KR20140139044A - Substrate bonding apparatus and substrate bonding method - Google Patents

Abstract

A substrate joining apparatus for joining a first substrate and a second substrate to each other, comprising: a joining section for joining together a first substrate and a second substrate which are aligned with each other and are superimposed on each other; And a second substrate; and a judging section for judging whether or not the concavo-convex state detected by the detecting section satisfies a predetermined condition, wherein the concavity and convexity satisfy a predetermined condition The bonding of the first substrate and the second substrate is not performed.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a substrate joining apparatus and a substrate joining method,

The present invention relates to a substrate bonding apparatus and a substrate bonding method.

There is a stacked semiconductor device in which a plurality of substrates are stacked and bonded (see Patent Document 1). In the case of bonding the substrates, the substrates are positioned with the accuracy of the line width level of the semiconductor device and overlapped and bonded to each other.

[Patent Document 1] Japanese Patent Application Laid-Open No. 2005-251972

Even if the substrate is aligned by aligning in the planar direction by the convex-and-concave state of the substrate to be bonded, a part of the substrate may not be closely contacted.

As a first aspect of the present invention, there is provided a substrate joining apparatus for joining a first substrate and a second substrate to each other, comprising: a joining section for joining together a first substrate and a second substrate which are aligned with each other and overlap each other; And a determination unit that determines whether or not the unevenness state detected by the detection unit satisfies a predetermined condition, wherein the bonding unit is configured to determine whether the unevenness state of the first substrate and the second substrate is a predetermined And the first substrate and the second substrate are not bonded when judged by the judging section that the condition is not satisfied.

According to a second aspect of the present invention, there is provided a substrate bonding method for bonding a first substrate and a second substrate to each other, the method comprising: a positioning step of aligning the first substrate and the second substrate with each other and overlapping each other; And the second substrate are bonded to each other; a detection step of detecting the unevenness state of at least one of the first substrate and the second substrate before the bonding step; and a step of detecting the unevenness state detected by the detection step under predetermined conditions And a judging step of judging whether or not the substrate is satisfactory or not. The substrate joining method is characterized in that, when it is judged in the judging step that the unevenness condition does not satisfy the predetermined condition, the joining step is not performed.

The above summary of the invention does not list all of the necessary features of the invention. Subcombinations of these feature groups may also be inventions.

According to the present invention, it is possible to detect the unevenness state of the substrate in advance and determine that the substrate is not suitable for bonding, thereby removing the substrate from the line without attempting to join the substrate bonding apparatus, which can improve the yield and throughput of the substrate bonding apparatus. A device and a substrate bonding method are provided.

1 is a schematic plan view of a substrate joining apparatus 100. Fig.
2 is a perspective view of the substrate holder 150. FIG.
3 is a perspective view of the substrate holder 150. FIG.
4 is a schematic cross-sectional view of the overlapping portion 170. FIG.
5 is a schematic cross-sectional view of the overlapping portion 170. FIG.
6 is a schematic cross-sectional view of the joint portion.
7 is a cross-sectional view showing the state transition of the substrate 121. Fig.
8 is a cross-sectional view showing the state transition of the substrate 121. Fig.
9 is a cross-sectional view showing the state transition of the substrate 121. Fig.
10 is a cross-sectional view showing the state transition of the substrate 121. Fig.
11 is a schematic perspective view of the substrate 121. Fig.
12 is a block diagram showing a part of the general control section 110. In FIG.
Fig. 13 is a flowchart showing a control procedure of the determination unit 116. Fig.
Fig. 14 is a flowchart showing an example of a detailed control procedure of the determination unit 116. Fig.
Fig. 15 is a flowchart showing another example of the detailed control procedure of the determination unit 116. Fig.
16 is a flowchart showing still another example of the detailed control procedure of the determination unit 116. As shown in FIG.
FIG. 17 is a flowchart showing another example of the detailed control procedure of the determination unit 116. FIG.
Fig. 18 is a flowchart showing another control procedure of the determination unit 116. Fig.
Fig. 19 is a flowchart showing another control procedure of the determination unit 116. Fig.

Best Mode for Carrying Out the Invention Hereinafter, the present invention will be described with reference to the embodiments of the invention. However, the following embodiments do not limit the claimed invention. It should be noted that not all the combinations of the features described in the embodiments are essential to the solution of the invention.

1 is a schematic plan view of a substrate joining apparatus 100. Fig. In the substrate joining apparatus 100, a plurality of substrates 121 are bonded to each other to produce a laminated substrate 123.

The substrate 121 to be bonded by the substrate joining apparatus 100 may be a glass substrate in addition to a semiconductor wafer such as a silicon single crystal wafer or a compound semiconductor wafer. At least one of the substrates 121 to be bonded may include a plurality of elements. In addition, one or both of the substrates 121 to be bonded may be a laminated substrate 123, which itself has already been manufactured by superimposing wafers on one another.

The substrate joining apparatus 100 includes a room temperature section 102 and a high temperature section 104 formed inside a common cover 106. On the outer surface of the cover 106 at the room temperature section 102, a comprehensive control section 110 and a plurality of FOUPs (Front Opening Unified Pods) 120 are arranged.

The general control unit 110 controls the operation of each part of the substrate joining apparatus 100 individually, and also controls the operation of the entire substrate joining apparatus 100 in a comprehensive manner. The integrated control unit 110 includes an operation unit that the user operates from the outside when the power source of the substrate joining apparatus 100 is input, various settings, information, and the like, and a display unit that transmits information to the user. In addition, the general control section 110 may include a connection section to be connected to another apparatus that is additionally disposed with respect to the substrate joining apparatus 100.

The FOUP 120 accommodates a plurality of substrates 121 or a laminated substrate 123. Further, the FOUP 120 can be attached to and detached from the substrate joining apparatus 100 individually. As a result, the plurality of substrates 121 to be bonded in the substrate joining apparatus 100 can be collectively loaded in the substrate joining apparatus 100 in a state of being accommodated in the FOUP 120. The laminated substrate 123 manufactured by the substrate joining apparatus 100 is housed in another FOUP 120 and taken out from the substrate joining apparatus 100 in a lump.

Loaders 132 and 134, a pre-aligner 140, an overlapping portion 170 and a holder stocker 180 are disposed inside the cover 106 at the room temperature portion 102. The temperature of the inside of the room temperature portion 102 is controlled so that the temperature is maintained at substantially the same temperature as the room temperature of the environment in which the substrate joining apparatus 100 is installed. As a result, since the operation accuracy of the overlapping portions 170 is stabilized, positioning accuracy when the substrates 121 are overlapped with each other is improved.

The loader 132 is disposed on the FOUP 120 and moves the substrate 121 to be bonded out of the FOUP 120. [ The substrate 121 taken out from the FOUP 120 is conveyed to the pre-aligner 140. [ In the illustrated example, the pre-aligner 140 is arranged vertically overlapping with the holder stocker 180.

The loader 132 passes the stacked substrate 123 manufactured by the substrate joining apparatus 100 from the loader 134 and stores it in the FOUP 120. [ As described above, the loader 132 transports either the substrate 121 before bonding or the laminated substrate 123 produced by bonding.

Many of the substrates 121 to be joined in the substrate joining apparatus 100 are formed of a thin and fragile material. Therefore, in the substrate joining apparatus 100, the substrate 121 is held by the substrate holder 150 having higher strength and rigidity than the substrate 121, and the substrate 121 and the substrate holder 150 are integrally formed The substrate 121 may be protected.

The substrate holder 150 has a flat holding surface and has a substrate holding function such as an electrostatic chuck for attracting the substrate 121 to the holding surface. The substrate holder 150 is taken out from the holder stocker 180 disposed in the room temperature section 102 and used. Further, the substrate holder 150 is separated from the stacked substrate 123 to be taken out and returned to the holder stocker 180. Therefore, the substrate holder 150 is used repeatedly inside the substrate joining apparatus 100.

The prealigner 140 aligns the substrate holder 150 and the substrate 121 when the substrate holder 121 is held by the substrate holder 150. As a result, the mounting position and mounting direction of the substrate 121 with respect to the substrate holder 150 are made constant, and the burden of the positioning operation in the overlapping portion 170 is reduced.

The loader 134 disposed along the side surface of the overlapping portion 170 in the drawing takes out the substrate holder 150 from the holder stocker 180 and conveys the substrate holder 150 to the pre-aligner 140. The loader 134 carries the substrate holder 150 holding the substrate 121 in the pre-aligner 140 to the overlapping portion 170 with each other.

Further, the holder stocker 180 receives a plurality of substrate holders 150. The holder stocker 180 may be provided with a function of cooling the substrate holder 150 carried out from the high temperature section 104. [

The loader 134 transports the substrate 121, which overlaps with the substrate holder 150, in the overlapping portion 170 to the high temperature portion 104 side. The loader 134 also transports the laminated substrate 123 sandwiched between the pair of substrate holders 150 even when the laminated substrate 123 is taken out from the high temperature section 104 side. As described above, the loader 134 also transports one or two substrate holders 150 in addition to the substrate 121 or the laminate substrate 123. Therefore, as the loader 134, one having a larger carrying capacity than the loader 132 is used.

The overlapping portions 170 have a fixed stage 250 and a fine moving stage 230 disposed inside the frame body 210. [ The fixed stage 250 is fixed relative to the frame body 210 and holds the substrate holder 150 and the substrate 121 in the downward direction. The fine movement stage 230 mounts the substrate holder 150 and the substrate 121 and moves relative to the fixed stage 250 within the overlapping portion 170 to move the pair of substrates 121 Align, and overlap each other.

In the overlapping portions 170, the outer surface of the frame body 210 is closed by the wall member 212. [ As a result, the influence of radiant heat from the surroundings on the overlapping portion 170 is cut off.

The overlapping portion 170 has an interferometer 222 and an image pickup portion 226 disposed inside the wall member 212. [ The interferometer 222 measures the position of the fine movement stage 230 with high accuracy using a reflector 224 mounted on the fine movement stage 230. The imaging section 226 observes the surface of the substrate 121 mounted on the fine movement stage 230 and detects the nature and state of the surface. This makes it possible to accurately position the substrate 121 mounted on the fine movement stage 230 with respect to the substrate 121 held by the fixed stage 250.

The high temperature section 104 is surrounded by the heat insulating wall 108 to maintain a high internal temperature and to prevent heat radiation to the outside. The high temperature section 104 includes a load lock 191, a joint 190, and a loader 136.

The load lock 191 has shutters 193 and 195 alternately opened and closed to prevent the high temperature atmosphere of the high temperature section 104 from leaking to the room temperature section 102. The loader 136 transfers the substrate 121 overlapped with the substrate holder 150 from the loader 134 of the room temperature portion 102 at the load lock 191. The loader 136 loads the substrate 121, which is overlapped with one another, into any one of the plurality of bonding portions 190.

The joining portion 190 presses and joins the positioned substrate 121. As a result, the substrate 121 becomes the laminated substrate 123. Further, the joining portion 190 may heat the substrate 121 in accordance with the pressurization.

The laminated substrate 123 is again carried out by the loader 136 together with the substrate holder 150 from the bonding portion 190 and is carried into the load lock 191. [ The laminated substrate 123 and the substrate holder 150 brought into the load lock 191 from the high temperature section 104 side are sequentially transferred to the loader 134 on the side of the room temperature section 102. [ The substrate holder 150 is separated from the laminated substrate 123.

The loader 132 disposed in the FOUP 120 houses the laminated substrate 123 separated from the substrate holder 150 alone in the FOUP 120. [ The substrate holder 150 is returned to the holder stocker 180 and reused when the other substrate 121 is bonded.

As described above, in the substrate joining apparatus 100, the joining portions 190 are positioned by the overlapping portions 170 to press and bond the overlapped substrates 121 to each other. However, for example, when the bonding surfaces to be bonded at each of the substrates 121 are clean and smooth, the substrate 121 may be bonded to each other at the overlapping portions 170. In such a case, the high temperature portion 104 including the joining portion 190 may be omitted.

FIG. 2 is a perspective view showing a state in which the substrate holder 150, which is inserted into the overlapping portion 170 in the downward direction, is raised. The substrate holder 150 is a disk-like member having a circular placement surface 156 contacting with the substrate 121 to be held, and is formed of a rigid material such as alumina ceramics. The substrate holder 150 has an electrostatic chuck 158 for electrostatically attracting the substrate 121 to the placement surface 156 when a voltage is applied to the embedded electrode.

In addition, the substrate holder 150 has a plurality of permanent magnets 152 arranged along the side edge. The permanent magnets 152 are fixed to the edge portions of the substrate holder 150 at the outer sides of the placement surfaces 156, respectively.

3 is a perspective view showing a substrate holder 150 which is inserted into the overlapping portion 170 in a downward direction. This substrate holder 150 also has the same shape and structure as the substrate holder 150 shown in Fig. 2 in terms of having the placement surface 156 and the electrostatic chuck 158. Fig.

The substrate holder 150 has a magnetic plate 154 instead of the permanent magnet 152. The magnetic substance plate 154 is disposed corresponding to the permanent magnets 152. [ Each of the magnetic substance plates 154 is resiliently mounted to the substrate holder 150 so as to be displaceable in the normal direction of the placement surface 156. Thus, when the substrate holder 150 shown in Fig. 2 and the substrate holder 150 shown in Fig. 3 are opposed to each other and overlap each other, the permanent magnet 152 attracts the magnetic substance plate 154, And maintains the relative position in the plane direction of the substrate holder 150 autonomously.

Fig. 4 is a schematic vertical cross-sectional view of the overlapping portion 170. Fig. The overlapping portions 170 have a frame body 210 and a movable stage portion 240 and a fixed stage 250 which are disposed inside the frame body 210.

The fixed stage 250 is suspended in the downward direction from the ceiling surface of the frame body 210 via a plurality of load cells 254. The fixed stage 250 includes an electrostatic chuck 252. Thereby, the fixed stage 250 holds the substrate holder 150 holding one side of the substrate 121 provided for bonding by the lower surface thereof.

In the illustrated example, the substrate holder 150 on which the permanent magnets 152 are mounted, shown in Fig. 2, is held in the fixed stage 250. The plurality of load cells 254 individually measure a load applied to the fixed stage 250 from the bottom to the top to detect the load distribution in the plane direction of the substrate 121.

On the ceiling surface of the frame body 210, a microscope 251 facing downward is disposed on the side of the fixed stage 250. The microscope 251 has an automatic in-focus function for focusing the optical system on the surface of the substrate 121 held by the fine movement stage 230 and observes the surface of the substrate 121. In addition, since the microscope 251 is fixed to the frame body 210, the relative positions of the microscope 251 and the fixed stage 250 do not change.

The moving stage unit 240 includes a moving table 242, a coarse moving stage 244, a gravity canceling unit 246, a spherical seat 248, and a fine moving stage 230, . The moving base 242 moves along the guide rails 241 fixed to the inner bottom surface of the frame body 210 by mounting the coarse movement stage 244, the gravity canceling section 246 and the fine movement stage 230. The movable stage portion 240 moves between a position immediately below the fixed stage 250 and a position deviating from directly below the fixed stage 250 by the movement of the movable table 242. [

The coarse stage 244 moves with respect to the movable table 242 in the horizontal direction including the X direction component and the Y direction component indicated by arrows in the drawing. When the movable stage 242 moves relative to the movable stage 242, the fine stage 230 moves along the coarse stage 244. [

The gravity canceling section 246 expands and contracts while detecting the fine displacement of the fine movement stage 230, thereby reducing the apparent weight of the fine movement stage 230. As a result, the load of the actuator for displacing the fine movement stage 230 is reduced to improve the position control precision.

The fine movement stage 230 has a holding portion 220 and holds a substrate holder 150 holding a substrate 121 to be provided for bonding. In the positioning operation of the substrate 121, the fine movement stage 230 initially moves in accordance with the movement of the coarse movement stage 244. In the next step, the fine motion stage 230 is displaced relative to the coarse stage 244. The displacement of the fine stage 230 relative to the coarse stage 244 includes translation and rotation for both the X, Y, and Z axes.

Further, the fine moving stage 230 has a microscope 231 fixed to the side portion. Since the microscope 231 is fixed with respect to the fine moving stage 230, the relative positions of the fine moving stage 230 and the microscope 231 do not change. The microscope 231 has an automatic in-focus function for focusing the optical system on the surface of the substrate 121 and observes the surface of the substrate 121 held by the fixed stage 250. [

5 is a schematic cross-sectional view of the overlapping portion 170. As shown in Fig. The same reference numerals as in FIG. 4 denote the same elements and redundant explanations are omitted.

The movable stage portion 240 moves along the guide rails 241 in the mutually overlapping portions 170 of the stationary stage 240 and the stationary stage 230 which hold the substrate holder 150 and the substrate 121, (250) are opposed to each other. In addition, after positioning the held pair of substrates, the fine movement stage 230 is raised to bring the pair of substrates 121 close to each other.

The pads on the substrate 121 are electrically coupled to each other via a solder bump or the like formed on at least one of the substrates 121 when the pair of the substrates 121 approaching each other are overlapped with each other . In this manner, the elements on the pair of substrates 121 can be mutually coupled to form the laminated substrate 123. In other words, when the laminated substrate 123 is formed, mutual positioning of the pair of substrates 121 is performed by the overlapping portion 170 so that the positions of the pads, bumps, and the like are coincident with each other.

However, the pair of substrates 121 are finally bonded at the joint 190. Accordingly, in the overlapping portions 170, the substrates 121 are fixed in a mutually positioned state. The fixed substrates 121 may be in contact with each other or may be separated from each other.

Fig. 6 is a schematic cross-sectional view of the joint 190. Fig. The joining portion 190 includes a base 198 and a heat plate 196 which are sequentially stacked from the bottom of the case 192 and a pressing portion 194 which is downwardly received from the ceiling face of the case 192, (196). Each of the heat plates 196 incorporates a heater. In addition, one of the side surfaces of the case 192 is provided with an inlet 199.

A substrate 121 already positioned and overlapped with each other and a pair of substrate holders 150 sandwiching the substrate 121 are brought into the joint 190 together. The loaded substrate holder 150 and the substrate 121 are placed on the upper surface of the heat plate 196 of the surface plate 198.

The joining portion 190 first raises the temperature of the heat plate 196 and simultaneously lowers the pressing portion 194 to press down the upper heat plate 196. As a result, the substrate holder 150 sandwiched between the heat plates 196 and the substrate 121 are heated and pressed to be bonded, and the substrate 121 becomes the laminated substrate 123. The manufactured laminated board 123 is taken out of the joint portion 190 by the loader 136. [

The substrate holder 150 is required to have strength and heat resistance that do not deteriorate even when the joining portion 190 is repeatedly heated and pressed. When the heating temperature by the heat plate 196 is high, the surface of the substrate 121 may chemically react with the atmosphere. Here, when the substrate 121 is heated and pressed, the inside of the case 192 is preferably evacuated to a vacuum environment. For this purpose, it is also possible to provide an openable and closable door for hermetically closing the inlet 199.

In addition, the joining portion 190 may be provided with a cooling portion for cooling the laminated substrate 123 after heating and pressurization. Thus, even if the temperature does not reach the room temperature, the cooled laminated substrate 123 can be taken out and returned to the FOUP 120 quickly.

Figs. 7, 8, 9, and 10 are views showing the transition of the state of the substrate 121 in the substrate joining apparatus 100. Fig. The operation of the substrate joining apparatus 100 will be described with reference to these drawings.

In the substrate joining apparatus 100, first, the substrate holder 150 carried out from the holder stocker 180 by the loader 134 is positioned on the pre-aligner 140 with a precision higher than a predetermined accuracy . Next, the substrate 121 taken out from the FOUP 120 one by one by the loader 132 is transferred to the substrate holder 150 at the pre-aligner 140 with a positioning accuracy of a predetermined precision or more 150).

Thus, as shown in Fig. 7, the substrate holder 150 holding the substrate 121 is prepared. The substrate holder 150 on which the substrate 121 is mounted is sequentially conveyed to the overlapping portion 170 by the loader 134. [ Thereby, for example, the substrate 121 and the substrate holder 150 that have been transported first are reversed by the loader 134 and held by the fixed stage 250.

Next, the substrate 121 and the substrate holder 150 carried in are held by the fine movement stage 230 in the same direction. Thus, as shown in Fig. 8, the pair of substrates 121 are held by the overlapping portions 170 in a state in which they are opposed to each other.

Next, by raising the fine movement stage 230, a pair of mutually positioned substrates 121 are overlapped with each other while maintaining the positioned state. This allows the loader 134 to integrally transport a pair of mutually positioned substrates 121 and 150 with the gaps between the substrates 121 being maintained.

At this stage, the pair of substrates 121 are not bonded yet. Accordingly, at this stage, the substrate holder 150 can be unfastened and the substrate 121 can be positioned again without damaging the substrate 121. [

The loaders 134 and 136 load the substrate holder 150 having the pair of substrates 121 sandwiched therebetween. The pair of substrates 121 heated and pressurized in the joining portion 190 are permanently bonded to form a laminated substrate 123 as shown in Fig. The loaders 134 and 136 separate the substrate holder 150 and the laminate substrate 123 so that the substrate holder 150 is attached to the holder stocker 180 and the laminate substrate 123 is attached to the FOUP 120, Respectively. Thus, a series of steps for manufacturing the laminated substrate 123 is completed.

11 is a conceptual perspective view of a pair of mutually opposing substrates 121 provided for bonding. The substrate 121 has a disk-like shape partially missing by the notch 124, and has a plurality of device regions 126 and alignment marks 128 on its surface.

The notch 124 is formed corresponding to the crystal orientation of the substrate 121 and the like. Therefore, when the substrate 121 is handled, the orientation of the substrate 121 is determined with the notch 124 as an index.

On the surface of the substrate 121, a plurality of element regions 126 are periodically arranged. In each of the element regions 126, a semiconductor device formed by processing a substrate 121 by photolithography or the like is mounted. Each of the element regions 126 also includes a pad or the like serving as a connection terminal when the substrate 121 is bonded to another substrate 121. [

Between the plurality of element regions 126, there is a blank region in which functional elements such as elements and circuits are not disposed. In the blank area, a scribe line 122 is provided for cutting off the substrate 121 in each device region 126.

In addition, on the scribe line 122, an alignment mark 128 serving as an index for positioning the substrate 121 is disposed. Since the scribe line 122 is cut as the cut portion in the process of cutting the substrate 121 into a die, the effective area of the substrate 121 is pressed by the alignment marks 128, It does not.

Although the device region 126 and the alignment mark 128 are largely shown in the drawing, the number of the element regions 126 formed on the substrate 121 having a diameter of 300 mm, for example, may reach several hundred or more. In addition, a wiring pattern or the like formed in the element region 126 may be used as the alignment mark 128.

The alignment marks 128 of the substrate 121 facing each other by the microscopes 231 and 251 are observed so that the substrate 121 is aligned with the alignment marks 128, And measures relative positions of the mutual members. In addition, the substrate 121 can be aligned by moving the fine movement stage 230 so as to eliminate the deviation of the measured relative position.

However, even in the case of the substrate 121 manufactured using the same mask in the same exposure apparatus, there is a case where the unevenness state changes due to different deformation of the substrate in the thickness direction due to a difference in environmental conditions such as temperature during the photolithography process have. In addition, the unevenness of the surface to be bonded by the foreign matter attached to the surface of the substrate 121 may change.

Even if the alignment of the substrate 121 with the alignment marks 128 arranged in the planar direction of the substrate 121 is aligned and bonded to each other, There arises a region that is not in close contact with the bonding surface of the other substrate, and the yield of the laminated structure due to the circuit on the substrate 121 may decrease.

However, in the substrate joining apparatus 100, the substrate 121, which is determined to be unfavorable for joining, is detected by previously detecting the uneven state of the substrate 121, and the joining is not attempted. As a result, the yield and throughput of the substrate joining apparatus 100 can be improved.

12 is a block diagram showing a part of the integrated controller 110 in the substrate joining apparatus 100. As shown in Fig. The overall control unit 110 has an overlap control unit 112, a detection unit 114, a determination unit 116, and a transport control unit 118,

Detection of the unevenness state by the detecting section 114 is performed before the substrate 121 is bonded at the bonding section 190. [ Alternatively, the detection of the unevenness state of the substrate 121 by the detection unit 114 may be performed before the substrates 121 are overlapped with each other at the overlapping unit 170. [ As a result, it is possible to prevent the throughput and the yield from being lowered by overlapping the substrates 121 in which the unevenness state is not suitable for bonding.

The detection unit 114 detects the image of the substrate 121 that is obliquely illuminated by the imaging unit 226 arranged on the overlapping unit 170 or the like, (121) is detected. The detecting section 114 may detect the unevenness state of the substrate 121 from the operation of the automatic inoculation mechanism of the microscopes 231 and 251 provided in the overlapping section 170 with each other. The arrangement of the detecting portions 114 is not limited to the above, but may be arranged at any place where the uneven state of the substrate 121 before being brought into the overlapping portion 170 can be detected. More specifically, it may be placed on the conveyance path from the FOUP 120 to the pre-aligner 140 or the overlapping section 170, and it may be provided on the stage of the pre-aligner 140. At least one of the pre-aligner 140 and the overlapping portion 170 may be used as a part of the detecting portion 114 as well.

In this case, the detection unit 114 may detect the protruding portion of the substrate 121 by detecting a protruding portion on the bonding surface of the substrate 121. That is, with respect to a standard surface (reference surface) to be considered based on the holding surface of the substrate holder 150 holding the substrate 121 to be detected and the thickness of the substrate 121, a predetermined threshold value, for example, The irregularity state of the substrate 121 can be detected by measuring a region protruding beyond 3 mu m. When observing the protruding portion for the purpose of detecting the unevenness state of the substrate 121, the unevenness state may be evaluated by measuring at least one of height, width, and width of the protruding portion.

In the above example, the imaging units 226 are disposed in the overlapping unit 170, but the imaging units 226 may be provided at different locations. It is also possible to arrange the image pickup section 226 in another place in addition to the inside of the overlapping section 170. [

If the detected protruding portion is local to the entire area of the substrate 121, the detecting portion 114 may detect the protruding portion as an attachment attached to the substrate 121. In this way, the detection unit 114 may detect whether the material of the protruding portion of the substrate 121, that is, the protruding portion is formed by the substrate 121 itself or by the attachment.

In addition, the detection unit 114 may detect the protruding direction of the protruding portion of the substrate 121. As a result, it can be seen that the detected protruded portions are reduced or reduced by the load applied to the substrate 121 by overlapping or joining the substrates 121, etc., and the decrease in the yield can be suppressed in some cases. Further, by detecting the projecting direction of the projecting portion, it is possible to select a method of efficiently pressing the projecting portion when an external force is applied so as to solve the projecting portion.

The detecting section 114 may also detect the unevenness state of the substrate 121 based on the load distribution measured by the load cell 254 of the overlapping section 170. That is, when there is a large protruding portion on the substrate 121, when the substrates 121 are overlapped with each other, a large load is caused in the protruding portion. The detection of the uneven state based on the output of the load cell 254 may be performed by referring to the output of the load cell 254 during the operation of overlapping the substrates 121. For the purpose of detecting the uneven state only, It is also possible to refer to the output of the load cell 254 by pushing the substrate 121 of the load cell 254 to the fixed stage 250.

The detection unit 114 may also acquire information on distances between the microscopes 231 and 251 and the surface of the substrate 121 from the inference mechanism of the microscopes 231 and 251 to detect the unevenness state. That is, the microscopes 231 and 251 invert the optical system with respect to the abutting surface of the substrate 121 when observing the abutting surface of the substrate 121. Therefore, information on the distance from the in-focus mechanism of the microscopes 231 and 251 to the bonding surface of the substrate 121 or information on the position of the bonding surface can be obtained to detect the uneven state of the substrate 121 have.

Further, the detection unit 114 may detect the uneven state of the substrate 121 in the substrate holder 150. That is, when the substrate 121 has large irregularities, the contact area between the substrate 121 and the substrate holder 150 decreases. As a result, the current flowing through the surface of the substrate 121 attracted to the substrate holder 150 changes, so that the uneven state of the substrate 121 can be electrically detected. More specifically, by measuring the impedance while applying an alternating voltage to the electrostatic chuck of the substrate holder 150 that attracts the substrate 121, a certain portion of the substrate 121 having the irregularities becomes a flat substrate holder 150).

In the above example, the case where the substrate holder 150 holds the substrate 121 by using the electrostatic chuck is taken as an example, but the concave-convex state of the substrate can also be detected in the substrate holder 150 having the vacuum chuck. When the substrate holder 150 is provided with a vacuum chuck, by measuring the negative pressure which varies depending on the atmosphere entering from the gaps between the substrate holder 150 and the substrate 121 according to the uneven state of the substrate 121, The uneven state of the substrate 121 can be detected.

Further, the detecting section 114 may detect the unevenness state of the substrate 121 with reference to the prealignment operation in the prealigner 140. [ As a result, since the unevenness state can be known before bringing the substrates 121 into the overlapping section 170, measures for eliminating or reducing the unevenness can be performed early to improve the throughput of the substrate joining apparatus 100 .

In the general control section 110, the overlap control section 112 includes an observation section 312, a calculation section 314, and a stage driving section 316. The observation unit 312 detects the position of the alignment mark 128 on each of the pair of substrates 121 to be bonded based on the image information acquired from the microscopes 231 and 251 of the overlapping unit 170 do.

The calculating unit 314 statistically processes the positional information of the alignment mark 128 detected by the observing unit 312 so as to calculate the position of the alignment mark 128 from the position of the relative position of the pair of substrates 121 And calculates the deviation. As a result, the displacement of the relative positions of the pair of substrates 121 brought into the overlapping portion 170 with each other is calculated as the positional displacement amount.

The stage driving section 316 drives the fine moving stage 230 so as to eliminate the position shift amount based on the position shift amount acquired from the calculating section 314. [ Thus, in the overlapping portion 170, the pair of substrates 121 are mutually positioned.

The determination unit 116 determines whether or not the unevenness state satisfies a predetermined condition based on the unevenness state of the substrate 121 detected by the detection unit 114. [ In this embodiment, the determination unit 116 determines whether or not the bonding of the substrate 121 should be performed based on the unevenness state of the substrate 121. That is, when the unevenness state of the substrate 121 is severe, the determination unit 116 instructs the transport control unit 118 not to overlap or bond with each other, and the substrate 121 is moved to the FOUP 120). As a result, it takes a lot of time for the substrates 121 to overlap each other, and the throughput of the substrate joining apparatus 100 is prevented from lowering.

Here, the determination unit 116 may be configured to determine the yield of the final product when the substrate 121 is bonded, not to determine whether the bonding of the substrate 121 is impossible, It is possible to judge that the joining of the substrate 121 is impossible when it is predicted that the yield becomes worse than a predetermined threshold value. The judging section 116 judges whether the substrate 121 is attracted by the substrate holder 150 or the load applied to the substrate 121 to overlap each other at the overlapping section 170 or when the bonding is performed at the joining section 190 The protruding portion of the substrate 121 may be reduced or eliminated by the load applied to the substrate 121. [

The transport control unit 118 includes a loader driving unit 318. The loader driving section 318 drives the four loaders 132, 134 and 136 to transport the substrate 121 and the substrate holder 150 to the processing of the destination. Therefore, the determination unit 116 can generate a command in accordance with the determination result toward the transport control unit 118, and can select a process for the substrate 121. [

FIG. 13 is a flowchart showing the execution procedure of the determination process of the determination unit 116 in the integrated control unit 110. FIG. The determination unit 116 first evaluates the detection result acquired from the detection unit 114 (Step S101) and checks whether or not there is a protruded portion on the surface of the substrate 121 held by the substrate holder 150 (Step S102).

The determination unit 116 determines that the surface of the substrate 121 is flat and smooth and determines that the surface of the substrate 121 is smooth and the surface of the substrate 121 is not smoothly projected on the surface of the substrate 121 (step S102: 100 overlap with each other with respect to the substrate 121. On the other hand, when a protruding portion is detected on the surface of the substrate 121 in step S102 (step S102: YES), the judging unit 116 judges whether or not the protruding part of the substrate 121 touches the adherend attached to the substrate 121 (Step S103: YES), it is determined whether or not it is formed by deformation of the substrate 121 itself (step S103: NO).

If it is determined in step S103 that the projected portion of the substrate 121 is not formed by the adherend (step S103: NO), the determination unit 116 determines that the detected irregularity state is due to deformation of the substrate itself, In this state, it is determined whether or not the overlapping section 170 can perform positioning (step S109).

When it is determined in step S109 that the overlapping section 170 can not perform positioning (step S109: NO), the process for the substrate 121 is terminated. On the other hand, when the determination unit 116 determines that positioning for overlapping can be performed (step S109: YES), the process proceeds to step S110.

If it is determined in step S103 that the projected portion of the substrate 121 is formed by the deposit (step S103: YES), the determination unit 116 determines whether or not it is necessary to clean the substrate 121 and remove the deposit (Step S104). If it is determined in step S104 that cleaning of the substrate 121 is unnecessary (step S104: YES), the determination unit 116 does not clean the substrate 121, and proceeds to step S110.

In step S110, the yield in the laminated substrate 123 is predicted. The yield can be predicted, for example, as follows. First, on the basis of the concavo-convex state of the substrate 121 detected by the detection unit 114, the position and the width of the region that is expected not to be in close contact with the substrate 121 that is paired when the substrate 121 is bonded are calculated . Next, the yield of the finally obtained semiconductor device can be predicted by counting the number of elements included in the calculated area.

Thus, when it is determined that the yield of the laminated board 123 has reached the predetermined target value (step S110: YES), the determination unit 116 determines whether or not a series of processes from the overlapping of the substrates 121 to bonding . On the other hand, if it is determined that the yield does not reach the target value (step S110: NO), the determination unit 116 ends the process for the substrate 121 without providing it to the overlapping and bonding. The substrate 121 determined to be inappropriate for bonding may be stored in one of the FOUPs 120 so as to be discarded at a time in the same manner as in the case of step S107: As described above, it is possible to prevent a decrease in the throughput of the substrate joining apparatus 100 by removing the substrates 121, which are predicted to be unable to be aligned with each other in the overlapping portions 170, before overlapping each other.

In step S110, it may be determined whether or not the yield reaches a given target value in consideration of whether or not the unevenness state of the substrate 121 is improved by overlapping each other. In this case, the judging unit 116 judges whether the substrate 121 is overlapped by the overlapping unit 170, for example, from the number N hanging on the substrate 121 to ten It is determined whether or not the unevenness state of the substrate 121 is improved. If the protruding portions are not attachments, it is determined whether or not one of the substrates 121 is deformed so that irregularities formed on at least one of the substrates 121 are flattened by the forces at the time of overlapping each other, 121 are deformed so that the concavities and convexities formed on the other substrate 121 are complementary to each other. On the other hand, when the protruding portion is an adherend, the adherend is crushed by the force at the time of overlapping on the basis of the shape, size, material, and the like of the adherend, It is determined whether or not the amount of protrusion becomes smaller than a predetermined value. When it is predicted that the unevenness state of the substrate 121 is improved by overlapping each other, the determination unit 116 determines whether or not the yield can be achieved on the premise that the unevenness state is improved by overlapping each other. Even if it is confirmed that the concavity and convexity state of the substrate 121 is improved by monitoring the sound emitted by the substrate 121 and the distribution of the pressure applied to the substrate 121 when the substrates 121 are overlapped with each other Okay.

The change in the concave-convex state of the substrate 121 caused by overlapping with each other can be predicted by the shape, height, number, position, and the like of the protruding portion detected from the substrate 121. In the case where the shape of the protruding portion is symmetrical or gentle, it is predicted that the protruding portion becomes flat by being deformed by the load applied to the substrate by overlapping each other. Further, even when the height of the projecting portion of the substrate 121 is low, it is expected that the unevenness state is improved by the load applied at the overlapping.

It may be judged whether or not the yield reaches a given target value in advance in consideration of whether or not the concavity and convexity state of the substrate 121 is improved by the joining in the joining portion 190 in the step S110. In this case, the determination unit 116 determines whether or not the unevenness state of the substrate 121 is improved by a force of 10t or more, which presses the substrate in accordance with the joining by the joining portion 190.

When it is predicted that the unevenness state of the substrate 121 is improved by the bonding, the determination unit 116 determines whether or not the yield can be achieved on the premise that the unevenness state is improved by the bonding. The change in the concavity and convexity of the substrate 121 due to the bonding can be predicted based on the shape and height of the protruding portion of the substrate 121 as well as the change in the concavity and convexity of the substrate 121 caused by overlapping each other. In the case of joining the substrates 121, a load greater than the mutual overlap is applied to the substrate 121. When it is predicted that the concave-convex state of the substrate 121 is improved by the overlapping portion 170 and the joining portion 190, the judgment unit 116 judges whether or not the time required for the improvement exceeds the predetermined time If it is judged that it is over, a series of processes from overlapping to joining may be executed without improvement.

If it is determined in step S104 that cleaning of the substrate 121 is necessary (step S104: NO), the determination unit 116 instructs cleaning of the substrate 121 (step S105). In addition, the determination unit 116 counts how many times the substrate 121 has been cleaned (step S106). In addition, the determination unit 116 checks that the number of times of cleaning recorded for each substrate 121 does not reach a predetermined threshold value (step S107).

If the number of times of the cleaning process for the substrate 121 has not yet reached the threshold value (step S107: YES), the determination unit 116 executes a cleaning process for the substrate 121 to attempt to remove the deposit (Step S108). Further, after the irregularity state of the cleaned substrate 121 is detected again by the detection unit 114, the determination unit 116 executes the process again from the evaluation of the detection result (step S101). Thus, the substrate 121 is repeatedly cleaned within the range of the threshold number of times until the deposit is removed by cleaning.

The substrate 121 may be cleaned by blowing dry air or an inert gas to the surface of the substrate 121 in addition to the method of carrying out the cleaning of the substrate 121 from the substrate joining apparatus 100 by using the cleaning liquid . In addition, for example, the first cleaning may be a blowing treatment, and the second cleaning may be followed by a cleaning with a cleaning liquid. In addition, the type of cleaning liquid may be changed every time the cleaning is repeated.

When the determination unit 116 instructs cleaning of the substrate 121, the substrate 121 may be taken out of the substrate joining apparatus 100 and attached to the cleaning process. A plurality of substrates 121 to be cleaned may be accumulated in the FOUP 120 or the like and then cleaned at one time.

If it is determined in step S107 that the number of times of the cleaning process for the substrate 121 has already reached the threshold value (step S107: NO), the determination unit 116 may repeat the cleaning of the substrate 121 , It is determined that the possibility that the state of the substrate 121 is improved due to the removal of the deposit is low. Therefore, the determination unit 116 ends the process for the substrate 121. [

The substrate 121 after the processing by the determination unit 116 is completed may be stored in one of the FOUPs 120, for example. The state of the unevenness detected for each of the processed substrates 121 is recorded so that even if a combination of the substrates 121 having a complementary uneven state occurs and such substrates 121 are tried to be joined Okay.

In the above embodiment, the above-described series of judgment procedures by the determination unit 116 is executed for the substrate 121 held in the substrate holder 150. [ The detection unit 114 detects the state of the concavity and convexities of the substrate 121 even before the substrate 121 is held by the substrate holder 150 and detects the state of the substrate 121 by the substrate holder 121 150, the unevenness state of the substrate 121 can be predicted. As a result, the substrate 121 having extremely large concavities and convexities can be eliminated in advance, and the defective adhesion of the substrate 121 by the substrate holder 150 can be prevented in advance. By predicting the state in which the substrate 121 is held in the substrate holder 150, the inference of the microscope when the surface of the substrate 121 held on the substrate holder 150 is observed is speeded up, Can be improved.

In the series of judgment procedures performed by the determination unit 116, a large irregularity state such as warpage of the substrate 121 that reaches the entire substrate 121 may be added to the judgment material. A state of such a large unevenness can be grasped by acquiring information detected in a previous step such as polishing of the substrate 121, for example. The judging section 116 may judge the state of concavity and convexity reaching the entire substrate 121 in consideration of the improvement of the state by overlapping and bonding.

In addition, as one of the materials for predicting whether or not the unevenness condition of the substrate 121 can be improved, the substrate 121 is brought into contact with another substrate 121 to be bonded, It may be detected. Furthermore, by sliding the substrate 121 in contact with the substrate 121, the surface properties and the state of the substrate 121 may be detected by friction of the substrate 121. It is also possible to detect an improvement in the concave-convex state and the concavo-convex state of the substrate 121 by collecting a collision sound generated when the substrate 121 is brought into contact with the substrate 121 and a sound generated when the substrate 121 is deformed due to force .

14 is a flowchart showing an example of a detailed control procedure of the determination unit 116 in steps S104 and S109. In steps S104 and S109, the determination unit 116 determines whether or not the size of the protruding part is within the allowable range, based on the information about the unevenness state acquired from the detection unit 114 (step S201). The permissible range of the size is set to, for example, a range in which the alignment mark in the protruding portion falls within the depth of field in the autofocus function of the microscopes 231 and 251. As another example, the size allowable range is set to a range in which, for example, the residual in the global alignment falls within the threshold value even if the alignment mark is deviated from the design position by the projecting portion.

The determination unit 116 compares the size of the protruding portion of the substrate 121 with the preset threshold value and the size of the protruding portion so that the overlapping portion 170 overlaps the substrate 121, (Step S109: YES). The size of the protruding portion including the case where an adherent is formed can be calculated based on the image obtained when the surface of the substrate 121 is observed with a microscope and the magnification of the microscope, , The automatic focus range, and the like, whether or not a preset threshold value is exceeded.

If the size of the protruding portion is out of the permissible range in step S201, the judging unit 116 judges whether or not the number of protruding portions is within the permissible range, for example, from the information about the unevenness state acquired from the detecting unit 114 (Step S202). The allowable range of the number is set, for example, to a range in which the residual in the global alignment falls within the threshold value even if the alignment marks deviate from the design position due to the projected portions.

If the number of protruding portions does not exceed the predetermined threshold value, the determination unit 116 determines that the overlapping unit 170 can align the substrate 121 with each other regardless of the determination in step S201 (Step S202: YES). The number of deposits on the substrate 121 can be calculated by image processing on the observed image in addition to the method of actually counting the observed image.

On the other hand, when it is determined in step S202 that the number of protruding portions exceeds the threshold value, the judging unit 116 judges, based on the information about the unevenness state acquired from the detecting unit 114, It is checked whether it is located in the permissible area (step S203). An example of a permissible area is on a scribe line 122.

When the position of the protruding portion is located in the permissible area, it is judged that the overlapping portion 170 can align the substrate 121 with each other (Step S109: YES), irrespective of the determination of Step S202.

However, when the position of the protruding portion is located outside the permissible area in Step S203, the judging unit 116 judges that it is not possible to align the substrate 121 to be judged with each other by the overlapping portion 170 (Step S109: NO). In this way, the determination unit 116 may determine that alignment is possible if the unevenness state of the substrate 121 satisfies any one of the conditions.

The state of the irregularities detected for each of the substrates 121 judged not to be suitable for bonding is recorded in relation to the identification information such as a bar code provided for each substrate 121 and the like, It is okay to decide the pair. In this case, the substrate 121 to be bonded may be, for example, a combination of the substrates 121 having mutually complementary unevenness states, and the substrates 121 having protruding portions or the like at the same positions may be combined.

In addition, when the substrate 121 has bumps, the bump flatness may be improved by polishing or the like, and bonding may be tried again. It is also possible to accumulate information on the substrate 121 determined to be impossible to bond and to reflect the improvement in the process before being brought into the substrate bonding apparatus 100.

15 is a flowchart showing an example other than the detailed control procedure of the determination unit 116 in steps S104 and S109. Here again, in step S104 and S109, the determination unit 116 determines whether or not the size of the protruding portion is within the permissible range, based on the information about the unevenness state acquired from the detection unit 114 (step S301).

The determination unit 116 determines whether or not the size of the protruding portion of the substrate 121 falls within the allowable range. If the size of the protruding portion of the substrate 121 is outside the permissible range, the judging unit 116 immediately judges that the overlapping unit 170 can not be aligned with respect to the substrate 121 to be judged (Step S109: NO).

On the other hand, when the size of the protruding portion is within the permissible range (step S301: YES), the judging unit 116 judges whether or not the number of the protruding portions is within the permissible range from the information about the unevenness state acquired from the detecting unit 114 (Step 302). If the number of protruding portions is within the permissible range (step S302: YES), the determination unit 116 determines that the overlapping unit 170 can perform alignment with respect to the substrate 121 Step S109: YES).

However, if the number of protruding portions is outside the permissible range in step S303 (step S302: NO), the judging section 116 also judges, based on the information about the unevenness state acquired from the detecting section 114, It is checked whether or not the position is included in the permissible area (step S303). When the protruding portion is located in the permissible area, the determination unit 116 determines that the overlapping unit 170 can be aligned with respect to the substrate 121 (step S109: YES).

However, when the position of the protruding portion is located outside the permissible area in Step S303, the judging unit 116 judges that it is impossible to align the substrate 121 to be judged with each other by the overlapping unit 170 (Step S109: NO). In this way, the determination unit 116 may determine that some of the conditions are immediately available, and that the other conditions are applicable to a plurality of conditions together.

16 is a flowchart showing still another example of the detailed control procedure of the determination unit 116 in the above-described steps S104 and S109. Here again, in step S104 and S109, the determination unit 116 determines whether or not the size of the protruding portion is within the allowable range, based on the information about the unevenness state acquired from the detection unit 114 (step S401).

When the size of the protruding portion of the substrate 121 is outside the permissible range (step S401: NO), the judging unit 116 judges whether the overlapped portion 170 is positioned relative to the substrate 121 to be judged It is immediately judged that alignment is impossible (step S109: NO). On the other hand, when the size of the protruding portion is within the permissible range (step S401: YES), the judging unit 116 judges whether or not the number of protruding portions is within the permissible range from the information about the unevenness state acquired from the detecting unit 114 (Step 402).

If the number of protruding portions is outside the permissible range (step S402: NO), the determination unit 116 determines that the overlapping unit 170 can not align the substrate 121 with each other (step S109: NO) . If the number of protruding portions is within the permissible range (step S401: YES), the judging unit 116 checks whether or not the position of the protruding portion is in the permissible area from the information about the unevenness state acquired from the detecting unit 114 (Step 403).

When the position of the protruding portion is included in the permissible area, the determination unit 116 determines that the overlapping unit 170 can be aligned with respect to the substrate 121 (step S109: YES). However, when the position of the protruding portion is located outside the permissible area in step S403, the judging section 116 judges that the overlapping section 170 can not align the substrate 121 (step S109: NO ). In this way, the determination unit 116 may determine that alignment is possible when at least one of the conditions is outside the allowable range.

17 is a flowchart showing still another example of the detailed control procedure of the determination unit 116 in the above-described steps S104 and S109. Here again, in step S104 and step S109, the determination unit 116 determines whether or not the size of the protruding part is within the permissible range with respect to the information on the unevenness state acquired from the detection unit 114 (step S501).

When the size of the protruding portion of the substrate 121 is within the permissible range (Step S501: YES), the judging unit 116 judges whether the overlapped portion 170 is located at the position It is immediately judged that it is possible to fit (step S109: YES). On the other hand, when the size of the protruding portion is outside the permissible range (step S501: NO), the judging unit 116 judges whether or not the number of the protruding portions is within the permissible range from the information about the ruggedness state acquired from the detecting unit 114 (Step 502).

If the number of the protruding portions is within the permissible range (step S502: YES), the judging unit 116 judges whether or not the position of the protruding portion is within the permissible area from the information about the unevenness state acquired from the detecting unit 114 (Step 503). If the number of protruding portions is outside the allowable range (step S502: NO), the determination unit 116 determines that the overlapping unit 170 can not align the substrate 121 (step S109 : NO).

When the position of the protruding portion is included in the permissible area, the determination unit 116 determines that the overlapping unit 170 can be aligned with respect to the substrate 121 (step S109: YES). However, when the position of the protruding portion is located outside the permissible area in step S503, the judging section 116 judges that the overlapping section 170 can not align the substrate 121 (step S109: NO ). In this way, the determination unit 116 may determine that the alignment of the substrate 121 is possible when at least one of the conditions is within the allowable range.

The control procedures shown in Figs. 14, 15, 16, and 17 are each only one example, and the determination unit 116 may judge by referring to more irregularity information. As such unevenness information, for example, the determination unit 116 may judge by referring to conditions other than the size, number, and position of the protruding portions. Deviations in the height of the bump formed on the surface of the substrate 121 and the adherence or the like adhering to the surface of the substrate 121 may be detected and used as irregularity information.

For example, when the detecting unit 114 detects the flatness of the bump, that is, the deviation of the heights of the bumps formed on the substrate 121 as irregularity information, as the irregularity information of the substrate 121, , It is also possible to determine whether or not the substrate 121 can be bonded according to the bump flatness determined by the height of the top surface of the bump. In this case, regardless of the flatness of the substrate 121, even when the substrate 121 is uneven due to the thickness irregularity of the substrate 121, the determination unit 116 makes a determination based on the bump flatness . The bump flatness can be measured using, for example, a confocal microscope, a three-dimensional shape measuring device, or the like.

When it is determined that the yield can not be improved based on the detected flatness of the bump (step S110: NO), it is determined that the yield can not be improved by overlapping each other, and the yield is not improved The determination unit 116 generates a command to the transport control unit 118 to remove the substrate 121 from the bonding process.

The substrate 121 that is excluded from the bonding process may be sought other combinations in which the yield due to the bonding becomes high in consideration of the flatness of the bumps of the detected substrate 121. [ It is also possible to try to improve the flatness of the bump by re-firing or the like. Instead of abandoning the bonding of the substrate 121 itself removed from the bonding process, the process conditions such as bump formation and polishing of the other substrate 121 may be adjusted in consideration of the flatness detected with respect to the substrate 121 It's okay to adjust.

When the detection unit 114 detects the attachment adhered to the surface of the substrate 121 as the concavo-convex information of the substrate 121 in step S103, the determination unit 116, in step S110, , The size, and the like. The material of the adherend can be estimated by observing the color, reflectance, transmittance and shape of the adherend under illumination with visible light or infrared light.

When the material of the deposit is detected, the determination unit 116 can determine the hardness (Young's rate) of the deposit, the presence or absence of outgassing, and the like. In addition, by estimating the physical properties of the deposit, it is possible to predict a reduction in the yield of the laminated semiconductor device caused by the deposit, which occurs when the substrate 121 is bonded while leaving the deposit.

That is, for example, when the material of the adherend has a high Young's modulus and it is predicted not to be crushed by the pressing by the bonding, the decrease in the yield due to the adherend becomes greater. In addition, even when the Young's modulus of the adherend is low and it is easy to deform by the pressing of the joint, if the dimension of the adherend is large, the decrease in the yield due to the adherend can not be ignored. In addition, even if bonding is possible by pressurization by bonding, if the outgas is generated from the adherend, the substrate 121 may be chemically altered, so that the adherence may affect the yield.

Examples of the attachments that can be attached to the substrate 121 in the substrate joining apparatus 100 include ceramics such as SiC, stainless steel such as SUS304, metals such as aluminum such as YH75, and PEEK (polyetheretherketone) And heat-resistant resin of the resin. These properties are illustrated in Table 1 below.

[Table 1]

As described above, the materials of the attachments that can be attached to the substrate 121 in the substrate joining apparatus 100 have their own physical characteristics. Therefore, the influence on the joining yield of the substrate 121 can be inferred, depending on the composition of the detected deposit.

The permissible particle diameter means the particle diameter of the adhered material, which is supposed to allow the yield of the final product to fall within the allowable range even if the substrate 121 is adhered while leaving the adhered material. Therefore, for example, when the bonding conditions for heating the substrate 121 are set, the allowable particle diameter may vary depending on the bonding temperature.

In the case where there is no possibility of achieving the yield based on the composition and size of the deposited deposit (step S110: NO), there is no likelihood of improvement due to overlapping with each other, The substrate is removed from the bonding process. The removed substrate may be bonded again through a process such as cleaning. It is also possible to carry out cleaning or repair of the substrate joining apparatus 100 based on the detected material of the deposit, presuming the cause of the deposit.

In the above example, the case where the determination unit 116 determines whether or not the overlapping unit 170 can align the substrate 121 (step S109) has been described. However, the control procedure described above can also be applied to the case where the determination unit 116 determines the yield of the laminated substrate 123 produced by joining the substrate 121 in the substrate joining apparatus 100 (step S110) have.

In the above example, the process of the determination unit 116 for one substrate 121 is sequentially described. However, in the substrate joining apparatus 100, a plurality of substrates 121 having more than three substrates 121 are arranged in parallel . Therefore, the processing in the determination unit 116 is also executed in parallel with respect to the plurality of substrates 121. [

18 is a flowchart showing another execution procedure of the determination process of the determination unit 116 in the integrated control unit 110. FIG. In this execution sequence, the determination unit 116 first evaluates the detection result obtained from the detection unit 114 (step S601), and determines the protruded portion on the surface of the substrate 121 held in the substrate holder 150 It is checked whether or not it can be detected (step S602).

In step S602, the determination unit 116 determines the presence or absence of a protruding portion on the surface of the substrate 121 based on the size, number, position, and the like of the protruding portion, as in step S102 of the procedure shown in Fig. If the protruded portion is not detected (step S602: NO), the determination unit 116 determines that the surface of the substrate 121 is flat and smooth, and determines that the surface of the substrate 121 ) To start overlapping each other.

When the protruding portion is detected on the surface of the substrate 121 in step S602 (step S602: YES), the judging unit 116 judges whether or not the substrate holder 150 holding the substrate 121 is moved to another substrate holder 150 (Step S603). In addition, the determination unit 116 again evaluates the substrate 121 held by the other substrate holder 150 (Step S604), and detects the protruding portion again (Step S605).

If a protruding portion is not detected on the surface of the substrate 121 held by the other substrate holder 150 in Step S605 (Step S605: NO), the protruding portion of the substrate 121, which has become the detection threshold or less, It is presumed that it is due to the nature and condition of the surface of the substrate holder 150. [ Here, the determination unit 116 causes the substrate joining apparatus 100 to start overlapping the substrate 121 that has become flat. The property and state of the surface of the substrate holder 150 include not only the flatness of the adsorption surface of the substrate holder 150 but also the undulation of the surface of the adherend adhering to the adsorption surface of the substrate holder 150 .

If a protruding portion is detected on the surface of the substrate 121 in step S605 (step S602: YES), even if the substrate holder 150 is exchanged, the protruding part of the substrate 121 does not become the detection threshold or less, It is determined that the substrate 121 is in the substrate 121 itself, such as the thickness variation of the substrate 121 itself. Here, the determination unit 116 executes the procedure from step S103 to (after) in the procedure shown in FIG. 13 with respect to the substrate 121 held by the replaced substrate holder 150. FIG.

That is, the judging unit 116 judges whether or not the protruding portion of the substrate 121 is formed by the deposit attached to the substrate 121 (Step S103: YES) (Step S103: NO). When it is judged that the protruding portion of the substrate 121 is formed by the attachment (step S103: YES), the judging unit 116 judges the necessity and necessity of cleaning (step S104) (Step S104: YES), the substrate 121 is aligned and bonded with the deposit left behind.

When it is determined in step S104 that the substrate 121 needs cleaning (step S104: NO), the determination unit 116 instructs the cleaning of the substrate 121 (step S105) ) And that the number of cleaning times does not reach a given threshold value (step S107), the cleaning process is executed (step S108). When the number of cleaning times exceeds the given threshold value (step S107: NO), the process for the substrate 121 is terminated.

If it is determined in step S103 that the projecting portion of the substrate 121 is not an attachment (step S103: NO), the determination unit 116 determines whether or not the overlapping unit 170 can perform alignment (Step S109). Here, if it is determined that the alignment can not be completed (step S109: NO), the determination unit ends the process for the substrate 121. [

If it is determined in step S109 that alignment is possible (step S109: YES), the determination unit 116 determines whether or not the yields of the semiconductor devices and the like obtained from the laminated substrate 123 (Step S110). If it is predicted that the yield can be achieved in this prediction, the determination unit 116 starts overlapping of the substrates 121 (step S110: YES).

If it is determined that the yield can not be attained (step S110: NO), the determination unit 116 may predict whether or not the yield can be achieved by devising a step of overlapping the substrates. If it is predicted that the yield can be achieved in this prediction, the determination unit 116 changes the determination of the substrate 121 to a yield achievable and starts overlapping the substrates 121 (Step S110: YES).

In addition, when it is determined that the yield can not be achieved in the above step, the determination unit 116 may predict whether or not the yield can be achieved by pressing the step of superimposing the substrates on each other. If it is predicted that the yield can be achieved in this prediction, the determination unit 116 changes the determination of the substrate 121 to a yield achievable and starts overlapping the substrates 121 (Step S110: YES).

As described above, in the above-described embodiment, the projecting portion of the substrate 121 caused by the nature and the state of the substrate holder 150 is strictly discriminated, and the decrease in the yield of the substrate 121 due to the occurrence of the projecting portion can be suppressed . In addition, even when it is determined that there is a protruding portion on the substrate 121 itself, it is possible to suppress the yield of the substrate 121 by attempting various judgments on the substrate 121. In the case of NO in step S109 and NO in step S107, it has already been described that the substrate 121 determined to be inappropriate for bonding is excluded from the line of bonding.

19 is a flowchart showing an example of the handling procedure of the substrate holder 150 removed from the substrate 121 for exchange in step S603. The substrate holder detached from the substrate 121 is first inspected by the detecting unit 114 on the protruding portion on the holding surface for holding the substrate 121. [

Next, the determination unit 116 evaluates the detection result of the detection unit 114 in the same manner as the surface of the substrate 121 (step S702). Thus, the determination unit 116 detects the presence or absence of a protruding portion on the holding surface of the substrate holder 150 (step S703). If no protruding portion is detected on the holding surface in step S703 (step S703: NO), the substrate holder 150 has a flat holding surface and is returned to the holder stocker 180 of the substrate joining apparatus 100 . The substrate holder 150 returned is used again for joining the substrate 121. The substrate holder 150 may be returned to the pre-aligner 140 without being returned to the holder stocker 180.

If a protruding portion is detected on the holding surface in step S703 (step S703: YES), the judging unit 116 then checks whether or not the detected protruding part is due to the attachment (step S704). The determination unit 116 determines that the protrusion portion is caused by the deformation of the substrate holder 150 itself and determines that the protrusion portion is not caused by the attachment (step S704: NO) The substrate holder 150 is taken out from the substrate joining apparatus 100.

If it is determined in step S704 that the protruding portion of the substrate holder 150 is formed by the attachment (step S704: YES), the determination unit 116 generates an instruction to clean the substrate holder 150 Step S705). Here, the determination unit counts the number of times the cleaning process is performed with respect to the substrate holder 150 (step S706), and checks that the counted number of cleaning times does not exceed a predetermined threshold value (step S707).

If the number of times of cleaning with respect to the substrate holder 150 reaches the threshold value in step S707 (step S707: NO), the determination unit 116 determines that the attachment of the substrate holder 150 does not disappear And the substrate holder 150 is taken out of the substrate joining apparatus 100 for the purpose of repairing,

When the number of times of cleaning with respect to the substrate holder 150 does not reach the threshold value (step S707: YES), the judging unit 116 executes a cleaning process of the substrate holder 150 Step S708). After the cleaning, a series of processes starting from the evaluation of the attachment surface (step S710) is executed again. The substrate holder 150 is returned to the holder stocker 180 of the substrate joining apparatus 100 and is used again for joining the substrate 121 when the adherend is removed in the cleaning process.

As described above, in the above-described embodiment, the case where the protrusion is formed on the substrate 121 is distinguished from the case where the protrusion is formed on the substrate holder 150 and the case where the protrusion is on the substrate 121, The substrate holder 150 quickly replaces the projecting portion of the substrate 121 by exchanging the substrate holder 150. [ When the cause of the protruding portion of the substrate 121 is on the substrate 121 itself, the condition for performing the bonding while leaving the protruding portion is searched to suppress the yield reduction in the substrate joining apparatus 100 .

The evaluation of the substrate holder 150 and the cleaning by the blowing treatment can be performed by using the pre-aligner 140 in the substrate joining apparatus 100, for example. The substrate holder 150 removed from the line by the exchange may be temporarily stored in the substrate joining apparatus 100 and may be repaired by batch processing outside the substrate joining apparatus 100. [ During maintenance and maintenance, for example, the holding surface of the substrate holder 150 is polished to flatten the holding surface.

Although the present invention has been described using the embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It will be apparent to those skilled in the art that various changes and modifications can be made to the above embodiments. It is apparent from the description of the claims that the form of such modification or improvement can be included in the technical scope of the present invention.

The order of execution of each process such as an operation, an order, a step, and a step in a device, a system, a program and a method as shown in the claims, the specification and the drawings is not particularly specified as "before", "before" And it is to be noted that the output of the previous process can be realized in an arbitrary order unless it is used in the later process. Although the description of the claims, the specification, and the operation flow in the drawings using "first," "next," and the like for the sake of convenience, it does not mean that it is necessary to carry out in this order.

100: substrate bonding apparatus 102: room temperature part
104: high temperature section 106: cover
108: heat insulating wall 110:
112: Overlap control unit 114:
116: Judgment section 118:
120: FOUP 121: substrate
122: scribe line 123: laminated substrate
124: notch 126: element region
128: alignment marks 132, 134, 136: loader
140: prealigner 150: substrate holder
152: permanent magnet 154: magnetic plate
156: Installation 158, 252: Electrostatic Chuck
170: mutually overlapping portions 180: holder stocker
190: abutment 191: loadlock
192: case 193, 195: shutter
194: pressing portion 196: heat plate
198: Plate 199: Entrance
210: frame body 212: wall material
220: Maintaining part 222: Interferometer
224: Reflector 226:
230: fine motion stage 231, 251: microscope
240: Moving stage part 241: Guide rail
242: moving plate 244: coarse stage
246: gravity cancel part 248: spherical sheet
250: Fixed stage 254: Load cell
312: Observation section 314:
316: stage driving unit 318: loader driving unit

Claims (64)

A substrate joining apparatus for joining a first substrate and a second substrate to each other,
A joining portion for joining together the first substrate and the second substrate which are aligned with each other and overlapped with each other,
A detection unit that detects the uneven state of at least one of the first substrate and the second substrate before bonding by the bonding portion;
And a determination unit that determines whether or not the unevenness state detected by the detection unit satisfies a predetermined condition,
Wherein the joining section does not join the first substrate and the second substrate when the determination section determines that the uneven state does not satisfy a predetermined condition. The method according to claim 1,
Wherein the determination unit determines whether or not the first substrate and the second substrate can be bonded based on the uneven state. The method according to claim 1 or 2,
Wherein the detection unit detects the uneven state of the surface to which the first substrate is bonded. 4. The method according to any one of claims 1 to 3,
Wherein the detection unit detects the uneven state caused by the deformation of the first substrate. 5. The method according to any one of claims 1 to 4,
Wherein the detecting unit detects the uneven state caused by the adherence attached to the first substrate. 4. The method according to any one of claims 1 to 3,
Wherein the detecting unit detects the uneven state caused by a deviation of a height of a bump disposed on a surface of the first substrate. 4. The method according to any one of claims 1 to 3,
Wherein the detection unit detects the unevenness state due to the thickness unevenness of the first substrate. The method according to any one of claims 1 to 7,
Wherein the detection unit detects a protruding portion existing on a surface associated with bonding of the first substrate. The method of claim 8,
Wherein the detecting unit detects the height of the projecting portion. The method according to claim 8 or 9,
Wherein the detection unit detects the width of the projecting portion. The method according to any one of claims 8 to 10,
And the detection unit detects the projecting direction of the projecting portion. The method according to any one of claims 8 to 11,
Wherein the determination unit determines whether or not the bonding is possible based on the material of the protruding portion. The method according to any one of claims 1 to 12,
Wherein the detecting section detects the unevenness state based on a distribution of loads applied to the first substrate when the first substrate and the second substrate are overlapped with each other. The method according to any one of claims 1 to 13,
Further comprising an optical system for observing the first substrate,
Wherein the detection unit detects the uneven state based on an in-focus state of an optical system with respect to the first substrate. The method according to any one of claims 1 to 14,
Wherein the detection unit detects the uneven state based on an image (video) taken of the first substrate. The method according to any one of claims 1 to 15,
And a holding member for holding the first substrate,
Wherein the detection unit detects the uneven state in the holding state of the first substrate with respect to the holding member. 18. The method of claim 16,
Wherein the holding member adsorbs and holds the first substrate by electrostatic force,
Wherein the detection unit detects the uneven state based on an amount of current flowing through the first substrate. 18. The method of claim 16,
Wherein the holding member holds and holds the first substrate,
Wherein the detection unit detects the uneven state based on an impedance of an AC voltage applied to the first substrate. 18. The method of claim 16,
Wherein the holding member holds and holds the first substrate by a negative pressure,
Wherein the detecting section detects the unevenness state based on the fluctuation of the negative pressure in the holding member. 18. The method of claim 16,
Wherein the detecting unit detects whether or not the uneven state caused in the first substrate is caused by the holding member. The method according to any one of claims 1 to 20,
And a transfer section for transferring the first substrate and the second substrate to the junction section, respectively,
Wherein the detecting unit detects the uneven state before the substrate is brought into the joining portion. The method according to any one of claims 1 to 21,
And a prealignment unit for detecting a position of each of the first substrate and the second substrate before they are aligned with each other,
Wherein the detection unit detects the uneven state in the pre-alignment unit. The method according to any one of claims 1 to 22,
The first substrate and the second substrate overlap each other,
Wherein the detecting unit detects the first substrate and the second substrate on the basis of a pressure distribution generated in the bonding surface between the first substrate and the second substrate when the overlapping portions overlap the first substrate and the second substrate, And detects the uneven state of at least one of the substrates. The method according to any one of claims 1 to 23,
Wherein the detection unit detects the uneven state before the first substrate and the second substrate are superimposed on each other and before the first substrate and the second substrate are bonded at the bonding portion. 26. The method according to any one of claims 1 to 24,
Wherein the determination unit determines whether or not the bonding is possible based on a yield when the first substrate and the second substrate are bonded. 26. The method of claim 25,
The determination unit calculates at least one of a size and a position of at least one of an adhesion region and a non-adhesion region when the first substrate and the second substrate are bonded, based on the uneven state detected by the detection unit , And the yield is calculated on the basis thereof. 26. The method according to any one of claims 1 to 26,
Wherein the determination unit predicts and determines deformation of at least one of the first substrate and the second substrate that occurs at the joining at the joining portion. 27. The method according to any one of claims 1 to 27,
Wherein the determination unit determines whether or not the attachment should be removed when the detection unit detects an attachment attached to at least one of the first substrate and the second substrate. 29. The method of claim 28,
Wherein the detection unit detects the unevenness state again after removing the adhering material that the determination unit has determined to be removed. 29. The method of claim 29,
Wherein the determination unit determines that at least one of the first substrate and the second substrate can not be bonded to one of the substrates when the number of repetitions of detection and removal of the attachment exceeds a predetermined threshold value Substrate bonding apparatus. A substrate bonding method for bonding a first substrate and a second substrate to each other,
An alignment step of aligning the first substrate and the second substrate with each other and overlapping each other,
A bonding step of bonding the first substrate and the second substrate which are aligned with each other,
A detecting step of detecting an uneven state of at least one of the first substrate and the second substrate before the joining step;
And a determining step of determining whether or not the unevenness state detected by the detecting step satisfies a predetermined condition,
Wherein the bonding step is not performed when it is determined in the determining step that the unevenness state does not satisfy the predetermined condition. 32. The method of claim 31,
Wherein the judging step judges whether the first substrate and the second substrate can be bonded or not in the joining step. 32. The method of claim 31 or 32,
Wherein the detecting step detects the uneven state of the surface to which the first substrate is bonded. 32. The method according to any one of claims 31 to 33,
Wherein the detecting step detects the uneven state caused by the deformation of the first substrate. 32. The method according to any one of claims 31 to 33,
Wherein the detecting step detects the unevenness state caused by the adherence adhered to the first substrate. 32. The method according to any one of claims 31 to 33,
Wherein the detecting step detects the unevenness state caused by a deviation of a height of a bump disposed on a surface of the first substrate. 32. The method according to any one of claims 31 to 33,
Wherein the detecting step detects the unevenness state caused by the thickness unevenness of the first substrate. 38. The method of any one of claims 31-37,
Wherein the detecting step detects a protruding portion existing on a surface associated with bonding of the first substrate. 42. The method of claim 38,
Wherein the detecting step detects the height of the projecting portion. 42. The method of claim 38 or 39,
Wherein the detecting step detects the width of the projecting portion. 42. A method according to any one of claims 38 to 40,
Wherein the detecting step detects the projecting direction of the protruding portion. 42. A method according to any one of claims 38 to 41,
Wherein the judging step judges whether or not the bonding is possible based on the material of the protruding portion. 42. A method as claimed in any one of claims 31 to 42,
Wherein the detecting step detects the unevenness state based on a distribution of a load applied to the first substrate when the first substrate and the second substrate are overlapped with each other. 42. A method according to any one of claims 31 to 43,
And an observation step of observing the first substrate,
Wherein the detecting step detects the uneven state based on a focus state of the optical system with respect to the first substrate. 42. A method as claimed in any one of claims 31 to 44,
Wherein the detecting step detects the unevenness state based on an image of the first substrate. 38. The apparatus of any one of claims 31 to 45,
Wherein the detecting step detects the uneven state in the holding state of the first substrate to the holding member holding the first substrate. 47. The method of claim 46,
Wherein the detecting step detects the unevenness state based on an amount of current flowing through the first substrate held by the holding member by electrostatic force. 47. The method of claim 46,
Wherein the detecting step detects the unevenness state based on the impedance of the alternating-current voltage applied to the first substrate. 47. The method of claim 46,
Wherein the detecting step detects the unevenness state based on the fluctuation of the negative pressure in the holding member that adsorbs and holds the first substrate by a negative pressure. 47. The method of claim 46,
Wherein the detecting step detects whether or not the unevenness state of the first substrate is caused by the holding member. 47. The method of any one of claims 31-50,
And a transporting step of transporting the first substrate and the second substrate, respectively, to a bonding portion for carrying out the bonding step,
Wherein the detecting step detects the unevenness state before the substrate is brought into the bonding portion. 47. The method of any one of claims 31-51,
And a prealignment step of detecting respective positions before aligning the first substrate and the second substrate with each other,
Wherein the detecting step detects the unevenness state in the prealignment step. 47. The method of any one of claims 31-52,
Wherein the first substrate and the second substrate overlap each other when the first substrate and the second substrate overlap each other, and wherein the detecting step includes a step of overlapping the first substrate and the second substrate, Wherein the unevenness state of at least one of the first substrate and the second substrate is detected based on a pressure distribution generated in a bonding surface of the second substrate. 47. The method of any one of claims 31 to 47,
Wherein the detecting step detects the unevenness state after the first substrate and the second substrate are superimposed on each other and before being bonded in the bonding step. 47. The method of any one of claims 31-48,
Wherein the judging step judges whether or not the bonding is possible based on the yield when the first substrate and the second substrate are bonded. 55. The method of claim 55,
Wherein the determining step includes determining at least one of a size and a position of at least one of an adhesion area and a non-adhesion area when the first substrate and the second substrate are bonded, based on the uneven state detected by the detection step And the yield is calculated on the basis of the calculated yield. 47. The method of any one of claims 31-56,
Wherein the determining step predicts and determines deformation of at least one of the first substrate and the second substrate that occurs at the time of joining in the joining step. 47. The method of any one of claims 31 to 57,
Wherein the determining step determines whether or not the attachment should be removed when the detection step detects an attachment attached to at least one of the first substrate and the second substrate. 64. The method of claim 58,
Wherein the detecting step detects the unevenness state again after removing the deposit determined to be removed in the determining step. 55. The method of claim 59,
Wherein the judging step judges that the one substrate can not be bonded in at least one of the first substrate and the second substrate when the number of repetitions of detection and removal of the deposit exceeds a predetermined threshold value / RTI > 38. The method of any one of claims 31-60,
And a transfer step of transferring the one substrate to the FOUP when it is determined in the determining step that at least one of the first substrate and the second substrate is unjoinable. 38. The method of any one of claims 31-61,
And combining at least one of the first substrate and the second substrate with another substrate capable of bonding with the one substrate when it is determined in the determining step that at least one of the first substrate and the second substrate can not be bonded. 62. The method of any one of claims 31-62,
And modifying the height of the bumps provided on the one of the substrates when it is determined in the determining step that at least one of the first substrate and the second substrate can not be bonded. 42. A method according to any one of claims 31 to 63,
And adjusting a process condition for forming a substrate on the basis of the data of the one of the substrates when it is determined in the determining step that at least one of the first substrate and the second substrate can not be bonded, Bonding method.

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