SG11201608445VA - Methods to form and to dismantle hermetically sealed chambers - Google Patents
Methods to form and to dismantle hermetically sealed chambersInfo
- Publication number
- SG11201608445VA SG11201608445VA SG11201608445VA SG11201608445VA SG11201608445VA SG 11201608445V A SG11201608445V A SG 11201608445VA SG 11201608445V A SG11201608445V A SG 11201608445VA SG 11201608445V A SG11201608445V A SG 11201608445VA SG 11201608445V A SG11201608445V A SG 11201608445VA
- Authority
- SG
- Singapore
- Prior art keywords
- dismantle
- methods
- hermetically sealed
- sealed chambers
- chambers
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/50273—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the means or forces applied to move the fluids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0076—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised in that the layers are not bonded on the totality of their surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0036—Heat treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/06—Fluid handling related problems
- B01L2200/0689—Sealing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/08—Geometry, shape and general structure
- B01L2300/0809—Geometry, shape and general structure rectangular shaped
- B01L2300/0816—Cards, e.g. flat sample carriers usually with flow in two horizontal directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/08—Geometry, shape and general structure
- B01L2300/0887—Laminated structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2400/00—Moving or stopping fluids
- B01L2400/04—Moving fluids with specific forces or mechanical means
- B01L2400/0475—Moving fluids with specific forces or mechanical means specific mechanical means and fluid pressure
- B01L2400/0481—Moving fluids with specific forces or mechanical means specific mechanical means and fluid pressure squeezing of channels or chambers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B2037/0092—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding in which absence of adhesives is explicitly presented as an advantage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
- B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
- B32B2310/0843—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2439/00—Containers; Receptacles
- B32B2439/80—Medical packaging
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2535/00—Medical equipment, e.g. bandage, prostheses, catheter
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
- Y10T156/1195—Delaminating from release surface
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1961—Severing delaminating means [e.g., chisel, etc.]
- Y10T156/1967—Cutting delaminating means
- Y10T156/1972—Shearing delaminating means
Landscapes
- Thermal Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Hematology (AREA)
- Clinical Laboratory Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Micromachines (AREA)
- Laser Beam Processing (AREA)
- Control And Other Processes For Unpacking Of Materials (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Measurement Of Radiation (AREA)
- Golf Clubs (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/270,265 US9440424B2 (en) | 2014-05-05 | 2014-05-05 | Methods to form and to dismantle hermetically sealed chambers |
PCT/US2015/024776 WO2015171236A1 (en) | 2014-05-05 | 2015-04-07 | Methods to form and to dismantle hermetically sealed chambers |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201608445VA true SG11201608445VA (en) | 2016-11-29 |
Family
ID=54354590
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201608445VA SG11201608445VA (en) | 2014-05-05 | 2015-04-07 | Methods to form and to dismantle hermetically sealed chambers |
Country Status (7)
Country | Link |
---|---|
US (3) | US9440424B2 (en) |
EP (1) | EP3140099A4 (en) |
JP (2) | JP6634030B2 (en) |
KR (1) | KR102426761B1 (en) |
CN (2) | CN106232326B (en) |
SG (1) | SG11201608445VA (en) |
WO (1) | WO2015171236A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060287602A1 (en) * | 2005-06-21 | 2006-12-21 | Cardiomems, Inc. | Implantable wireless sensor for in vivo pressure measurement |
JP6953679B2 (en) | 2016-03-30 | 2021-10-27 | ソニーグループ株式会社 | Sample sorting kit, sample sorting device |
CN109563726A (en) | 2016-06-03 | 2019-04-02 | 康宁股份有限公司 | Method and apparatus for vacuum heat-insulation pane |
GB201704769D0 (en) | 2017-01-03 | 2017-05-10 | Illumina Inc | Flowcell cartridge with floating seal bracket |
USD849265S1 (en) * | 2017-04-21 | 2019-05-21 | Precision Nanosystems Inc | Microfluidic chip |
KR102481474B1 (en) | 2018-01-10 | 2022-12-26 | 삼성전자 주식회사 | LASER bonding apparatus, method of bonding semiconductor device, and method of fabricating semiconductor package |
CN115350733B (en) * | 2022-07-13 | 2023-12-22 | 中国科学院上海微系统与信息技术研究所 | Microfluidic chip with single-layer inclined structure liquid drop storage cavity and preparation method thereof |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
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US2532014A (en) | 1949-06-18 | 1950-11-28 | American Seating Co | Apparatus for heating canned foods |
US2825963A (en) | 1956-11-16 | 1958-03-11 | Charles J Sykes | Can opener |
US3737624A (en) | 1970-09-16 | 1973-06-05 | Progressive Products Co | Electric grill with a thin-film heating element |
US4227473A (en) * | 1979-03-08 | 1980-10-14 | Young Claude A | Can edge riding can opener |
DE4113714A1 (en) * | 1991-04-26 | 1992-10-29 | Hoechst Ag | DRAWN PACKAGING WITH INTEGRATED TARGET BREAKAGE POINTS AND METHOD FOR THEIR PRODUCTION |
US6709869B2 (en) * | 1995-12-18 | 2004-03-23 | Tecan Trading Ag | Devices and methods for using centripetal acceleration to drive fluid movement in a microfluidics system |
US6071795A (en) | 1998-01-23 | 2000-06-06 | The Regents Of The University Of California | Separation of thin films from transparent substrates by selective optical processing |
US6890093B2 (en) * | 2000-08-07 | 2005-05-10 | Nanostream, Inc. | Multi-stream microfludic mixers |
US6496248B2 (en) * | 2000-12-15 | 2002-12-17 | Nikon Corporation | Stage device and exposure apparatus and method |
US7318912B2 (en) | 2001-06-07 | 2008-01-15 | Nanostream, Inc. | Microfluidic systems and methods for combining discrete fluid volumes |
NL1020034C2 (en) | 2002-02-21 | 2003-08-25 | Corus Staal Bv | Packaging and method for providing a filled package. |
US7122153B2 (en) | 2003-01-08 | 2006-10-17 | Ho Winston Z | Self-contained microfluidic biochip and apparatus |
US7785533B2 (en) * | 2003-09-12 | 2010-08-31 | Nec Corporation | Chip, device using the chip, and method of using the same |
JP2007217060A (en) * | 2006-01-17 | 2007-08-30 | Assay Corp | Receptacle, microtube, receptacle manufacturing method and test or inspection method |
KR100958557B1 (en) * | 2006-06-26 | 2010-05-18 | 도쿄엘렉트론가부시키가이샤 | Substrate processing method and substrate processing apparatus |
US8335050B2 (en) * | 2007-04-03 | 2012-12-18 | Hitachi Global Storage Technologies, Netherlands B.V. | Disk drive with a solder preform hermetic seal |
JP5064941B2 (en) * | 2007-09-03 | 2012-10-31 | 麒麟麦酒株式会社 | Attaching the plastic cap |
CN101527552B (en) * | 2008-03-07 | 2011-12-07 | 中国科学院声学研究所 | Device of packaging structure of love wave sensor |
KR20110087265A (en) * | 2008-11-26 | 2011-08-02 | 아사히 가라스 가부시키가이샤 | Glass member having sealing/bonding material layer, electronic device using same, and manufacturing method thereof |
RU2013107367A (en) * | 2010-07-26 | 2014-09-10 | Эленза, Инк. | SEALED IMPLANTED EYE DEVICES AND METHODS FOR THEIR MANUFACTURE |
JP5835945B2 (en) * | 2010-08-11 | 2015-12-24 | 株式会社日立製作所 | Laser bonding method |
CN102319956B (en) * | 2011-08-16 | 2015-04-22 | 北京博晖创新光电技术股份有限公司 | Method for welding substrate and diaphragm of diaphragm-moving polymer microfluidic chip |
US8894946B2 (en) * | 2011-10-21 | 2014-11-25 | Integenx Inc. | Sample preparation, processing and analysis systems |
US9492990B2 (en) * | 2011-11-08 | 2016-11-15 | Picosys Incorporated | Room temperature glass-to-glass, glass-to-plastic and glass-to-ceramic/semiconductor bonding |
JP6024152B2 (en) * | 2012-03-29 | 2016-11-09 | 東洋製罐株式会社 | Sealing method of container and lid by laser welding |
JP2013203054A (en) * | 2012-03-29 | 2013-10-07 | Sumitomo Chemical Co Ltd | Method for manufacturing hollow molded body, and hollow molded body |
US20150107752A1 (en) | 2012-04-26 | 2015-04-23 | Alere San Diego, Inc. | Laser joining device |
US9441416B2 (en) | 2012-09-27 | 2016-09-13 | Guardian Industries Corp. | Low temperature hermetic sealing via laser |
US8846416B1 (en) * | 2013-03-13 | 2014-09-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for forming biochips and biochips with non-organic landings for improved thermal budget |
CN103272657A (en) * | 2013-05-27 | 2013-09-04 | 苏州扬清芯片科技有限公司 | Liquid storage method of micro-fluidic chip |
-
2014
- 2014-05-05 US US14/270,265 patent/US9440424B2/en active Active
-
2015
- 2015-04-07 JP JP2016566631A patent/JP6634030B2/en not_active Expired - Fee Related
- 2015-04-07 KR KR1020167032343A patent/KR102426761B1/en active IP Right Grant
- 2015-04-07 WO PCT/US2015/024776 patent/WO2015171236A1/en active Application Filing
- 2015-04-07 CN CN201580020575.2A patent/CN106232326B/en active Active
- 2015-04-07 SG SG11201608445VA patent/SG11201608445VA/en unknown
- 2015-04-07 CN CN201811267836.2A patent/CN109383034B/en active Active
- 2015-04-07 EP EP15789584.8A patent/EP3140099A4/en not_active Withdrawn
-
2016
- 2016-08-16 US US15/237,965 patent/US10005271B2/en active Active
- 2016-08-16 US US15/237,953 patent/US9809019B2/en active Active
-
2019
- 2019-12-13 JP JP2019225432A patent/JP2020075767A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US9809019B2 (en) | 2017-11-07 |
JP2020075767A (en) | 2020-05-21 |
US20150314585A1 (en) | 2015-11-05 |
US9440424B2 (en) | 2016-09-13 |
US10005271B2 (en) | 2018-06-26 |
US20160368258A1 (en) | 2016-12-22 |
US20160354778A1 (en) | 2016-12-08 |
CN109383034A (en) | 2019-02-26 |
KR20170003933A (en) | 2017-01-10 |
CN106232326A (en) | 2016-12-14 |
KR102426761B1 (en) | 2022-07-28 |
CN109383034B (en) | 2021-08-10 |
EP3140099A1 (en) | 2017-03-15 |
CN106232326B (en) | 2018-11-27 |
EP3140099A4 (en) | 2017-11-15 |
JP6634030B2 (en) | 2020-01-22 |
JP2017515683A (en) | 2017-06-15 |
WO2015171236A1 (en) | 2015-11-12 |
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