SG11201702921XA - Dynamic binning for diversification and defect discovery - Google Patents

Dynamic binning for diversification and defect discovery

Info

Publication number
SG11201702921XA
SG11201702921XA SG11201702921XA SG11201702921XA SG11201702921XA SG 11201702921X A SG11201702921X A SG 11201702921XA SG 11201702921X A SG11201702921X A SG 11201702921XA SG 11201702921X A SG11201702921X A SG 11201702921XA SG 11201702921X A SG11201702921X A SG 11201702921XA
Authority
SG
Singapore
Prior art keywords
diversification
defect discovery
dynamic binning
binning
dynamic
Prior art date
Application number
SG11201702921XA
Other languages
English (en)
Inventor
Martin Plihal
Vidyasagar Anantha
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of SG11201702921XA publication Critical patent/SG11201702921XA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/28—Determining representative reference patterns, e.g. by averaging or distorting; Generating dictionaries
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/40—Extraction of image or video features
    • G06V10/42—Global feature extraction by analysis of the whole pattern, e.g. using frequency domain transformations or autocorrelation
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/77—Processing image or video features in feature spaces; using data integration or data reduction, e.g. principal component analysis [PCA] or independent component analysis [ICA] or self-organising maps [SOM]; Blind source separation
    • G06V10/772—Determining representative reference patterns, e.g. averaging or distorting patterns; Generating dictionaries
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
SG11201702921XA 2014-10-19 2015-10-19 Dynamic binning for diversification and defect discovery SG11201702921XA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462065752P 2014-10-19 2014-10-19
US14/614,202 US9582869B2 (en) 2014-10-19 2015-02-04 Dynamic binning for diversification and defect discovery
PCT/US2015/056169 WO2016064710A1 (en) 2014-10-19 2015-10-19 Dynamic binning for diversification and defect discovery

Publications (1)

Publication Number Publication Date
SG11201702921XA true SG11201702921XA (en) 2017-07-28

Family

ID=55749438

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201702921XA SG11201702921XA (en) 2014-10-19 2015-10-19 Dynamic binning for diversification and defect discovery

Country Status (7)

Country Link
US (1) US9582869B2 (ko)
JP (1) JP6570014B2 (ko)
KR (1) KR102226225B1 (ko)
CN (1) CN106796180B (ko)
SG (1) SG11201702921XA (ko)
TW (1) TWI648707B (ko)
WO (1) WO2016064710A1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10679909B2 (en) * 2016-11-21 2020-06-09 Kla-Tencor Corporation System, method and non-transitory computer readable medium for tuning sensitivies of, and determining a process window for, a modulated wafer
US10713534B2 (en) * 2017-09-01 2020-07-14 Kla-Tencor Corp. Training a learning based defect classifier
US11514357B2 (en) * 2018-03-19 2022-11-29 Kla-Tencor Corporation Nuisance mining for novel defect discovery
US10670536B2 (en) 2018-03-28 2020-06-02 Kla-Tencor Corp. Mode selection for inspection
US10620134B2 (en) 2018-05-11 2020-04-14 Kla-Tencor Corp. Creating defect samples for array regions
US11550309B2 (en) 2019-01-08 2023-01-10 Kla Corporation Unsupervised defect segmentation

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6265232B1 (en) 1998-08-21 2001-07-24 Micron Technology, Inc. Yield based, in-line defect sampling method
US6792366B2 (en) 2001-12-11 2004-09-14 Hitachi, Ltd. Method and apparatus for inspecting defects in a semiconductor wafer
US7739064B1 (en) * 2003-05-09 2010-06-15 Kla-Tencor Corporation Inline clustered defect reduction
JP2005109056A (ja) * 2003-09-30 2005-04-21 Matsushita Electric Ind Co Ltd 半導体素子の検査装置
US7142992B1 (en) * 2004-09-30 2006-11-28 Kla-Tencor Technologies Corp. Flexible hybrid defect classification for semiconductor manufacturing
WO2006044426A2 (en) 2004-10-12 2006-04-27 Kla-Tencor Technologies Corp. Computer-implemented methods and systems for classifying defects on a specimen
US7844100B2 (en) * 2004-11-29 2010-11-30 Applied Materials Israel, Ltd. Method for filtering nuisance defects
JP4750444B2 (ja) 2005-03-24 2011-08-17 株式会社日立ハイテクノロジーズ 外観検査方法及びその装置
US9037280B2 (en) 2005-06-06 2015-05-19 Kla-Tencor Technologies Corp. Computer-implemented methods for performing one or more defect-related functions
US7676077B2 (en) * 2005-11-18 2010-03-09 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US7570796B2 (en) * 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US7570800B2 (en) * 2005-12-14 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for binning defects detected on a specimen
US7904845B2 (en) * 2006-12-06 2011-03-08 Kla-Tencor Corp. Determining locations on a wafer to be reviewed during defect review
WO2008086282A2 (en) * 2007-01-05 2008-07-17 Kla-Tencor Corporation Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions
KR100867634B1 (ko) * 2007-03-09 2008-11-10 삼성전자주식회사 웨이퍼 시료 분석 방법
US8799831B2 (en) 2007-05-24 2014-08-05 Applied Materials, Inc. Inline defect analysis for sampling and SPC
US8135204B1 (en) * 2007-09-21 2012-03-13 Kla-Tencor Technologies Corp. Computer-implemented methods, carrier media, and systems for creating a defect sample for use in selecting one or more parameters of an inspection recipe
US8223327B2 (en) * 2009-01-26 2012-07-17 Kla-Tencor Corp. Systems and methods for detecting defects on a wafer
US8315453B2 (en) * 2010-07-27 2012-11-20 Applied Materials Israel, Ltd. Defect classification with optimized purity
US9053390B2 (en) * 2012-08-14 2015-06-09 Kla-Tencor Corporation Automated inspection scenario generation
US8948494B2 (en) 2012-11-12 2015-02-03 Kla-Tencor Corp. Unbiased wafer defect samples
US9310320B2 (en) * 2013-04-15 2016-04-12 Kla-Tencor Corp. Based sampling and binning for yield critical defects

Also Published As

Publication number Publication date
KR20170088849A (ko) 2017-08-02
TWI648707B (zh) 2019-01-21
JP2017536708A (ja) 2017-12-07
TW201626328A (zh) 2016-07-16
CN106796180B (zh) 2019-07-26
US9582869B2 (en) 2017-02-28
WO2016064710A1 (en) 2016-04-28
KR102226225B1 (ko) 2021-03-09
CN106796180A (zh) 2017-05-31
US20160110857A1 (en) 2016-04-21
JP6570014B2 (ja) 2019-09-04

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