SG11201901047XA - Optical measurement of step size and plated metal thickness - Google Patents

Optical measurement of step size and plated metal thickness

Info

Publication number
SG11201901047XA
SG11201901047XA SG11201901047XA SG11201901047XA SG11201901047XA SG 11201901047X A SG11201901047X A SG 11201901047XA SG 11201901047X A SG11201901047X A SG 11201901047XA SG 11201901047X A SG11201901047X A SG 11201901047XA SG 11201901047X A SG11201901047X A SG 11201901047XA
Authority
SG
Singapore
Prior art keywords
captured image
international
determining
characteristic value
california
Prior art date
Application number
SG11201901047XA
Inventor
James Jianguo Xu
Ronny Soetarman
Budi Hartono
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/233,812 external-priority patent/US20180045937A1/en
Priority claimed from US15/338,838 external-priority patent/US10157457B2/en
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of SG11201901047XA publication Critical patent/SG11201901047XA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/022—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by means of tv-camera scanning
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/24—Base structure
    • G02B21/241—Devices for focusing
    • G02B21/244—Devices for focusing using image analysis techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/04—Measuring microscopes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/0004—Microscopes specially adapted for specific applications
    • G02B21/0016—Technical microscopes, e.g. for inspection or measuring in industrial production processes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/24—Base structure
    • G02B21/26—Stages; Adjusting means therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/36—Microscopes arranged for photographic purposes or projection purposes or digital imaging or video purposes including associated control and data processing arrangements
    • G02B21/365—Control or image processing arrangements for digital or video microscopes
    • G02B21/367—Control or image processing arrangements for digital or video microscopes providing an output produced by processing a plurality of individual source images, e.g. image tiling, montage, composite images, depth sectioning, image comparison
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T1/00—General purpose image data processing
    • G06T1/0007—Image acquisition
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/50—Depth or shape recovery
    • G06T7/55—Depth or shape recovery from multiple images
    • G06T7/571—Depth or shape recovery from multiple images from focus
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/60—Analysis of geometric attributes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10028—Range image; Depth image; 3D point clouds
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10141—Special mode during image acquisition
    • G06T2207/10148—Varying focus
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Optics & Photonics (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Multimedia (AREA)
  • Quality & Reliability (AREA)
  • Geometry (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Microscoopes, Condenser (AREA)

Abstract

INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 15 February 2018 (15.02.2018) WIP0 I PCT ill~~~~~~~~ 011101010VIIIOH olo olll omoniloommom oimIE (10) International Publication Number WO 2018/031567 Al (51) International Patent Classification: GO1B 11/02 (2006.01) GO6T 1/00 (2006.01) GO1B 9/04 (2006.01) G06T 7/60 (2006.01) G01B 11/24 (2006.01) (21) International Application Number: PCT/US2017/045938 (22) International Filing Date: 08 August 2017 (08.08.2017) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 15/233,812 10 August 2016 (10.08.2016) US 15/338,838 31 October 2016 (31.10.2016) US 15/346,594 08 November 2016 (08.11.2016) US (71) Applicant: KLA-TENCOR CORPORATION [US/US]; Legal Department, One Technology Drive, Milpitas, Cali- fornia 95035 (US). (72) Inventors: XU, James Jianguo; 1029 Olmo Court, San Jose, California 95129 (US). SOETARMAN, Ronny; 48353 Avalon Heights Terrace, Fremont, California 94539 (US). HARTONO, Budi; 4141 Lowry Road, Fremont, Cal- ifornia 94555 (US). (74) Agent: MCANDREWS, Kevin et al.; KLA-TENCOR CORPORATION, Legal Department, One Technology Dri- ve, Milpitas, California 95035 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). (54) Title: OPTICAL MEASUREMENT OF STEP SIZE AND PLATED METAL THICKNESS SEMI-AUTOMATED 3-D METROLOGY SYSTEM (57) : A method of generating 3D information includes: vary- ing the distance between the sample and an objective lens of the op- tical microscope at pre-determined steps, capturing an image at each pre-determined step; determining a characteristic value of each pix- el in each captured image; determining, for each captured image, the greatest characteristic value across all pixels in the captured image; comparing the greatest characteristic value for each captured image to determine if a surface of the sample is present at each pre-determined step; determining a first captured image that is focused on a first sur- face of the sample based on the characteristic value of each pixel in each captured image; determining a second captured image that is fo- cused on a second surface of the sample based on the characteristic value of each pixel in each captured image; and determining a first distance between the first surface and the second surface. W O 20 18/03 15 67 Al SEMI-AUTOMATED 3-D METROLOGY SYSTEM FIG. 1 [Continued on next page] WO 2018/031567 Al IIIII1 00 Published: — with international search report (Art. 21(3))
SG11201901047XA 2016-08-10 2017-08-08 Optical measurement of step size and plated metal thickness SG11201901047XA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US15/233,812 US20180045937A1 (en) 2016-08-10 2016-08-10 Automated 3-d measurement
US15/338,838 US10157457B2 (en) 2016-08-10 2016-10-31 Optical measurement of opening dimensions in a wafer
US15/346,594 US10359613B2 (en) 2016-08-10 2016-11-08 Optical measurement of step size and plated metal thickness
PCT/US2017/045938 WO2018031567A1 (en) 2016-08-10 2017-08-08 Optical measurement of step size and plated metal thickness

Publications (1)

Publication Number Publication Date
SG11201901047XA true SG11201901047XA (en) 2019-03-28

Family

ID=61160196

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201901047XA SG11201901047XA (en) 2016-08-10 2017-08-08 Optical measurement of step size and plated metal thickness

Country Status (6)

Country Link
US (1) US10359613B2 (en)
KR (1) KR102226228B1 (en)
CN (1) CN109791038B (en)
SG (1) SG11201901047XA (en)
TW (1) TWI733877B (en)
WO (1) WO2018031567A1 (en)

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CN110610147A (en) * 2019-08-30 2019-12-24 中国科学院深圳先进技术研究院 Blood vessel image extraction method, related device and storage equipment
KR102654133B1 (en) * 2021-09-07 2024-04-04 조선대학교산학협력단 Apparatus and method generating 3d image of target metalic grain
CN115930787A (en) * 2022-10-06 2023-04-07 山东申华光学科技有限公司 Method and system for detecting coating quality of coating machine based on machine vision

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Also Published As

Publication number Publication date
TW201812705A (en) 2018-04-01
KR20190029765A (en) 2019-03-20
WO2018031567A1 (en) 2018-02-15
CN109791038A (en) 2019-05-21
US10359613B2 (en) 2019-07-23
US20180045946A1 (en) 2018-02-15
KR102226228B1 (en) 2021-03-09
CN109791038B (en) 2021-02-26
TWI733877B (en) 2021-07-21

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