SG11201709209UA - Novel (meth)acryloyl compound and method for producing same - Google Patents

Novel (meth)acryloyl compound and method for producing same

Info

Publication number
SG11201709209UA
SG11201709209UA SG11201709209UA SG11201709209UA SG11201709209UA SG 11201709209U A SG11201709209U A SG 11201709209UA SG 11201709209U A SG11201709209U A SG 11201709209UA SG 11201709209U A SG11201709209U A SG 11201709209UA SG 11201709209U A SG11201709209U A SG 11201709209UA
Authority
SG
Singapore
Prior art keywords
meth
novel
producing same
acryloyl compound
acryloyl
Prior art date
Application number
SG11201709209UA
Inventor
Masatoshi Echigo
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Publication of SG11201709209UA publication Critical patent/SG11201709209UA/en

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Classifications

    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/017Esters of hydroxy compounds having the esterified hydroxy group bound to a carbon atom of a six-membered aromatic ring
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07BGENERAL METHODS OF ORGANIC CHEMISTRY; APPARATUS THEREFOR
    • C07B61/00Other general methods
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C67/00Preparation of carboxylic acid esters
    • C07C67/14Preparation of carboxylic acid esters from carboxylic acid halides
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/52Esters of acyclic unsaturated carboxylic acids having the esterified carboxyl group bound to an acyclic carbon atom
    • C07C69/533Monocarboxylic acid esters having only one carbon-to-carbon double bond
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/52Esters of acyclic unsaturated carboxylic acids having the esterified carboxyl group bound to an acyclic carbon atom
    • C07C69/533Monocarboxylic acid esters having only one carbon-to-carbon double bond
    • C07C69/54Acrylic acid esters; Methacrylic acid esters
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/52Esters of acyclic unsaturated carboxylic acids having the esterified carboxyl group bound to an acyclic carbon atom
    • C07C69/587Monocarboxylic acid esters having at least two carbon-to-carbon double bonds
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D311/00Heterocyclic compounds containing six-membered rings having one oxygen atom as the only hetero atom, condensed with other rings
    • C07D311/02Heterocyclic compounds containing six-membered rings having one oxygen atom as the only hetero atom, condensed with other rings ortho- or peri-condensed with carbocyclic rings or ring systems
    • C07D311/78Ring systems having three or more relevant rings
    • C07D311/80Dibenzopyrans; Hydrogenated dibenzopyrans
    • C07D311/82Xanthenes
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D311/00Heterocyclic compounds containing six-membered rings having one oxygen atom as the only hetero atom, condensed with other rings
    • C07D311/02Heterocyclic compounds containing six-membered rings having one oxygen atom as the only hetero atom, condensed with other rings ortho- or peri-condensed with carbocyclic rings or ring systems
    • C07D311/78Ring systems having three or more relevant rings
    • C07D311/92Naphthopyrans; Hydrogenated naphthopyrans
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10Esters
    • C08F20/26Esters containing oxygen in addition to the carboxy oxygen
    • C08F20/30Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • G03F7/0226Quinonediazides characterised by the non-macromolecular additives
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • G03F7/023Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0757Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G03F7/0758Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/094Multilayer resist systems, e.g. planarising layers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
SG11201709209UA 2015-07-23 2016-07-21 Novel (meth)acryloyl compound and method for producing same SG11201709209UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015145643 2015-07-23
PCT/JP2016/071448 WO2017014285A1 (en) 2015-07-23 2016-07-21 New (meth)acryloyl compound and production method for same

Publications (1)

Publication Number Publication Date
SG11201709209UA true SG11201709209UA (en) 2017-12-28

Family

ID=57834389

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201709209UA SG11201709209UA (en) 2015-07-23 2016-07-21 Novel (meth)acryloyl compound and method for producing same

Country Status (8)

Country Link
US (1) US10723690B2 (en)
EP (1) EP3326997A4 (en)
JP (1) JP6853957B2 (en)
KR (1) KR20180034427A (en)
CN (1) CN107848946A (en)
SG (1) SG11201709209UA (en)
TW (1) TW201718445A (en)
WO (1) WO2017014285A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190034213A (en) * 2016-07-21 2019-04-01 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 COMPOSITIONS, RESINS, COMPOSITIONS
KR20190034149A (en) * 2016-07-21 2019-04-01 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 COMPOSITIONS, RESINS AND COMPOSITIONS, AND RESIST PATTERN FORMING METHOD
KR102511277B1 (en) * 2017-01-13 2023-03-17 닛산 가가쿠 가부시키가이샤 Resist underlayer film forming composition containing an amide solvent
KR20190124716A (en) * 2017-02-28 2019-11-05 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 Method for Purifying Compound or Resin and Method for Preparing Composition
JP2018154600A (en) * 2017-03-21 2018-10-04 三菱瓦斯化学株式会社 Compound, resin, composition, patterning method, and purifying method
KR20210047822A (en) * 2018-08-24 2021-04-30 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 Compound, and composition containing the same, and a method of forming a resist pattern and a method of forming an insulating film

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DE3071155D1 (en) * 1979-12-22 1985-11-07 Ciba Geigy Ag Compositions containing acrylate and their polymerisation
US4387204A (en) 1980-04-11 1983-06-07 Ciba-Geigy Corporation Self-crosslinkable monomer composition containing alkenylphenyl substituted acrylates or methacrylates
US4320144A (en) * 1981-04-03 1982-03-16 Gaf Corporation Fungicidal use of diphenyl esters of alkylenes
JPS62191850A (en) * 1986-02-17 1987-08-22 Nec Corp Positive resist material
JP3892926B2 (en) 1996-01-26 2007-03-14 新中村化学工業株式会社 Calixarene derivative and curable resin composition containing the same
JP3731979B2 (en) 1997-07-29 2006-01-05 新中村化学工業株式会社 Calixarene derivative and curable resin composition containing the same
JP4102033B2 (en) 2001-03-27 2008-06-18 本州化学工業株式会社 Novel (meth) acrylic acid triesters
WO2006132139A1 (en) * 2005-06-06 2006-12-14 Mitsubishi Gas Chemical Company, Inc. Compound for resist and resist composition
JP2010138393A (en) 2008-11-13 2010-06-24 Nippon Kayaku Co Ltd Energy ray-curable resin composition for optical lens sheet, and cured product thereof
JP5750231B2 (en) * 2010-03-30 2015-07-15 富士フイルム株式会社 Coating composition, optical film, polarizing plate, and image display device
CN103733136B (en) * 2011-08-12 2017-06-23 三菱瓦斯化学株式会社 Lower layer film for lithography forms material, lower layer film for lithography and pattern formation method
US9182666B2 (en) 2011-11-18 2015-11-10 Mitsubishi Gas Chemical Co., Inc. Cyclic compound, method for producing the same, radiation-sensitive composition, and resist pattern formation method
KR101955951B1 (en) 2012-07-25 2019-03-08 디아이씨 가부시끼가이샤 Radically curable compound, method for producing radically curable compound, radically curable composition, cured product thereof, and composition for resist material
JP6183790B2 (en) 2013-02-08 2017-08-23 三菱瓦斯化学株式会社 Novel allyl compound and production method thereof
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Also Published As

Publication number Publication date
KR20180034427A (en) 2018-04-04
TW201718445A (en) 2017-06-01
EP3326997A1 (en) 2018-05-30
JPWO2017014285A1 (en) 2018-05-10
US10723690B2 (en) 2020-07-28
WO2017014285A1 (en) 2017-01-26
EP3326997A4 (en) 2019-04-03
JP6853957B2 (en) 2021-04-07
US20180210341A1 (en) 2018-07-26
CN107848946A (en) 2018-03-27

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