SG11201702725WA - Defect detection using structural information - Google Patents
Defect detection using structural informationInfo
- Publication number
- SG11201702725WA SG11201702725WA SG11201702725WA SG11201702725WA SG11201702725WA SG 11201702725W A SG11201702725W A SG 11201702725WA SG 11201702725W A SG11201702725W A SG 11201702725WA SG 11201702725W A SG11201702725W A SG 11201702725WA SG 11201702725W A SG11201702725W A SG 11201702725WA
- Authority
- SG
- Singapore
- Prior art keywords
- defect detection
- structural information
- structural
- information
- defect
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/401—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for measuring, e.g. calibration and initialisation, measuring workpiece for machining purposes
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/37—Measurements
- G05B2219/37365—Surface shape, gradient
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/37—Measurements
- G05B2219/37571—Camera detecting reflected light from laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/22—Treatment of data
- H01J2237/221—Image processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/28—Scanning microscopes
- H01J2237/2813—Scanning microscopes characterised by the application
- H01J2237/2817—Pattern inspection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462063841P | 2014-10-14 | 2014-10-14 | |
| US14/880,187 US9727047B2 (en) | 2014-10-14 | 2015-10-09 | Defect detection using structural information |
| PCT/US2015/055295 WO2016061080A1 (en) | 2014-10-14 | 2015-10-13 | Defect detection using structural information |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201702725WA true SG11201702725WA (en) | 2017-04-27 |
Family
ID=55655939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201702725WA SG11201702725WA (en) | 2014-10-14 | 2015-10-13 | Defect detection using structural information |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US9727047B2 (en) |
| JP (1) | JP6617143B2 (en) |
| KR (1) | KR102276921B1 (en) |
| CN (1) | CN107111294B (en) |
| DE (1) | DE112015004721B4 (en) |
| IL (1) | IL250088B (en) |
| SG (1) | SG11201702725WA (en) |
| TW (1) | TWI643280B (en) |
| WO (1) | WO2016061080A1 (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017027748A1 (en) * | 2015-08-12 | 2017-02-16 | Kla-Tencor Corporation | Determining a position of a defect in an electron beam image |
| US10043265B2 (en) * | 2016-03-17 | 2018-08-07 | Kla-Tencor Corporation | System, method and computer program product for identifying fabricated component defects using a local adaptive threshold |
| US10275872B2 (en) * | 2017-08-24 | 2019-04-30 | Applied Materials Israel Ltd. | Method of detecting repeating defects and system thereof |
| US10290087B2 (en) * | 2017-09-11 | 2019-05-14 | Applied Materials Israel Ltd. | Method of generating an examination recipe and system thereof |
| US11195268B2 (en) | 2018-05-22 | 2021-12-07 | Kla-Tencor Corporation | Target selection improvements for better design alignment |
| US10698325B2 (en) * | 2018-05-23 | 2020-06-30 | Kla-Tencor Corporation | Performance monitoring of design-based alignment |
| WO2019244637A1 (en) * | 2018-06-20 | 2019-12-26 | 株式会社クボタ | Wafer inspection device and wafer inspection method |
| JP2019219295A (en) * | 2018-06-20 | 2019-12-26 | 株式会社クボタ | Wafer inspection device and wafer inspection method |
| US10832396B2 (en) * | 2018-10-19 | 2020-11-10 | Kla-Tencor Corp. | And noise based care areas |
| US11619592B2 (en) * | 2019-07-09 | 2023-04-04 | KLA Corp. | Selecting defect detection methods for inspection of a specimen |
| US11087449B2 (en) * | 2019-10-24 | 2021-08-10 | KLA Corp. | Deep learning networks for nuisance filtering |
| US11615993B2 (en) * | 2019-11-21 | 2023-03-28 | Kla Corporation | Clustering sub-care areas based on noise characteristics |
| US11127136B2 (en) * | 2019-12-05 | 2021-09-21 | Kla Corporation | System and method for defining flexible regions on a sample during inspection |
| US20220301133A1 (en) * | 2021-03-16 | 2022-09-22 | Kla Corporation | Segmentation of design care areas with a rendered design image |
| US20240120221A1 (en) * | 2022-10-03 | 2024-04-11 | Kla Corporation | Correcting target locations for temperature in semiconductor applications |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020054291A1 (en) | 1997-06-27 | 2002-05-09 | Tsai Bin-Ming Benjamin | Inspection system simultaneously utilizing monochromatic darkfield and broadband brightfield illumination sources |
| US6240208B1 (en) * | 1998-07-23 | 2001-05-29 | Cognex Corporation | Method for automatic visual identification of a reference site in an image |
| US7155052B2 (en) | 2002-06-10 | 2006-12-26 | Tokyo Seimitsu (Israel) Ltd | Method for pattern inspection |
| JP2006216611A (en) * | 2005-02-01 | 2006-08-17 | Hitachi High-Technologies Corp | Pattern inspection apparatus |
| US7526749B2 (en) * | 2005-10-31 | 2009-04-28 | Kla-Tencor Technologies Corporation | Methods and apparatus for designing and using micro-targets in overlay metrology |
| JP4616864B2 (en) | 2007-06-20 | 2011-01-19 | 株式会社日立ハイテクノロジーズ | Appearance inspection method and apparatus, and image processing evaluation system |
| US8611639B2 (en) * | 2007-07-30 | 2013-12-17 | Kla-Tencor Technologies Corp | Semiconductor device property extraction, generation, visualization, and monitoring methods |
| WO2010009930A1 (en) * | 2008-06-02 | 2010-01-28 | Asml Netherlands B.V. | Sub-wavelength segmentation in measurement targets on substrates |
| US20090309022A1 (en) * | 2008-06-12 | 2009-12-17 | Hitachi High-Technologies Corporation | Apparatus for inspecting a substrate, a method of inspecting a substrate, a scanning electron microscope, and a method of producing an image using a scanning electron microscope |
| KR101647010B1 (en) | 2008-06-19 | 2016-08-10 | 케이엘에이-텐코어 코오포레이션 | Computer-implemented methods, computer-readable media, and systems for determining one or more characteristics of a wafer |
| US8270698B2 (en) * | 2008-09-24 | 2012-09-18 | Merge Healthcare Incorporated | Anterior commissure and posterior commissure segmentation system and method |
| EP2177898A1 (en) | 2008-10-14 | 2010-04-21 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for selecting an optimized evaluation feature subset for an inspection of free-form surfaces and method for inspecting a free-form surface |
| US8775101B2 (en) | 2009-02-13 | 2014-07-08 | Kla-Tencor Corp. | Detecting defects on a wafer |
| US20100235114A1 (en) * | 2009-03-10 | 2010-09-16 | Kla-Tencor Corporation | Systems and methods for determining one or more characteristics of a specimen using radiation in the terahertz range |
| US8289508B2 (en) * | 2009-11-19 | 2012-10-16 | Globalfoundries Singapore Pte. Ltd. | Defect detection recipe definition |
| US20130082177A1 (en) * | 2010-06-07 | 2013-04-04 | Hitachi High-Technologies Corporation | Circuit pattern inspection apparatus and circuit pattern inspection method |
| US8781781B2 (en) * | 2010-07-30 | 2014-07-15 | Kla-Tencor Corp. | Dynamic care areas |
| JP5788719B2 (en) * | 2011-06-09 | 2015-10-07 | 株式会社日立ハイテクノロジーズ | Stage device and control method of stage device |
| JP5647999B2 (en) * | 2012-01-04 | 2015-01-07 | 株式会社日立ハイテクノロジーズ | Pattern matching apparatus, inspection system, and computer program |
| US8825570B2 (en) * | 2012-07-31 | 2014-09-02 | Hewlett-Packard Development Company, L.P. | Active learning with per-case symmetrical importance scores |
| US9310316B2 (en) | 2012-09-11 | 2016-04-12 | Kla-Tencor Corp. | Selecting parameters for defect detection methods |
| US9311698B2 (en) * | 2013-01-09 | 2016-04-12 | Kla-Tencor Corp. | Detecting defects on a wafer using template image matching |
| US9619876B2 (en) | 2013-03-12 | 2017-04-11 | Kla-Tencor Corp. | Detecting defects on wafers based on 2D scatter plots of values determined for output generated using different optics modes |
| US9123583B2 (en) * | 2013-07-12 | 2015-09-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Overlay abnormality gating by Z data |
| US9401016B2 (en) | 2014-05-12 | 2016-07-26 | Kla-Tencor Corp. | Using high resolution full die image data for inspection |
-
2015
- 2015-10-09 US US14/880,187 patent/US9727047B2/en active Active
- 2015-10-13 CN CN201580055325.2A patent/CN107111294B/en active Active
- 2015-10-13 WO PCT/US2015/055295 patent/WO2016061080A1/en active Application Filing
- 2015-10-13 JP JP2017519503A patent/JP6617143B2/en active Active
- 2015-10-13 KR KR1020177012934A patent/KR102276921B1/en active IP Right Grant
- 2015-10-13 DE DE112015004721.2T patent/DE112015004721B4/en active Active
- 2015-10-13 SG SG11201702725WA patent/SG11201702725WA/en unknown
- 2015-10-14 TW TW104133740A patent/TWI643280B/en active
-
2017
- 2017-01-12 IL IL250088A patent/IL250088B/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| US20160104600A1 (en) | 2016-04-14 |
| KR102276921B1 (en) | 2021-07-12 |
| JP6617143B2 (en) | 2019-12-11 |
| DE112015004721T5 (en) | 2017-07-06 |
| KR20170067876A (en) | 2017-06-16 |
| IL250088B (en) | 2020-07-30 |
| TWI643280B (en) | 2018-12-01 |
| JP2017539076A (en) | 2017-12-28 |
| US9727047B2 (en) | 2017-08-08 |
| CN107111294A (en) | 2017-08-29 |
| DE112015004721B4 (en) | 2023-09-21 |
| IL250088A0 (en) | 2017-03-30 |
| WO2016061080A1 (en) | 2016-04-21 |
| TW201630092A (en) | 2016-08-16 |
| CN107111294B (en) | 2018-12-11 |
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