SG11201707950QA - Laser projection module - Google Patents

Laser projection module

Info

Publication number
SG11201707950QA
SG11201707950QA SG11201707950QA SG11201707950QA SG11201707950QA SG 11201707950Q A SG11201707950Q A SG 11201707950QA SG 11201707950Q A SG11201707950Q A SG 11201707950QA SG 11201707950Q A SG11201707950Q A SG 11201707950QA SG 11201707950Q A SG11201707950Q A SG 11201707950QA
Authority
SG
Singapore
Prior art keywords
projection module
laser projection
laser
module
projection
Prior art date
Application number
SG11201707950QA
Inventor
Lorito Victoria
Original Assignee
Jabil Circuit Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jabil Circuit Inc filed Critical Jabil Circuit Inc
Publication of SG11201707950QA publication Critical patent/SG11201707950QA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02315—Support members, e.g. bases or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/0232—Lead-frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/0234—Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/14—External cavity lasers
    • H01S5/141—External cavity lasers using a wavelength selective device, e.g. a grating or etalon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H01S5/0071—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for beam steering, e.g. using a mirror outside the cavity to change the beam direction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02255—Out-coupling of light using beam deflecting elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • H01S5/0425—Electrodes, e.g. characterised by the structure

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
SG11201707950QA 2015-03-27 2016-03-28 Laser projection module SG11201707950QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562139409P 2015-03-27 2015-03-27
PCT/US2016/024516 WO2016160704A1 (en) 2015-03-27 2016-03-28 Laser projection module

Publications (1)

Publication Number Publication Date
SG11201707950QA true SG11201707950QA (en) 2017-10-30

Family

ID=56975808

Family Applications (4)

Application Number Title Priority Date Filing Date
SG10201908973V SG10201908973VA (en) 2015-03-27 2016-03-25 Chip on submount module
SG11201707952UA SG11201707952UA (en) 2015-03-27 2016-03-25 Chip on submount module
SG11201707950QA SG11201707950QA (en) 2015-03-27 2016-03-28 Laser projection module
SG10201908895V SG10201908895VA (en) 2015-03-27 2016-03-28 Laser projection module

Family Applications Before (2)

Application Number Title Priority Date Filing Date
SG10201908973V SG10201908973VA (en) 2015-03-27 2016-03-25 Chip on submount module
SG11201707952UA SG11201707952UA (en) 2015-03-27 2016-03-25 Chip on submount module

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10201908895V SG10201908895VA (en) 2015-03-27 2016-03-28 Laser projection module

Country Status (8)

Country Link
US (2) US11431146B2 (en)
EP (2) EP3275057B1 (en)
JP (3) JP7433762B2 (en)
KR (2) KR102458413B1 (en)
CN (2) CN107624205B (en)
IL (2) IL254757B (en)
SG (4) SG10201908973VA (en)
WO (2) WO2016160547A1 (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014114618A1 (en) * 2014-10-08 2016-04-14 Osram Opto Semiconductors Gmbh Laser component and method for its production
DE102016106896A1 (en) 2016-04-14 2017-10-19 Osram Opto Semiconductors Gmbh Light-emitting component
DE102017124147A1 (en) * 2017-10-17 2019-04-18 Osram Opto Semiconductors Gmbh Light-emitting component
JP7080971B2 (en) 2017-11-01 2022-06-06 ヌブル インク Multi kW class blue laser system
US10763639B2 (en) * 2018-02-12 2020-09-01 Lumentum Operations Llc Emitter-on-sub-mount device
KR102111635B1 (en) * 2018-02-23 2020-05-26 주식회사 옵티맥 laser projector
EP3572769A4 (en) * 2018-02-27 2020-04-01 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Laser projection module, depth camera, and electronic device
CN108490632B (en) * 2018-03-12 2020-01-10 Oppo广东移动通信有限公司 Laser projection module, depth camera and electronic device
US20210181614A1 (en) * 2018-08-15 2021-06-17 Sony Corporation Light-emitting device and projection display apparatus
CN109412017A (en) * 2018-10-30 2019-03-01 上海索晔国际贸易有限公司 A kind of VCSEL laser device
CN112970198A (en) 2018-10-30 2021-06-15 埃赛力达加拿大有限公司 High speed switching circuit arrangement
US11264778B2 (en) 2018-11-01 2022-03-01 Excelitas Canada, Inc. Quad flat no-leads package for side emitting laser diode
JP2020113718A (en) * 2019-01-16 2020-07-27 日亜化学工業株式会社 Light-emitting device and method for manufacturing the same
US10788632B2 (en) * 2019-01-29 2020-09-29 Google Llc Device and method for coupling laser to a photonic integrated circuit
JPWO2021131171A1 (en) * 2019-12-26 2021-07-01
DE102020114371A1 (en) 2020-05-28 2021-12-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung OPTOELECTRONIC SEMICONDUCTOR COMPONENT AND METHOD FOR MANUFACTURING AN OPTOELECTRONIC SEMICONDUCTOR COMPONENT
DE102021129698A1 (en) * 2021-11-15 2023-05-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung OPTOELECTRONIC DEVICE AND METHOD FOR MANUFACTURING OPTOELECTRONIC DEVICE
WO2023229017A1 (en) * 2022-05-27 2023-11-30 京セラ株式会社 Laser device and package for mounting optical component
CN117783199B (en) * 2024-02-27 2024-05-14 中国科学院长春光学精密机械与物理研究所 Device and method for detecting linear expansion coefficient

Family Cites Families (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2910113B2 (en) * 1990-01-19 1999-06-23 ソニー株式会社 Optical integrated circuit and integrated circuit package
NL9000161A (en) * 1990-01-23 1991-08-16 Koninkl Philips Electronics Nv SEMICONDUCTOR DEVICE CONTAINING A CARRIER AND METHOD FOR MANUFACTURING THE CARRIER.
JPH0497581A (en) 1990-08-15 1992-03-30 Nec Corp Heat sink of semiconductor device
JPH06203403A (en) * 1992-10-22 1994-07-22 Matsushita Electron Corp Semiconductor laser device and optical pickup device
JPH06188516A (en) 1992-12-16 1994-07-08 Matsushita Electron Corp Semiconductor device and fabrication thereof
JPH0758414A (en) * 1993-08-17 1995-03-03 Fuji Electric Co Ltd Optical module
US5748658A (en) 1993-10-22 1998-05-05 Matsushita Electric Industrial Co., Ltd. Semiconductor laser device and optical pickup head
US5355382A (en) * 1993-11-22 1994-10-11 Xerox Corporation Composite laser array support
WO1995028735A2 (en) * 1994-04-15 1995-10-26 Philips Electronics N.V. Method of manufacturing a device whereby a support bar is provided with conductor tracks for electrically contacting a semiconductor element
KR100373801B1 (en) 1994-07-29 2003-05-09 산요 덴키 가부시키가이샤 Semiconductor Laser Apparatus and Optical Pickup Apparatus Using the Same
JP3485645B2 (en) * 1994-07-29 2004-01-13 三洋電機株式会社 Semiconductor laser device and optical pickup device using the same
US5905750A (en) * 1996-10-15 1999-05-18 Motorola, Inc. Semiconductor laser package and method of fabrication
JPH10256648A (en) * 1997-03-13 1998-09-25 Hitachi Ltd Laser diode module
JP4090512B2 (en) * 1997-04-08 2008-05-28 日本オプネクスト株式会社 Optical module
US5844257A (en) 1997-06-12 1998-12-01 Quarton, Inc. Multi-directional light emitting semiconductor device
DE19944042A1 (en) * 1999-09-14 2001-04-12 Siemens Ag Illumination unit for medical examination device
JP2001189027A (en) * 1999-12-28 2001-07-10 Pioneer Electronic Corp Package structure of hybrid optical moduel, and its manufacturing method
JP2002374027A (en) * 2001-06-14 2002-12-26 Mitsubishi Electric Corp Semiconductor laser device
KR100400081B1 (en) 2001-11-24 2003-09-29 한국전자통신연구원 Submount for opto-electronic module and packaging method using the submount
JP3866993B2 (en) * 2002-03-12 2007-01-10 シャープ株式会社 Semiconductor laser device and optical pickup using the same
JP2003309314A (en) * 2002-04-17 2003-10-31 Sony Corp Integrated optical element and its manufacturing method
JP2004022760A (en) 2002-06-14 2004-01-22 Oki Electric Ind Co Ltd Laser diode
US7692206B2 (en) * 2002-12-06 2010-04-06 Cree, Inc. Composite leadframe LED package and method of making the same
US7061025B2 (en) * 2003-03-10 2006-06-13 Mccolloch Lawrence R Optoelectronic device packaging assemblies and methods of making the same
JP2004289010A (en) * 2003-03-24 2004-10-14 Sony Corp Light emitting device
KR100568275B1 (en) * 2003-09-19 2006-04-05 삼성전기주식회사 A semiconductor laser diode having a lead frame of pcb tpye
JP4161899B2 (en) * 2003-12-22 2008-10-08 松下電工株式会社 Optical waveguide module
CN101032034A (en) * 2004-06-30 2007-09-05 克里公司 Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices
JP2006066739A (en) 2004-08-27 2006-03-09 Kyocera Corp Sub-mount and method for manufacturing same
JP2006072232A (en) * 2004-09-06 2006-03-16 Mitsubishi Electric Corp Optical transceiver module
KR101181501B1 (en) 2004-09-13 2012-09-11 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 Optical module hermetically packaged in micro-machined structures
CN1790845A (en) * 2004-12-17 2006-06-21 上海飞恩微电子有限公司 High-speed broadband photoelectric transmission TO-CAN assembly
DE102005006052A1 (en) * 2004-12-21 2006-07-06 Osram Opto Semiconductors Gmbh Lens, laser assembly and method of making a laser assembly
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
JP4165760B2 (en) * 2005-01-11 2008-10-15 ローム株式会社 Semiconductor laser device and manufacturing method thereof
US8447153B2 (en) * 2006-04-27 2013-05-21 Finisar Corporation Low inductance optical transmitter submount assembly
JP4922663B2 (en) * 2006-05-18 2012-04-25 スタンレー電気株式会社 Semiconductor optical device
JP5058549B2 (en) * 2006-10-04 2012-10-24 矢崎総業株式会社 Optical element module
JP2008198716A (en) 2007-02-09 2008-08-28 Eudyna Devices Inc Optical semiconductor device
JP5384819B2 (en) 2007-12-07 2014-01-08 日本特殊陶業株式会社 Opto-electric hybrid package, opto-electric hybrid module
JP5033688B2 (en) * 2008-03-18 2012-09-26 株式会社リコー Light source device, optical scanning device, and image forming apparatus
JP4492733B2 (en) * 2008-05-27 2010-06-30 ソニー株式会社 LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE MANUFACTURING METHOD
US20090310635A1 (en) * 2008-06-12 2009-12-17 Applied Optoelectronics, Inc. Wavelength locker and laser package including same
CN101499446B (en) * 2009-02-26 2013-10-16 光宝电子(广州)有限公司 Wire frame tablet, packaging structure and LED packaging structure
US8465172B2 (en) * 2009-12-17 2013-06-18 Phoseon Technology, Inc. Lighting module with diffractive optical element
CN104241500B (en) * 2010-02-05 2018-06-12 亿光电子工业股份有限公司 Light-emitting diode encapsulation structure and display device
MY170920A (en) * 2010-11-02 2019-09-17 Carsem M Sdn Bhd Leadframe package with recessed cavity for led
KR101192183B1 (en) 2010-11-26 2012-10-17 (주)포인트엔지니어링 LED pakage, metal submount for LED package and fabricating method thereof
CN202178295U (en) * 2011-03-02 2012-03-28 惠州科锐半导体照明有限公司 Light emitting diode packaging part
US8659889B2 (en) * 2011-05-20 2014-02-25 Apple Inc. Docking station for providing digital signage
US9449941B2 (en) * 2011-07-07 2016-09-20 Taiwan Semiconductor Manufacturing Company, Ltd. Connecting function chips to a package to form package-on-package
US8897327B2 (en) * 2012-04-16 2014-11-25 Osram Opto Semiconductors Gmbh Laser diode devices
US10439112B2 (en) * 2012-05-31 2019-10-08 Cree, Inc. Light emitter packages, systems, and methods having improved performance
CN103457150A (en) * 2012-05-31 2013-12-18 山东浪潮华光光电子股份有限公司 Fiber-coupled output semiconductor laser package structure and package method thereof
CN103883918A (en) * 2012-12-20 2014-06-25 鸿富锦精密工业（深圳）有限公司 Light-emitting diode light source device and lamp bar with same
US20140218892A1 (en) * 2013-02-05 2014-08-07 Intematix Corporation Wide emission angle led package with remote phosphor component
DE102013201931B4 (en) 2013-02-06 2022-03-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Laser component and method for its manufacture
CN103972357B (en) * 2013-02-06 2016-12-28 光宝电子(广州)有限公司 Light emission diode package member and lead frame thereof
CN103178193B (en) 2013-03-29 2016-02-17 上海大学 The encapsulating structure preventing high power LED chip from offseting and preparation technology thereof
US9300112B2 (en) * 2013-12-18 2016-03-29 Lumentum Operations Llc Packaged laser diode and method of packaging a laser diode
JP5834125B1 (en) * 2014-09-29 2015-12-16 株式会社フジクラ Optical fiber module

Also Published As

Publication number Publication date
SG10201908973VA (en) 2019-11-28
KR102471307B1 (en) 2022-11-25
JP7382458B2 (en) 2023-11-16
WO2016160704A1 (en) 2016-10-06
CN107624205A (en) 2018-01-23
US11431146B2 (en) 2022-08-30
EP3275057A4 (en) 2018-12-26
IL254763A0 (en) 2017-12-31
IL254763B (en) 2022-04-01
EP3274760A4 (en) 2018-04-04
EP3274760A1 (en) 2018-01-31
EP3275057B1 (en) 2022-05-25
CN108012573B (en) 2021-09-03
JP2018511186A (en) 2018-04-19
JP2018512745A (en) 2018-05-17
IL254757B (en) 2022-01-01
JP6930958B2 (en) 2021-09-01
KR20170130499A (en) 2017-11-28
SG10201908895VA (en) 2019-11-28
US20160285233A1 (en) 2016-09-29
SG11201707952UA (en) 2017-10-30
US20180287336A1 (en) 2018-10-04
CN107624205B (en) 2020-03-17
CN108012573A (en) 2018-05-08
WO2016160547A1 (en) 2016-10-06
KR20170136545A (en) 2017-12-11
US10944237B2 (en) 2021-03-09
JP2022133477A (en) 2022-09-13
IL254757A0 (en) 2017-12-31
EP3275057A1 (en) 2018-01-31
JP7433762B2 (en) 2024-02-20
KR102458413B1 (en) 2022-10-24

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