SG11201702727SA - Automated decision-based energy-dispersive x-ray methodology and apparatus - Google Patents
Automated decision-based energy-dispersive x-ray methodology and apparatusInfo
- Publication number
- SG11201702727SA SG11201702727SA SG11201702727SA SG11201702727SA SG11201702727SA SG 11201702727S A SG11201702727S A SG 11201702727SA SG 11201702727S A SG11201702727S A SG 11201702727SA SG 11201702727S A SG11201702727S A SG 11201702727SA SG 11201702727S A SG11201702727S A SG 11201702727SA
- Authority
- SG
- Singapore
- Prior art keywords
- dispersive
- based energy
- automated decision
- methodology
- ray
- Prior art date
Links
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
- G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
- G01N23/2252—Measuring emitted X-rays, e.g. electron probe microanalysis [EPMA]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
- G01N23/083—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption the radiation being X-rays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/07—Investigating materials by wave or particle radiation secondary emission
- G01N2223/079—Investigating materials by wave or particle radiation secondary emission incident electron beam and measuring excited X-rays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/22—Treatment of data
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/28—Scanning microscopes
- H01J2237/2803—Scanning microscopes characterised by the imaging method
- H01J2237/2806—Secondary charged particle
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/28—Scanning microscopes
- H01J2237/2803—Scanning microscopes characterised by the imaging method
- H01J2237/2807—X-rays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/28—Scanning microscopes
- H01J2237/2813—Scanning microscopes characterised by the application
- H01J2237/2817—Pattern inspection
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Toxicology (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462069048P | 2014-10-27 | 2014-10-27 | |
| US201562159180P | 2015-05-08 | 2015-05-08 | |
| US201562171698P | 2015-06-05 | 2015-06-05 | |
| IN3080CH2015 | 2015-06-19 | ||
| US201562204325P | 2015-08-12 | 2015-08-12 | |
| US14/919,563 US9696268B2 (en) | 2014-10-27 | 2015-10-21 | Automated decision-based energy-dispersive x-ray methodology and apparatus |
| PCT/US2015/057455 WO2016069523A1 (en) | 2014-10-27 | 2015-10-27 | Automated decision-based energy-dispersive x-ray methodology and apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201702727SA true SG11201702727SA (en) | 2017-05-30 |
Family
ID=55791780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201702727SA SG11201702727SA (en) | 2014-10-27 | 2015-10-27 | Automated decision-based energy-dispersive x-ray methodology and apparatus |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9696268B2 (en) |
| JP (1) | JP6814733B2 (en) |
| KR (1) | KR102219788B1 (en) |
| CN (2) | CN111982953A (en) |
| DE (1) | DE112015004853T5 (en) |
| SG (1) | SG11201702727SA (en) |
| TW (1) | TWI656340B (en) |
| WO (1) | WO2016069523A1 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9778215B2 (en) * | 2012-10-26 | 2017-10-03 | Fei Company | Automated mineral classification |
| US9696268B2 (en) * | 2014-10-27 | 2017-07-04 | Kla-Tencor Corporation | Automated decision-based energy-dispersive x-ray methodology and apparatus |
| KR102409943B1 (en) * | 2017-11-29 | 2022-06-16 | 삼성전자주식회사 | Method of detecting a defect and apparatus for performing the same |
| JP6679049B2 (en) * | 2018-09-28 | 2020-04-15 | 株式会社リガク | Measuring device, program, and control method of measuring device |
| US10928336B1 (en) * | 2019-07-29 | 2021-02-23 | Applied Materials Israel Ltd. | X-ray based evaluation of a status of a structure of a substrate |
| DE102019126200A1 (en) * | 2019-09-27 | 2021-04-01 | Carl Zeiss Microscopy Gmbh | EDX process |
| KR20220062635A (en) * | 2019-10-18 | 2022-05-17 | 주식회사 히타치하이테크 | Inspection system, and non-transitory computer-readable medium |
| EP3995808B1 (en) * | 2020-11-09 | 2023-01-04 | Siltronic AG | Method for classifying unknown particles on a surface of a semiconductor wafer |
| CN114723650A (en) * | 2020-12-21 | 2022-07-08 | 东方晶源微电子科技（北京）有限公司 | Wafer defect detection method and device, equipment and storage medium |
| CN116130377B (en) * | 2023-04-17 | 2023-09-29 | 西安奕斯伟材料科技股份有限公司 | Method, device and system for detecting defects of epitaxial wafer and manufacturing method thereof |
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| JP2922940B2 (en) | 1989-11-22 | 1999-07-26 | 株式会社日立製作所 | Energy dispersive X-ray analyzer |
| US5263075A (en) | 1992-01-13 | 1993-11-16 | Ion Track Instruments, Inc. | High angular resolution x-ray collimator |
| US5649169A (en) * | 1995-06-20 | 1997-07-15 | Advanced Micro Devices, Inc. | Method and system for declustering semiconductor defect data |
| US5656812A (en) * | 1995-07-21 | 1997-08-12 | Jeol Ltd. | Electron probe microanalyzer and X-ray analysis using same |
| US6259960B1 (en) * | 1996-11-01 | 2001-07-10 | Joel Ltd. | Part-inspecting system |
| JP3500264B2 (en) | 1997-01-29 | 2004-02-23 | 株式会社日立製作所 | Sample analyzer |
| JP3101257B2 (en) * | 1998-01-30 | 2000-10-23 | 理学電機工業株式会社 | Method for inspecting sample surface and X-ray analyzer using the same |
| US6442233B1 (en) | 1998-06-18 | 2002-08-27 | American Science And Engineering, Inc. | Coherent x-ray scatter inspection system with sidescatter and energy-resolved detection |
| US6479818B1 (en) | 1998-09-17 | 2002-11-12 | Thermo Noran Inc. | Application of x-ray optics to energy dispersive spectroscopy |
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| JP4312910B2 (en) * | 1999-12-02 | 2009-08-12 | 株式会社日立製作所 | Review SEM |
| US6528818B1 (en) | 1999-12-14 | 2003-03-04 | Kla-Tencor | Test structures and methods for inspection of semiconductor integrated circuits |
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| JP3804757B2 (en) | 2000-09-05 | 2006-08-02 | 株式会社日立製作所 | Micropart analyzer and analysis method |
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| JP4178741B2 (en) | 2000-11-02 | 2008-11-12 | 株式会社日立製作所 | Charged particle beam apparatus and sample preparation apparatus |
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| JP6355318B2 (en) | 2012-11-15 | 2018-07-11 | 株式会社日立ハイテクサイエンス | Cross-section processing observation method and apparatus |
| TW201430336A (en) * | 2013-01-23 | 2014-08-01 | Huang Tian Xing | Defect detection method, device and system |
| JP5948262B2 (en) * | 2013-01-30 | 2016-07-06 | 株式会社日立ハイテクノロジーズ | Defect observation method and defect observation apparatus |
| KR102026936B1 (en) * | 2013-03-26 | 2019-10-01 | 삼성디스플레이 주식회사 | Inspection system using scanning electron microscope |
| JP6328456B2 (en) | 2014-03-20 | 2018-05-23 | 株式会社日立ハイテクサイエンス | Energy dispersive X-ray analyzer and energy dispersive X-ray analysis method |
| JP2015216285A (en) * | 2014-05-13 | 2015-12-03 | 株式会社日立ハイテクノロジーズ | Defect analytical method |
| US9218940B1 (en) * | 2014-05-30 | 2015-12-22 | Fei Company | Method and apparatus for slice and view sample imaging |
| US9696268B2 (en) * | 2014-10-27 | 2017-07-04 | Kla-Tencor Corporation | Automated decision-based energy-dispersive x-ray methodology and apparatus |
-
2015
- 2015-10-21 US US14/919,563 patent/US9696268B2/en active Active
- 2015-10-22 TW TW104134805A patent/TWI656340B/en active
- 2015-10-27 DE DE112015004853.7T patent/DE112015004853T5/en not_active Ceased
- 2015-10-27 CN CN202010883345.1A patent/CN111982953A/en active Pending
- 2015-10-27 CN CN201580055501.2A patent/CN106796188A/en active Pending
- 2015-10-27 JP JP2017521139A patent/JP6814733B2/en active Active
- 2015-10-27 KR KR1020177014282A patent/KR102219788B1/en active IP Right Grant
- 2015-10-27 WO PCT/US2015/057455 patent/WO2016069523A1/en active Application Filing
- 2015-10-27 SG SG11201702727SA patent/SG11201702727SA/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TWI656340B (en) | 2019-04-11 |
| US20160116425A1 (en) | 2016-04-28 |
| TW201627659A (en) | 2016-08-01 |
| JP6814733B2 (en) | 2021-01-20 |
| KR102219788B1 (en) | 2021-02-23 |
| CN111982953A (en) | 2020-11-24 |
| DE112015004853T5 (en) | 2017-07-13 |
| US9696268B2 (en) | 2017-07-04 |
| CN106796188A (en) | 2017-05-31 |
| JP2017532564A (en) | 2017-11-02 |
| WO2016069523A1 (en) | 2016-05-06 |
| KR20170077184A (en) | 2017-07-05 |
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