SG11201907720RA - Method for the alignment of two substrates - Google Patents
Method for the alignment of two substratesInfo
- Publication number
- SG11201907720RA SG11201907720RA SG11201907720RA SG11201907720RA SG 11201907720R A SG11201907720R A SG 11201907720RA SG 11201907720R A SG11201907720R A SG 11201907720RA SG 11201907720R A SG11201907720R A SG 11201907720RA
- Authority
- SG
- Singapore
- Prior art keywords
- substrates
- alignment
- proposed
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/5442—Marks applied to semiconductor devices or parts comprising non digital, non alphanumeric information, e.g. symbols
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54493—Peripheral marks on wafers, e.g. orientation flats, notches, lot number
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75723—Electrostatic holding means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75733—Magnetic holding means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75753—Means for optical alignment, e.g. sensors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/8012—Aligning
- H01L2224/80121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/8012—Aligning
- H01L2224/80121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
- H01L2224/8013—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed on the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/8012—Aligning
- H01L2224/80121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
- H01L2224/80132—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed outside the semiconductor or solid-state body, i.e. "off-chip"
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/808—Bonding techniques
- H01L2224/80894—Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces
- H01L2224/80895—Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces between electrically conductive surfaces, e.g. copper-copper direct bonding, surface activated bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/808—Bonding techniques
- H01L2224/80894—Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces
- H01L2224/80896—Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces between electrically insulating surfaces, e.g. oxide or nitride layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/94—Batch processes at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0015—Orientation; Alignment; Positioning
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Liquid Crystal (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Mechanical Engineering (AREA)
Abstract
Method for the alignment of two substrates A method for the alignment of substrates is proposed. Figure 1a
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2017/056584 WO2018171861A1 (en) | 2017-03-20 | 2017-03-20 | Method for aligning two substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201907720RA true SG11201907720RA (en) | 2019-10-30 |
Family
ID=58410281
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201907720R SG11201907720RA (en) | 2017-03-20 | 2017-03-20 | Method for the alignment of two substrates |
Country Status (8)
Country | Link |
---|---|
US (1) | US11121091B2 (en) |
EP (1) | EP3602624A1 (en) |
JP (1) | JP2020511787A (en) |
KR (1) | KR102365283B1 (en) |
CN (1) | CN110352488A (en) |
SG (1) | SG11201907720RA (en) |
TW (1) | TWI679722B (en) |
WO (1) | WO2018171861A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017105697A1 (en) * | 2017-03-16 | 2018-09-20 | Ev Group E. Thallner Gmbh | Method and device for aligning two optical subsystems |
US11545474B2 (en) * | 2020-05-11 | 2023-01-03 | Semileds Corporation | Method and system for transferring alignment marks between substrate systems |
KR20220030685A (en) | 2020-09-03 | 2022-03-11 | 삼성전자주식회사 | Semiconductor package |
WO2023070272A1 (en) * | 2021-10-25 | 2023-05-04 | 长江存储科技有限责任公司 | Wafer bonding device and method |
KR102653108B1 (en) | 2021-10-28 | 2024-04-02 | 코스텍시스템(주) | Apparatus and method for aligniing a substrate |
KR102644565B1 (en) * | 2022-01-28 | 2024-03-07 | 주식회사 에스에프이 | Method for aligning flatzone of wafer and aligning position of wafer |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT405775B (en) | 1998-01-13 | 1999-11-25 | Thallner Erich | Method and apparatus for bringing together wafer-type (slice-type, disk-shaped) semiconductor substrates in an aligned manner |
JP4467318B2 (en) * | 2004-01-28 | 2010-05-26 | Necエレクトロニクス株式会社 | Semiconductor device, chip alignment method for multi-chip semiconductor device, and method for manufacturing chip for multi-chip semiconductor device |
WO2010023935A1 (en) * | 2008-08-29 | 2010-03-04 | 株式会社ニコン | Substrate aligning apparatus, substrate aligning method and method for manufacturing multilayer semiconductor |
EP3731258A1 (en) | 2009-09-22 | 2020-10-28 | EV Group E. Thallner GmbH | Device for aligning two substrates |
US8569899B2 (en) * | 2009-12-30 | 2013-10-29 | Stmicroelectronics, Inc. | Device and method for alignment of vertically stacked wafers and die |
EP2511756A4 (en) * | 2010-01-15 | 2013-06-12 | Sharp Kk | Liquid crystal display device and method for manufacturing same |
US8102064B2 (en) * | 2010-04-08 | 2012-01-24 | Nanya Technology Corp. | Electrical alignment mark set and method for aligning wafer stack |
EP2463892B1 (en) * | 2010-12-13 | 2013-04-03 | EV Group E. Thallner GmbH | Device, assembly and method for detecting alignment errors |
KR20140139044A (en) * | 2012-03-28 | 2014-12-04 | 가부시키가이샤 니콘 | Substrate bonding apparatus and substrate bonding method |
US9418882B2 (en) * | 2013-06-17 | 2016-08-16 | Ev Group E. Thallner Gmbh | Device and method for aligning substrates |
CN105247670B (en) * | 2013-12-06 | 2018-06-12 | Ev 集团 E·索尔纳有限责任公司 | For being aligned the device and method of substrate |
KR102259484B1 (en) | 2014-02-03 | 2021-06-02 | 에베 그룹 에. 탈너 게엠베하 | Method and device for bonding substrates |
EP3451062B1 (en) * | 2016-05-18 | 2020-08-19 | Towerjazz Panasonic Semiconductor Co., Ltd. | Semiconductor device and method for manufacturing same |
-
2017
- 2017-03-20 WO PCT/EP2017/056584 patent/WO2018171861A1/en active Search and Examination
- 2017-03-20 SG SG11201907720R patent/SG11201907720RA/en unknown
- 2017-03-20 JP JP2019548030A patent/JP2020511787A/en active Pending
- 2017-03-20 US US16/487,647 patent/US11121091B2/en active Active
- 2017-03-20 CN CN201780088130.7A patent/CN110352488A/en active Pending
- 2017-03-20 EP EP17713209.9A patent/EP3602624A1/en active Pending
- 2017-03-20 KR KR1020197023759A patent/KR102365283B1/en active IP Right Grant
-
2018
- 2018-03-06 TW TW107107400A patent/TWI679722B/en active
Also Published As
Publication number | Publication date |
---|---|
KR102365283B1 (en) | 2022-02-18 |
CN110352488A (en) | 2019-10-18 |
TW201836052A (en) | 2018-10-01 |
JP2020511787A (en) | 2020-04-16 |
KR20190125972A (en) | 2019-11-07 |
WO2018171861A1 (en) | 2018-09-27 |
EP3602624A1 (en) | 2020-02-05 |
US11121091B2 (en) | 2021-09-14 |
US20190378799A1 (en) | 2019-12-12 |
TWI679722B (en) | 2019-12-11 |
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