SG11201705578XA - Multilayer transmission line plate - Google Patents
Multilayer transmission line plateInfo
- Publication number
- SG11201705578XA SG11201705578XA SG11201705578XA SG11201705578XA SG11201705578XA SG 11201705578X A SG11201705578X A SG 11201705578XA SG 11201705578X A SG11201705578X A SG 11201705578XA SG 11201705578X A SG11201705578X A SG 11201705578XA SG 11201705578X A SG11201705578X A SG 11201705578XA
- Authority
- SG
- Singapore
- Prior art keywords
- transmission line
- line plate
- multilayer transmission
- multilayer
- plate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
- B32B17/04—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/026—Coplanar striplines [CPS]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/04—Insulators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
- H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0248—Skew reduction or using delay lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Reinforced Plastic Materials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015005188A JP6519187B2 (en) | 2015-01-14 | 2015-01-14 | Multilayer transmission line board |
JP2015199360A JP6645108B2 (en) | 2015-10-07 | 2015-10-07 | Multi-layer transmission line board |
PCT/JP2015/082732 WO2016114002A1 (en) | 2015-01-14 | 2015-11-20 | Multilayer transmission line plate |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201705578XA true SG11201705578XA (en) | 2017-08-30 |
Family
ID=56405559
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201705578XA SG11201705578XA (en) | 2015-01-14 | 2015-11-20 | Multilayer transmission line plate |
Country Status (7)
Country | Link |
---|---|
US (1) | US10506705B2 (en) |
EP (1) | EP3247183A4 (en) |
KR (1) | KR102463613B1 (en) |
CN (1) | CN107211544B (en) |
SG (1) | SG11201705578XA (en) |
TW (1) | TWI704847B (en) |
WO (1) | WO2016114002A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017034958A1 (en) * | 2015-08-21 | 2017-03-02 | Corning Incorporated | Glass substrate assemblies having low dielectric properties |
WO2017122376A1 (en) | 2016-01-13 | 2017-07-20 | 日立化成株式会社 | Multilayer transmission line plate |
TWI605734B (en) * | 2016-12-21 | 2017-11-11 | 財團法人工業技術研究院 | Differential signal transmitting circuit board |
US10405418B2 (en) | 2016-12-21 | 2019-09-03 | Industrial Technology Research Institute | Differential signal transmitting circuit board |
US10542618B1 (en) * | 2018-09-13 | 2020-01-21 | International Business Machines Corporation | Printed circuit board with routing of a conductor and dielectric strands |
US11538772B2 (en) * | 2020-11-19 | 2022-12-27 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and method of manufacturing the same |
US20220240373A1 (en) * | 2021-01-26 | 2022-07-28 | Dell Products L.P. | Inhomogeneous dielectric medium high-speed stripline trace system |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3562918B2 (en) | 1996-10-22 | 2004-09-08 | 三井化学株式会社 | Process for producing pentaerythritol mercaptocarboxylate |
JP2000047003A (en) | 1998-07-31 | 2000-02-18 | Seiko Epson Corp | Production of plastic lens |
JP4426018B2 (en) | 1999-07-27 | 2010-03-03 | 三井化学株式会社 | Method for producing pentaerythritol poly (thioglycolate) |
JP4336086B2 (en) * | 2002-09-10 | 2009-09-30 | 信越石英株式会社 | Synthetic quartz glass fiber, strand, yarn and cloth |
JP4747608B2 (en) * | 2005-02-23 | 2011-08-17 | パナソニック電工株式会社 | Prepreg and laminate containing polyphenylene resin composition |
JP2009141233A (en) * | 2007-12-10 | 2009-06-25 | Hitachi Ltd | Printed board and method of manufacturing the same |
JP2009259879A (en) | 2008-04-14 | 2009-11-05 | Hitachi Ltd | Wiring board, and multilayer wiring board |
JP5578322B2 (en) * | 2009-08-25 | 2014-08-27 | 日本電気硝子株式会社 | Glass fiber, glass fiber manufacturing method and glass fiber sheet |
JP5471870B2 (en) * | 2010-06-17 | 2014-04-16 | 富士通株式会社 | Wiring board |
WO2013012053A1 (en) * | 2011-07-20 | 2013-01-24 | パナソニック株式会社 | Printed wiring board |
TW201422073A (en) * | 2012-11-22 | 2014-06-01 | Hon Hai Prec Ind Co Ltd | Circuit board |
TWI558276B (en) * | 2012-12-27 | 2016-11-11 | 鴻海精密工業股份有限公司 | Circuit board |
JP6107412B2 (en) * | 2013-05-22 | 2017-04-05 | 富士通株式会社 | Simulation method, simulation apparatus, and simulation program |
-
2015
- 2015-11-20 EP EP15877954.6A patent/EP3247183A4/en active Pending
- 2015-11-20 WO PCT/JP2015/082732 patent/WO2016114002A1/en active Application Filing
- 2015-11-20 SG SG11201705578XA patent/SG11201705578XA/en unknown
- 2015-11-20 KR KR1020177019156A patent/KR102463613B1/en active IP Right Grant
- 2015-11-20 US US15/542,722 patent/US10506705B2/en not_active Expired - Fee Related
- 2015-11-20 CN CN201580072770.XA patent/CN107211544B/en active Active
- 2015-11-25 TW TW104139238A patent/TWI704847B/en active
Also Published As
Publication number | Publication date |
---|---|
CN107211544A (en) | 2017-09-26 |
TW201633859A (en) | 2016-09-16 |
KR20170103813A (en) | 2017-09-13 |
TWI704847B (en) | 2020-09-11 |
WO2016114002A1 (en) | 2016-07-21 |
EP3247183A1 (en) | 2017-11-22 |
EP3247183A4 (en) | 2018-09-12 |
US20180139837A1 (en) | 2018-05-17 |
US10506705B2 (en) | 2019-12-10 |
CN107211544B (en) | 2020-06-26 |
KR102463613B1 (en) | 2022-11-03 |
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