 (en) * 2014-09-16 2018-04-04 東芝メモリ株式会社 Semiconductor device manufacturing method and semiconductor manufacturing apparatus
US10954122B2 (en) * 2017-03-16 2021-03-23 Ev Group E. Thallner Gmbh Method for bonding of at least three substrates
WO2018171861A1 (en) * 2017-03-20 2018-09-27 Ev Group E. Thallner Gmbh Method for aligning two substrates

Also Published As

Publication number Publication date
CN110366773B (en) 2023-10-20
KR20190126068A (en) 2019-11-08
CN110366773A (en) 2019-10-22
JP2020511783A (en) 2020-04-16
WO2018166772A1 (en) 2018-09-20
US20200174383A1 (en) 2020-06-04
EP3596751A1 (en) 2020-01-22
EP3596751B1 (en) 2022-03-30
DE102017105697A1 (en) 2018-09-20
KR102546940B1 (en) 2023-06-22
TWI714833B (en) 2021-01-01
TW201839526A (en) 2018-11-01
JP7143314B2 (en) 2022-09-28
US11209739B2 (en) 2021-12-28

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