SG11201901754PA - Working apparatus and working method - Google Patents

Working apparatus and working method

Info

Publication number
SG11201901754PA
SG11201901754PA SG11201901754PA SG11201901754PA SG11201901754PA SG 11201901754P A SG11201901754P A SG 11201901754PA SG 11201901754P A SG11201901754P A SG 11201901754PA SG 11201901754P A SG11201901754P A SG 11201901754PA SG 11201901754P A SG11201901754P A SG 11201901754PA
Authority
SG
Singapore
Prior art keywords
work
drive device
moving
heads
stage
Prior art date
Application number
SG11201901754PA
Inventor
Kazumasa Ikushima
Original Assignee
Musashi Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Musashi Engineering Inc filed Critical Musashi Engineering Inc
Publication of SG11201901754PA publication Critical patent/SG11201901754PA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
    • B05C5/0216—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles by relative movement of article and outlet according to a predetermined path
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
    • B05C5/0275—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated flow controlled, e.g. by a valve
    • B05C5/0279—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated flow controlled, e.g. by a valve independently, e.g. individually, flow controlled
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C3/00—Measuring distances in line of sight; Optical rangefinders

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Automatic Control Of Machine Tools (AREA)
  • Control Of Position Or Direction (AREA)
  • Machine Tool Units (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

[Problem] To provide a work apparatus and a work method whereby work can be obtained that is free of variations among a plurality of work heads having machine differences. [Solution] A work apparatus and a work method that uses the apparatus, the work apparatus provided with n (where n is a natural number equal to 2 or greater) work heads for performing the same work, a stage for retaining a work object, a first-direction drive device for moving the stage and the work heads relative to each other, a second-direction drive device for moving the stage and the work heads relative to each other, a third-direction drive device for moving the stage and the work heads relative to each other, a work amount measurement device for measuring the work amount of each work head, and a control device, the first-direction drive device being capable of moving each of the n work heads independently in a first direction, and the second-direction drive device being provided with a second-direction main drive device for moving the n work heads in a second direction simultaneously and a second-direction secondary drive device for moving each of n-1 work heads of the n work heads independently in the second direction. Figure 1
SG11201901754PA 2016-09-30 2017-09-29 Working apparatus and working method SG11201901754PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016194424 2016-09-30
PCT/JP2017/035393 WO2018062463A1 (en) 2016-09-30 2017-09-29 Working apparatus and working method

Publications (1)

Publication Number Publication Date
SG11201901754PA true SG11201901754PA (en) 2019-04-29

Family

ID=61759832

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201901754PA SG11201901754PA (en) 2016-09-30 2017-09-29 Working apparatus and working method
SG10202101804XA SG10202101804XA (en) 2016-09-30 2017-09-29 Working apparatus and working method

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10202101804XA SG10202101804XA (en) 2016-09-30 2017-09-29 Working apparatus and working method

Country Status (12)

Country Link
US (1) US11229923B2 (en)
EP (1) EP3520904B1 (en)
JP (1) JP6995374B2 (en)
KR (1) KR102362082B1 (en)
CN (1) CN109789434B (en)
HU (1) HUE062007T2 (en)
MY (1) MY202372A (en)
PH (1) PH12019550047A1 (en)
PL (1) PL3520904T3 (en)
SG (2) SG11201901754PA (en)
TW (1) TWI797090B (en)
WO (1) WO2018062463A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7212055B2 (en) * 2018-10-11 2023-01-24 株式会社Fuji work machine
US11684947B2 (en) * 2018-11-09 2023-06-27 Illinois Tool Works Inc. Modular fluid application device for varying fluid coat weight
US20210301943A1 (en) * 2020-03-27 2021-09-30 Illinois Tool Works Inc. Dispensing unit having fixed flexible diaphragm seal
US11246249B2 (en) 2020-04-15 2022-02-08 Illinois Tool Works Inc. Tilt and rotate dispenser having strain wave gear system
US11805634B2 (en) * 2021-08-03 2023-10-31 Illinois Tool Works Inc. Tilt and rotate dispenser having motion control
US11904337B2 (en) 2021-08-03 2024-02-20 Illinois Tool Works Inc. Tilt and rotate dispenser having material flow rate control
CN114425500A (en) * 2021-12-30 2022-05-03 杨倬铭 Container plate detecting and righting repairing equipment for port

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AU2002360448A1 (en) * 2002-11-27 2004-06-23 Litrex Corporation Microdeposition system
US20050056215A1 (en) * 2003-03-11 2005-03-17 Shibaura Mechantronics Corporation Apparatus for applying paste and method of applying paste
JP2004290885A (en) 2003-03-27 2004-10-21 Seiko Epson Corp Application method and application apparatus of coating material, and production method of electro-optical device
TWI298268B (en) * 2005-07-08 2008-07-01 Top Eng Co Ltd Paste dispenser and method of controlling the same
JP2008104916A (en) * 2006-10-24 2008-05-08 Seiko Epson Corp Liquid droplet discharge device, weight measuring method, discharge method of liquid like material and manufacturing method of color filter
JP4871093B2 (en) * 2006-11-01 2012-02-08 武蔵エンジニアリング株式会社 Method, apparatus and program for filling liquid material
JP2009050828A (en) 2007-08-29 2009-03-12 Shibaura Mechatronics Corp Paste coating device and paste coating method
JP4891185B2 (en) * 2007-09-18 2012-03-07 パナソニック株式会社 Viscous fluid application device
KR101026426B1 (en) * 2008-08-27 2011-04-07 주식회사 탑 엔지니어링 Dispenser and method for dispensing sealant, etc. using the same
JP2010186839A (en) 2009-02-11 2010-08-26 Misuzu Kogyo:Kk Device for setting sealing resin delivery condition for electronic component, and sealing resin delivery device for electronic component, and method of setting sealing resin delivery condition for electronic component and sealing resin delivery method for electronic component
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Also Published As

Publication number Publication date
EP3520904A4 (en) 2020-06-03
JPWO2018062463A1 (en) 2019-07-18
CN109789434B (en) 2022-04-29
WO2018062463A1 (en) 2018-04-05
PH12019550047A1 (en) 2019-07-24
KR102362082B1 (en) 2022-02-10
HUE062007T2 (en) 2023-09-28
SG10202101804XA (en) 2021-04-29
PL3520904T3 (en) 2023-06-05
TWI797090B (en) 2023-04-01
JP6995374B2 (en) 2022-01-14
KR20190062405A (en) 2019-06-05
US11229923B2 (en) 2022-01-25
CN109789434A (en) 2019-05-21
MY202372A (en) 2024-04-24
TW201819050A (en) 2018-06-01
US20190193104A1 (en) 2019-06-27
EP3520904A1 (en) 2019-08-07
EP3520904B1 (en) 2023-03-29

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