SG11201807221YA - Fabry-perot interference filter and production method for fabry-perot interference filter - Google Patents

Fabry-perot interference filter and production method for fabry-perot interference filter

Info

Publication number
SG11201807221YA
SG11201807221YA SG11201807221YA SG11201807221YA SG11201807221YA SG 11201807221Y A SG11201807221Y A SG 11201807221YA SG 11201807221Y A SG11201807221Y A SG 11201807221YA SG 11201807221Y A SG11201807221Y A SG 11201807221YA SG 11201807221Y A SG11201807221Y A SG 11201807221YA
Authority
SG
Singapore
Prior art keywords
fabry
interference filter
perot interference
laminate
outer edge
Prior art date
Application number
SG11201807221YA
Inventor
Takashi Kasahara
Katsumi Shibayama
Masaki Hirose
Toshimitsu Kawai
Hiroki Oyama
Yumi Kuramoto
Original Assignee
Hamamatsu Photonics Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics Kk filed Critical Hamamatsu Photonics Kk
Publication of SG11201807221YA publication Critical patent/SG11201807221YA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/12—Generating the spectrum; Monochromators
    • G01J3/26—Generating the spectrum; Monochromators using multiple reflection, e.g. Fabry-Perot interferometer, variable interference filters
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00523—Etching material
    • B81C1/00539—Wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00634—Processes for shaping materials not provided for in groups B81C1/00444 - B81C1/00626
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/02—Details
    • G01J3/0205—Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows
    • G01J3/0243—Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows having a through-hole enabling the optical element to fulfil an additional optical function, e.g. a mirror or grating having a throughhole for a light collecting or light injecting optical fiber
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/28—Interference filters
    • G02B5/284—Interference filters of etalon type comprising a resonant cavity other than a thin solid film, e.g. gas, air, solid plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

Abstract

The Fabry-Perot interference filter includes: a substrate 11 having a first surface 11a, a first laminate 22 having a first mirror portion 31 disposed on the first surface 11a, a second laminate 24 5 having a second mirror portion 32 facing the first mirror portion 31 with an air gap S interposed therebetween, and an intermediate layer 23 defining the air gap S between the first laminate 22 and the second laminate 24. The substrate 11 has an outer edge portion 11 c positioned outside an outer edge of the intermediate layer 23 when viewed from a 10 direction perpendicular to the first surface 11a. The second laminate 24 further includes a covering portion 33 covering the intermediate layer 23 and a peripheral edge portion 34 positioned on the first surface 11 a in the outer edge portion 11c. The second mirror portion 32, the covering portion 33, and the peripheral edge portion 34 are integrally 15 formed so as to be continuous with each other. The peripheral edge portion 34 is thinned along an outer edge of the outer edge portion 11 c. Figure 3 34
SG11201807221YA 2016-05-27 2017-05-01 Fabry-perot interference filter and production method for fabry-perot interference filter SG11201807221YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016106269 2016-05-27
PCT/JP2017/017172 WO2017203949A1 (en) 2016-05-27 2017-05-01 Fabry-perot interference filter and production method for fabry-perot interference filter

Publications (1)

Publication Number Publication Date
SG11201807221YA true SG11201807221YA (en) 2018-09-27

Family

ID=60411250

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201807221YA SG11201807221YA (en) 2016-05-27 2017-05-01 Fabry-perot interference filter and production method for fabry-perot interference filter

Country Status (10)

Country Link
US (3) US10900834B2 (en)
EP (2) EP3467565B1 (en)
JP (3) JP6341959B2 (en)
KR (1) KR102349371B1 (en)
CN (2) CN109313334B (en)
CA (1) CA3024961A1 (en)
PH (1) PH12018502443A1 (en)
SG (1) SG11201807221YA (en)
TW (2) TWI733816B (en)
WO (1) WO2017203949A1 (en)

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JP7202160B2 (en) * 2018-12-05 2023-01-11 浜松ホトニクス株式会社 OPTICAL FILTER DEVICE AND CONTROL METHOD FOR OPTICAL FILTER DEVICE
JP7091489B2 (en) * 2020-02-26 2022-06-27 キヤノンファインテックニスカ株式会社 A one-way clutch, a drive transmission unit using this one-way clutch, and an inkjet recording device using this drive transmission unit.
DE102020203573A1 (en) 2020-03-19 2021-09-23 Robert Bosch Gesellschaft mit beschränkter Haftung Semiconductor substrate and method for forming air and / or gas transfer access through a semiconductor substrate

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Also Published As

Publication number Publication date
CN109196404B (en) 2022-05-03
PH12018502443A1 (en) 2019-09-09
CN109313334B (en) 2021-08-17
TWI733816B (en) 2021-07-21
TWI735581B (en) 2021-08-11
KR20190012139A (en) 2019-02-08
JP2018128703A (en) 2018-08-16
US20190204150A1 (en) 2019-07-04
JP6341959B2 (en) 2018-06-13
US20180373021A1 (en) 2018-12-27
EP3467565A4 (en) 2020-03-11
EP3467565B1 (en) 2024-02-14
JPWO2017203949A1 (en) 2019-03-22
JP2017215559A (en) 2017-12-07
TW201800728A (en) 2018-01-01
EP3467566A4 (en) 2019-12-25
US20210131870A1 (en) 2021-05-06
US10908022B2 (en) 2021-02-02
TW201805686A (en) 2018-02-16
JP6983767B2 (en) 2021-12-17
CA3024961A1 (en) 2017-11-30
WO2017203949A1 (en) 2017-11-30
KR102349371B1 (en) 2022-01-11
CN109196404A (en) 2019-01-11
EP3467565A1 (en) 2019-04-10
EP3467566A1 (en) 2019-04-10
JP6368447B1 (en) 2018-08-01
US10900834B2 (en) 2021-01-26
CN109313334A (en) 2019-02-05

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