SG11201804404RA - Liquid crystal polymer article for high temperature semiconductor process - Google Patents

Liquid crystal polymer article for high temperature semiconductor process

Info

Publication number
SG11201804404RA
SG11201804404RA SG11201804404RA SG11201804404RA SG11201804404RA SG 11201804404R A SG11201804404R A SG 11201804404RA SG 11201804404R A SG11201804404R A SG 11201804404RA SG 11201804404R A SG11201804404R A SG 11201804404RA SG 11201804404R A SG11201804404R A SG 11201804404RA
Authority
SG
Singapore
Prior art keywords
international
rule
liquid crystal
crystal polymer
pct
Prior art date
Application number
SG11201804404RA
Inventor
Michael Zimmerman
F Mahoney
William Scavuzzo
Original Assignee
Iqlp Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iqlp Llc filed Critical Iqlp Llc
Publication of SG11201804404RA publication Critical patent/SG11201804404RA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
    • C09K19/38—Polymers
    • C09K19/3804—Polymers with mesogenic groups in the main chain
    • C09K19/3809—Polyesters; Polyester derivatives, e.g. polyamides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/52—Liquid crystal materials characterised by components which are not liquid crystals, e.g. additives with special physical aspect: solvents, solid particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/016—Additives defined by their aspect ratio

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Ink Jet (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

Title: LIQUID CRYSTAL POLYMER ARTICLE FOR HIGH TEMPERATURE SEMICONDUCTOR PROCESS Shear Sweep Curve Run I -4-----Run 10000 100000 Apparent Shear Rate (1./s) FIG. 1 (57) : A Front-Opening Unified Pod (FOUP), and more particularly an injection molded liquid crystal polymer article used in making the FOUP which both positive CTE value and shrinkage values and similar expansion and shrinkage of the article in both the MD and TD directions. s. (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau 111111111M 1111111111111111111111111111111111111111111111111111111111R111111111111111 (10) International Publication Number WO 2017/091567 Al WIPO I PCT (43) International Publication Date 1 June 2017 (01.06.2017) BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Declarations under Rule 4.17: as to applicant's entitlement to apply for and be granted a patent (Rule 4.170) as to the applicant's entitlement to claim the priority of the earlier application (Rule 4.17(iii)) of inventorship (Rule 4.17(iv)) Published: — with international search report (Art 21(3)) (51) International Patent Classification: GO2F 1/13 (2006.01) C09K 19/52 (2006.01) C09K 19/06 (2006.01) C08K 3/04 (2006.01) C09K 19/38 (2006.01) HO1L 23/60 (2006.01) (21) International Application Number: PCT/US2016/063309 (22) International Filing Date: 22 November 2016 (22.11.2016) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/259,320 24 November 2015 (24.11.2015) US (71) Applicant: IQLP LLC [US/US]; 10-M Commerce Way, Woburn, MA 01801 (US). (72) Inventors: ZIMMERMAN, Michael, A.; 55 Rosemont Drive, No. Andover, MA 01845 (US). MAHONEY, F., Michael; 88 Juniper Road, Holliston, MA 01746 (US). SCAVUZZO, William, S.; P.O. Box 181, Newton Junc- tion, NH 03859 (US). (74) Agents: SCHURGIN, Stanley, M. et al.; Preti Flaherty Beliveau & Pachios LLP, 60 State Street, Suite 1100, Bo- ston, MA 02109 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, W O 20 17 /09 15 67 Al
SG11201804404RA 2015-11-24 2016-11-22 Liquid crystal polymer article for high temperature semiconductor process SG11201804404RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562259320P 2015-11-24 2015-11-24
PCT/US2016/063309 WO2017091567A1 (en) 2015-11-24 2016-11-22 Liquid crystal polymer article for high temperature semiconductor process

Publications (1)

Publication Number Publication Date
SG11201804404RA true SG11201804404RA (en) 2018-06-28

Family

ID=58764395

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201804404RA SG11201804404RA (en) 2015-11-24 2016-11-22 Liquid crystal polymer article for high temperature semiconductor process

Country Status (7)

Country Link
US (1) US20190062520A1 (en)
EP (1) EP3380887A4 (en)
JP (1) JP2018535863A (en)
KR (1) KR20180084982A (en)
CN (1) CN108431682A (en)
SG (1) SG11201804404RA (en)
WO (1) WO2017091567A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110876230B (en) * 2018-09-03 2020-09-15 昆山雅森电子材料科技有限公司 Composite laminated LCP substrate and preparation method thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8915475D0 (en) * 1989-07-06 1989-08-23 T & N Technology Ltd Wear-resistant articles
US5432225A (en) * 1992-10-22 1995-07-11 Toray Industries, Inc. Thermotropic resin composition containing a graphite
EP0704486B1 (en) * 1994-03-18 2005-09-21 Mitsubishi Denki Kabushiki Kaisha Resin composition for molding precision parts, and sleeve and ferrule produced therefrom
WO2004016673A1 (en) * 2002-08-19 2004-02-26 Rensselaer Polytechnic Institute Liquid crystal polymers
CA2509050A1 (en) * 2002-12-18 2004-07-15 E. I. Du Pont De Nemours And Company High temperature lcp for wear resistance
SG157957A1 (en) * 2003-01-29 2010-01-29 Interplex Qlp Inc Package for integrated circuit die
US7784178B2 (en) * 2007-06-29 2010-08-31 Intel Corporation Higher performance barrier materials for containers of environmentally sensitive semiconductor fabrication devices
EP2195374B1 (en) * 2007-10-01 2013-07-10 DSM IP Assets B.V. Heat-processable thermally conductive polymer composition
TW201012857A (en) * 2008-05-29 2010-04-01 Sumitomo Chemical Co Liquid-crystalline polymer composition containing nanostructured hollow-carbon material and molded article thereof

Also Published As

Publication number Publication date
JP2018535863A (en) 2018-12-06
EP3380887A4 (en) 2019-06-26
US20190062520A1 (en) 2019-02-28
KR20180084982A (en) 2018-07-25
WO2017091567A1 (en) 2017-06-01
EP3380887A1 (en) 2018-10-03
CN108431682A (en) 2018-08-21

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