SG11201608097VA - Elevating mechanism and socket for electrical component - Google Patents
Elevating mechanism and socket for electrical componentInfo
- Publication number
- SG11201608097VA SG11201608097VA SG11201608097VA SG11201608097VA SG11201608097VA SG 11201608097V A SG11201608097V A SG 11201608097VA SG 11201608097V A SG11201608097V A SG 11201608097VA SG 11201608097V A SG11201608097V A SG 11201608097VA SG 11201608097V A SG11201608097V A SG 11201608097VA
- Authority
- SG
- Singapore
- Prior art keywords
- socket
- electrical component
- elevating mechanism
- elevating
- electrical
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
- H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
- H01R33/7664—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket having additional guiding, adapting, shielding, anti-vibration or mounting means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/629—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances
- H01R13/62905—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances comprising a camming member
- H01R13/62922—Pair of camming plates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/629—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances
- H01R13/62977—Pivoting levers actuating linearly camming means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/639—Additional means for holding or locking coupling parts together, after engagement, e.g. separate keylock, retainer strap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Connecting Device With Holders (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014071608A JP6251104B2 (en) | 2014-03-31 | 2014-03-31 | Elevating mechanism and socket for electrical parts |
PCT/JP2015/059573 WO2015152033A1 (en) | 2014-03-31 | 2015-03-27 | Vertical-motion mechanism and socket for electrical component |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201608097VA true SG11201608097VA (en) | 2016-11-29 |
Family
ID=54240359
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201608097VA SG11201608097VA (en) | 2014-03-31 | 2015-03-27 | Elevating mechanism and socket for electrical component |
Country Status (6)
Country | Link |
---|---|
US (1) | US9755387B2 (en) |
JP (1) | JP6251104B2 (en) |
CN (1) | CN106165215B (en) |
SG (1) | SG11201608097VA (en) |
TW (1) | TWI632749B (en) |
WO (1) | WO2015152033A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD788722S1 (en) * | 2014-07-17 | 2017-06-06 | Advantest Corporation | Socket for an electronic device testing apparatus |
JP6698426B2 (en) * | 2016-05-20 | 2020-05-27 | 株式会社エンプラス | Socket for electrical parts |
JP6744173B2 (en) * | 2016-08-09 | 2020-08-19 | 株式会社エンプラス | Socket for electrical parts |
JP7018310B2 (en) * | 2017-12-27 | 2022-02-10 | 株式会社エンプラス | Socket for electrical components |
JP7057499B2 (en) * | 2018-05-08 | 2022-04-20 | 山一電機株式会社 | Inspection socket |
CN109301552B (en) * | 2018-10-19 | 2020-06-02 | 绵阳鹏志远科技有限公司 | Hidden electric shock prevention socket and plug with dustproof and waterproof functions |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5256080A (en) | 1992-06-12 | 1993-10-26 | The Whitaker Corporation | Bail actuated ZIF socket |
JPH08162239A (en) * | 1994-12-02 | 1996-06-21 | Texas Instr Japan Ltd | Socket |
US5647756A (en) * | 1995-12-19 | 1997-07-15 | Minnesota Mining And Manufacturing | Integrated circuit test socket having toggle clamp lid |
US6137298A (en) * | 1997-12-05 | 2000-10-24 | Compaq Computer Corporation | Method and apparatus for clamping land grid array integrated circuit devices |
US6086387A (en) * | 1998-05-14 | 2000-07-11 | International Business Machines Corporation | Cover assembly for a socket adaptable to IC modules of varying thickness used for burn-in testing |
JP3562405B2 (en) * | 1999-10-21 | 2004-09-08 | 住友電装株式会社 | Lever type connector |
JP3683476B2 (en) * | 2000-06-19 | 2005-08-17 | 株式会社エンプラス | Socket for electrical parts and method for assembling the same |
JP2003168532A (en) * | 2001-11-29 | 2003-06-13 | Texas Instr Japan Ltd | Semiconductor device socket and installation method of semiconductor device on socket |
JP3803099B2 (en) * | 2002-12-17 | 2006-08-02 | 山一電機株式会社 | Socket for semiconductor device |
JP3716843B2 (en) * | 2003-07-15 | 2005-11-16 | 株式会社エンプラス | Socket for electrical parts |
US6881088B2 (en) * | 2003-07-29 | 2005-04-19 | Hon Hai Precision Ind. Co., Ltd. | Connector assembly with actuation system |
US7161805B2 (en) * | 2003-10-21 | 2007-01-09 | Hon Hai Precision Ind. Co., Ltd. | Latch means for socket connector assembly |
US7101209B2 (en) * | 2004-01-26 | 2006-09-05 | Gold Technologies, Inc. | Test socket |
KR100675343B1 (en) * | 2004-12-20 | 2007-01-29 | 황동원 | Socket for integrated circuit used in test and burn-in |
JP2006252946A (en) | 2005-03-10 | 2006-09-21 | Yamaichi Electronics Co Ltd | Socket for semiconductor device |
TWM354250U (en) * | 2008-09-08 | 2009-04-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
JP5383167B2 (en) * | 2008-12-04 | 2014-01-08 | 株式会社エンプラス | Socket for electrical parts |
JP5196327B2 (en) * | 2008-12-22 | 2013-05-15 | 山一電機株式会社 | Socket for semiconductor device |
US7914313B1 (en) * | 2010-02-04 | 2011-03-29 | Plastronics Socket Partners, Ltd. | Clamping mechanism for an IC socket |
JP5656578B2 (en) * | 2010-11-19 | 2015-01-21 | センサータ テクノロジーズ マサチューセッツ インコーポレーテッド | socket |
TWI571010B (en) * | 2011-12-07 | 2017-02-11 | 英特爾公司 | Quick release retention mechanism for socketed microelectronic devices, method of loading the same and computer system |
-
2014
- 2014-03-31 JP JP2014071608A patent/JP6251104B2/en not_active Expired - Fee Related
-
2015
- 2015-03-27 CN CN201580017832.7A patent/CN106165215B/en not_active Expired - Fee Related
- 2015-03-27 SG SG11201608097VA patent/SG11201608097VA/en unknown
- 2015-03-27 US US15/300,610 patent/US9755387B2/en not_active Expired - Fee Related
- 2015-03-27 WO PCT/JP2015/059573 patent/WO2015152033A1/en active Application Filing
- 2015-03-31 TW TW104110441A patent/TWI632749B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN106165215B (en) | 2018-09-21 |
CN106165215A (en) | 2016-11-23 |
TW201545426A (en) | 2015-12-01 |
US20170110841A1 (en) | 2017-04-20 |
US9755387B2 (en) | 2017-09-05 |
TWI632749B (en) | 2018-08-11 |
WO2015152033A1 (en) | 2015-10-08 |
JP6251104B2 (en) | 2017-12-20 |
JP2015195100A (en) | 2015-11-05 |
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