TWI571010B - Quick release retention mechanism for socketed microelectronic devices, method of loading the same and computer system - Google Patents

Description

Quick release latching mechanism for inserting microelectronic device, loading method thereof and computer system

The described embodiments are summarized in the field of microelectronic device latching mechanisms.

Background of the invention

The embodiments of the present description are broadly related to the field of microelectronic device latching mechanisms, and more particularly to including a substrate board, a load board, and a device for applying a desired load and allowing the microelectronic device to be quickly inserted and withdrawn. A quick release latching mechanism for the biasing mechanism of the socket.

According to an embodiment of the present invention, a fastening mechanism is specifically provided, comprising: a base plate having a first surface and an opposite second surface, an opening defined therein, and the first from the base plate a surface extending at least one flange; a biasing mechanism pivotally attached to the at least one base plate flange, and a load plate adapted to be disposed between the first surface of the base plate and the biasing mechanism And across the base plate opening.

Simple illustration

The subject matter of the present disclosure is specifically indicated and uniquely claimed in the conclusion of the specification. The above and other features of the present disclosure will be fully understood from the following detailed description and claims. The drawings are to depict only a few embodiments in accordance with the present disclosure, and thus are not considered to limit the scope thereof. The disclosure will be described with respect to additional specifics and details, so that the advantages of the present disclosure may be more readily determined, wherein:

Figure 1 shows a skewed, exploded view of a fastening mechanism of the present description;

2 is a perspective view of the fastening mechanism of FIG. 1 according to an embodiment of the present description, showing a drop and rotation process for attaching a load board to a base plate;

Figure 3 is a perspective view showing a load-holding mechanism according to Figure 1 of an embodiment of the present description;

4 is a side cross-sectional view of a load plate loaded into a base plate and biased by a cam in accordance with an embodiment of the present description;

Figure 5 is a flow chart of a process for loading a latching mechanism of Figures 1 through 4 in accordance with an embodiment of the present description;

6 is a perspective view of a latching mechanism showing a sliding process for attaching a load board to a base board in accordance with another embodiment of the present disclosure;

Figure 7 is a perspective view showing a load-holding mechanism according to Figure 6 of an embodiment of the present description;

Figure 8 is a flow chart of a process for loading a latching mechanism of Figure 6 in accordance with an embodiment of the present description;

Figure 9 shows a computer system in accordance with an embodiment of the present description.

A detailed description

In the following detailed description, reference is made to the accompanying drawings These embodiments are described in sufficient detail to enable those skilled in the art to practice the subject matter. Please understand that the different embodiments are not identical but are not mutually exclusive. For example, a particular feature of the structure, structure, or features described herein may be practiced in other embodiments without departing from the spirit and scope of the claimed subject matter. In addition, it is to be understood that the location or configuration of the individual elements of the disclosed embodiments may be modified without departing from the spirit and scope of the claimed subject matter. The following detailed description is not to be taken in a limiting description, and the scope of the invention is defined by the scope of the appended claims. In the figures, like numerals indicate the same or similar elements or functions in the various figures, and the elements are not necessarily drawn in proportion to each other, and the individual elements may be enlarged or reduced to make it easier to understand the elements of the present description.

The embodiments of the present description relate to the field of microelectronic device latching mechanisms, and more particularly to a substrate board, a load board, and a device for applying a desired load and allowing the microelectronic device to quickly insert and withdraw the socket. The quick release latching mechanism of the biasing mechanism.

Figure 1 shows a skewed, exploded view of a latching mechanism 100 of the present description. The fastening mechanism 100 can include a load board 110, a base board 130, and a biasing mechanism 150 for the load board 110. The load plate 110 can have a first surface 112, an opposite second surface 114, and a perimeter 116. The load plate 110 can also include an opening 118 defined by the load plate 110 from the load plate first surface 112 to the load plate second surface 114. Load plate 110 can be fabricated from any suitable, substantially rigid material including, but not limited to, metal, high density polymers, carbon fibers, and the like. In one embodiment, the load plate 110 can be fabricated from a high thermal conductivity metal, including but not limited to aluminum, copper, and the like, and can be fabricated from stamped metal sheets.

A heat dissipation mechanism 122 can be attached to the load plate first surface 112 to span the load plate opening 118. The heat dissipation mechanism 122 can be attached to the load plate 110 by at least one screw 124. The embodiment shown in Figure 1 will have four screws 124; however, only one will be shown to simplify the illustration. The heat dissipation mechanism retaining screw 124 can be threaded into at least one corresponding threaded opening 126 in or on the first surface 112 of the load plate. The heat dissipation mechanism retaining screw 124 can include a biasing device 128, such as a spring that surrounds a threaded portion of the heat dissipation mechanism retaining screw 124. The biasing device 128 can allow the heat dissipation mechanism 122 to move and deliver a desired load against any object that the heat dissipation mechanism 122 is in contact with.

The heat dissipation mechanism 122 can have any suitable configuration. In the illustrated embodiment, the heat dissipation mechanism 122 includes a plurality of rods 122a extending from a base 122b. Thermal dissipation mechanism 122 can be fabricated from any suitable thermally conductive material including, but not limited to, aluminum, copper, alloys thereof, and the like. An air flow mechanism (not shown), such as a fan, can be positioned adjacent to the heat dissipation mechanism 122 to assist in removing heat from the heat dissipation mechanism rod 122a, as will be appreciated by those skilled in the art.

The base plate 130 of the fastening mechanism 100 can have a first surface 132, an opposite second surface 134, and an opening 136 defined by the base plate 130. The base plate 130 can further have at least one flange (shown as two flanges, a first flange 138a and a second flange 138b) extending substantially orthogonally from the first surface 132 of the base plate. As shown, the base plate first flange 138a and the base plate second flange 138b can be located on opposite edges 140a and 140b of the base plate 130 with a base plate opening 136 disposed therebetween. Base plate 130 can be fabricated from any suitable, substantially rigid material including, but not limited to, metal, high density polymer, carbon fiber, and the like.

The base plate 130 and the load plate 110 may include a mechanism for aligning the load plate 110 to the base plate 130. In an embodiment, the base plate 130 can include at least one alignment pin 142 that extends from the base plate first surface 132. The load plate 110 can include at least one alignment opening 144 to receive the substrate plate alignment pin 142. It is understood that the load plate 110 can have an alignment pin and the base plate 130 can have an alignment opening.

The biasing mechanism 150 can be any mechanism that can provide a desired load to the load board 110. As shown in FIG. 1, the biasing mechanism 150 can be a dual cam device having a first cam 152a and a second cam 152b, wherein a lever grip 156 attaches the first cam 152a to the second cam 152b. The first cam 152a and the second cam 152b are allowed to operate in conjunction. The first cam 152a can be pivotally attached to the base plate first flange 138a and the second cam 152b can be pivotally attached to the base plate second flange 138b. In the illustrated embodiment, the first cam 152a is pivotally attachable by a first pivot bolt 158a, wherein the first pivot bolt 158a extends through a first cam bore 166a and base in the first cam 152a a first flange hole 168a in the first flange 138a of the plate, and the second cam 152b is pivotally attachable by a second pivot bolt 158b, wherein the second pivot bolt 158b extends through the second cam 152b a second cam hole (hidden) and a second flange hole 168b in the second flange 138b of the base plate.

The second surface 134 of the base plate 130 can be placed on a first surface 172 of the substrate 170 and secured thereto by a mounting mechanism. In the illustrated embodiment, the base plate 130 can be secured to the base by at least one mounting bolt (shown as mounting bolts 174a, 174b, and 174c (cum-four fourth shielded bolt 174d (shown in Figure 6))) Material 170. Substrate 170 can be any suitable substrate including a printed circuit board, such as a motherboard or microelectronic device test substrate. Substrate 170 can include a microelectronic device 182 disposed in a receptacle 184. The base plate opening 136 can be sized to substantially surround the socket 184.

Microelectronic device 182 may include, but is not limited to, a central processing unit (CPU), a chipset, a graphics processor, an application specific integrated circuit (ASIC), or other instruction/data processing device. The socket 184 can be any suitable socket for receiving a microelectronic device 182, including a central processing unit (CPU) socket and a metallized particle interconnect (MPI) socket (generally used in conjunction with a chipset and ASIC application). It is understood that the latching mechanism 100 can be used with any single or multi-device socket, such as an MCP (multi-chip processor).

A support plate 190 can be placed on a second surface 176 of the substrate 170 (i.e., opposite the first surface 172 of the substrate with the mounting bolts 174a, 174b, and 174c (cum the fourth shielded bolt 174d ( Shown in Figure 6)) extends through and is secured to the support plate 190. The support plate 190 can assist in the distribution by mounting bolts 174a, 174b, and 174c (and the fourth shielded bolt 174d (shown in Figure 6)) Fixing the substrate plate 130 against the load transmitted across the second surface 176 of the substrate can assist in reducing the likelihood of stress damage to the substrate 170. The support plate 190 can have an opening 192 defined therein. Opening 192 can be used for backside detection as will be appreciated by those skilled in the art.

As shown in Figures 1 and 2, the load plate perimeter 116 can be shaped to allow for "drop and rotate" insertion. The shaped load plate perimeter 116 can be contoured at its corners 120 to provide space for mounting bolts 174a, 174b, and 174c (and a covered fourth bolt 174d (shown in Figure 6)).

Referring to Figure 2, the load plate 110 can be rotated about 45 degrees relative to the base plate 130 from its load position (see Figure 3). The load plate 110 can then be lowered with the base plate 130 (shown by arrow A) and then rotated about 45 degrees (shown by arrow B) to align and engage the alignment pins 142 to the alignment openings 144, which place the load plate 110 Between the first cam 152a and the base plate first surface 132, and between the second cam 152b and the base plate first surface 132. The biasing mechanism 150 can be rotated (shown by arrow C) to engage the first cam 152a and the second cam 152b against the load plate first surface 112, which places a desired load against the microelectronic device 182. A stop pin 162 can be attached to the first cam 152a (see Figure 1) and/or the second cam 152b (see Figure 2) to contact its respective base plate first flange 138a and/or base The second flange 138b of the plate is such that the biasing mechanism 150 stops rotating at a desired position. This operation results in a loaded latching mechanism 100, as shown in FIG. The embodiments shown in Figures 1 through 3 may be particularly suitable for use in smaller cooling solutions for lower power dissipation microelectronic devices, "keep out volume", such as in metallized particle interconnect (MPI) sockets. The chipset and special application integrated circuit devices will be understood by those skilled in the art.

Figure 4 shows a side cross-sectional view of the biasing mechanism first cam 152a and the biasing mechanism second cam 152b (shown in hatching) engaged with the load plate first surface 112. An electrically insulating material 164 can be disposed between the load plate second surface 114 and the microelectronic device and/or a socket (collectively shown as element 180) on the substrate 170. The electrically insulating material 164 can be threaded with an opening 165 that is substantially aligned with the opening (shown in hatching) in the load plate opening 118 to expose any heat sensitive component or portion of the microelectronic device that can be dissipated by the thermal dissipating device 122 generated (see Figure 1). Electrically insulating material 164 prevents electrical shorting of any circuitry on the microelectronic device and/or a socket (collectively referred to as component 180). Electrically insulating material 164 can be attached to load plate second surface 114. By changing the thickness T of the load plate 110 and also referring to FIG. 1 by changing the diameter of the first pivot bolt 158a and the diameter of the second pivot bolt 158b and the respective first cam holes 166a and the first flange The hole 168b, and the second cam hole (hidden) and the second flange hole 168b are used to change the load placed on the load board 110. Thus, the load on the microelectronic device 182 in the socket is self-adjusting without the need for special tools or operator training.

As will be appreciated by those skilled in the art, the described embodiments can be used for testing a microelectronic device or for use in a final assembly of a computer system or a computer server. For microelectronic device testing (error correction and verification), the holding mechanism allows for quick assembly and disassembly by replacing the commonly used spring screws to hold the hardware. In addition, applying a uniform load system by the latching mechanism of the present invention can increase the reliability of the socket, reduce the possibility of cracking or damaging a microelectronic device, and increase the insertion and extraction that can be achieved from the microelectronic device test hardware. The number of cycles.

The process described in FIG. 2 is shown in the flowchart of FIG. 5 as a process 200. As shown in block 210, a substrate panel can be attached to a substrate, wherein the substrate is attached with a socket, a microelectronic device is disposed in the socket, and wherein the microelectronic device is exposed through an opening in the substrate panel . As shown in block 220, a load plate having contoured corners can be rotated relative to a base plate from its load position. The load plate can then be lowered adjacent to the substrate plate, as shown in block 230, and then rotated to align and engage the alignment plate on the load plate and substrate plate, which places the load plate on a biasing mechanism and substrate plate Between, as indicated by block 240. As indicated by block 250, the biasing mechanism can be engaged against the load plate, which places a desired load against the microelectronic device.

Figure 6 shows a load plate 310 suitable for sliding in place on the base plate 130. The load plate 310 can include at least one stop tab 312 adapted to contact a stop structure of the base plate 120 to thereby align the load plate 310 on the base plate 120. In the illustrated embodiment, the load plate 310 slides on the base plate 130 (shown by arrow D) until the load plate stop projection 312 contacts a base plate flange as a stop structure (such as the base plate first flange 138a and/or Or the base plate second flange 138b). The biasing mechanism 150 can then be rotated to engage the first cam 152a and the second cam 152b against the load plate first surface 112, placing a desired load against the microelectronic device 182 and resulting in Figure 7 Loaded latching mechanism 300. The embodiments shown in Figures 6 and 7 may be particularly suitable for use with larger "forbidden volumes" for high power dissipative microelectronic devices such as microprocessors, as will be appreciated by those skilled in the art.

The process described in FIG. 6 is shown in the flowchart of FIG. 8 as a process 400. As shown in block 410, a substrate panel can be attached to a substrate, wherein the substrate is attached with a socket, a microelectronic device is disposed in the socket, and wherein the microelectronic device is exposed through an opening in the substrate panel . As shown in block 420, a load plate having a stop projection slides on a base plate until the load plate stop projection contacts a stop structure on the base plate, which places the load plate on a biasing mechanism and the base plate between. As indicated by block 420, the biasing mechanism can engage against the load plate, placing a desired load against a microelectronic device.

FIG. 9 shows an embodiment of a computer system 510. Computer system 510 can include a substrate or motherboard 520 within a housing 530. The motherboard 520 can have various electronic components electrically coupled thereto, including a microelectronic device such as a central processing unit (CPU), a chipset, a graphics processor, an ASIC, or other instruction/data processing device, located at a It is held in the socket and is held by a fastening mechanism of the present description. The processor, socket and holding mechanism are generally shown as elements 540 (details of these components are shown in Figures 1 through 4, 6 and 7). The substrate or motherboard 520 can be attached to a variety of different peripheral devices, including input devices such as a keyboard 560 and/or a mouse 570, and a display device such as a monitor 580.

It is also understood that the subject matter of the present description is not necessarily limited to the particular application shown in Figures 1-9. The subject matter can be applied to other microelectronic applications. Moreover, the subject matter can also be used in any suitable application outside of the field of microelectronic device fabrication, as will be appreciated by those skilled in the art.

DETAILED DESCRIPTION Various embodiments of the devices and/or processes have been described using the figures, block diagrams, flowcharts, and/or examples. If the figures, the block diagrams, the flowcharts, and/or the examples contain one or more functions and/or operations, those skilled in the art will understand that each of the various figures, blocks, flowcharts, and/or examples The functions and/or operations may be performed individually and/or collectively by a wide range of hardware, software, firmware, or any combination thereof.

The subject matter described is sometimes indicative of different components contained within, or in conjunction with, other components. Please understand that these illustrations are exemplary only and that many alternative structures can be implemented to achieve the same function. In a conceptual sense, any component configuration that is used to achieve the same function is substantially "associated" to achieve the desired functionality. Thus, any two components that are combined herein to achieve a particular function can be seen as "associated" with each other to achieve the desired function, regardless of the structure or intermediate components. Similarly, any two components associated therewith can also be viewed as "operatively connected" or "operably coupled" to each other to achieve a desired function, and any two components that can be so associated can also be considered as "available. Operately coupled to each other to achieve the desired function. Specific examples of operability coupling include, but are not limited to, physically dockable and/or physical interactive components and/or wirelessly interactable and/or wireless interactive components and/or logically interactive and/or logically interactive components.

Those skilled in the art will appreciate that the language of this document, and in particular the scope of the patent application, is generally intended to be an "open" term. In general, the term "including" should be interpreted as "including but not limited to". In addition, the term "having" should be interpreted as "having at least".

The use of the plural and / or singular terms in the detailed description may be used in the singular and / or

Those skilled in the art will further appreciate that if an indication of the number of components is used in a request item, the intent of the claim to be subject to this limitation will be explicitly stated in the claim, and if not explicitly stated, there is no such intent. Moreover, if a particular number of a description of a claim is explicitly recited, those skilled in the art will appreciate that the description should typically be interpreted as referring to "at least" the number of the recited.

The phrase "an embodiment", "an embodiment", "an embodiment" or "another embodiment" in the specification may mean that a particular feature, structure, or feature described in connection with one or more embodiments can be It is included in at least some of the embodiments, but not necessarily all of the embodiments. The various terms "an embodiment", "an embodiment" or "another embodiment" in the detailed description are not necessarily referring to the same embodiment.

While the various methods and systems have been described and described herein, it will be understood by those skilled in the art that various modifications may be made, and the equivalents may be substituted without departing from the subject matter or spirit of the claims. In addition, many modifications may be made to adapt a particular situation to the teachings of the claimed subject matter without departing from the central concepts described herein. Therefore, the claimed subject matter is not intended to be limited to the specific examples disclosed, but the claimed subject matter may also include all embodiments and equivalents falling within the scope of the claims.

100,300. . . Buttoning mechanism

110,310. . . Load board

112. . . Load plate first surface

114. . . Load plate second surface

116. . . Load board periphery

118. . . Load plate opening

120. . . corner

122. . . Heat dissipation device

122a. . . Rod

122b. . . Base

124. . . Screw

126. . . Threaded opening

128. . . Biasing device

130. . . Base plate

132. . . First surface of base plate 130

134. . . Second surface of base plate 130

136. . . Base plate opening

138a. . . Base plate first flange

138b. . . Base plate second flange

140a, 140b. . . Edge of base plate 130

142. . . Alignment pin

144. . . Alignment opening

150. . . Biasing mechanism

152a. . . First cam

152b. . . Second cam

156. . . Lever grip

158a. . . First pivot bolt

158b. . . Second pivot bolt

162. . . Stop pin

164. . . Electrical insulation material

165,192. . . Opening

166a. . . First cam hole

168a. . . First flange hole

168b. . . Second flange hole

170. . . Substrate

172. . . First surface of substrate 170

174a, 174b, 174c. . . Mounting bolt

174d. . . Fourth covered bolt

176. . . Second surface of substrate 170

180. . . element

182. . . Microelectronic device

184. . . socket

190. . . Support plate

200,400. . . Process

210,220,230,240,250,410,420,430. . . Square

312. . . Stop the protrusion

510. . . computer system

520. . . Substrate or motherboard

530. . . case

540. . . element

560. . . keyboard

570. . . mouse

580. . . Monitor

A, B, C, D. . . arrow

T. . . Thickness of load plate 110

Figure 1 shows a skewed, exploded view of a fastening mechanism of the present description;

2 is a perspective view of the fastening mechanism of FIG. 1 according to an embodiment of the present description, showing a drop and rotation process for attaching a load board to a base plate;

Figure 3 is a perspective view showing a load-holding mechanism according to Figure 1 of an embodiment of the present description;

4 is a side cross-sectional view of a load plate loaded into a base plate and biased by a cam in accordance with an embodiment of the present description;

Figure 5 is a flow chart of a process for loading a latching mechanism of Figures 1 through 4 in accordance with an embodiment of the present description;

6 is a perspective view of a latching mechanism showing a sliding process for attaching a load board to a base board in accordance with another embodiment of the present disclosure;

Figure 7 is a perspective view showing a load-holding mechanism according to Figure 6 of an embodiment of the present description;

Figure 8 is a flow chart of a process for loading a latching mechanism of Figure 6 in accordance with an embodiment of the present description;

Figure 9 shows a computer system in accordance with an embodiment of the present description.

100‧‧‧Detention institution

110‧‧‧ load board

112‧‧‧First surface of the load board

114‧‧‧Second surface of load plate

116‧‧‧Load board periphery

118‧‧‧ Load plate opening

120‧‧‧ corner

122‧‧‧Heat dissipating device

122a‧‧‧ rod

122b‧‧‧Base

124‧‧‧ screws

126‧‧ Threaded opening

128‧‧‧ biasing device

130‧‧‧Base plate

132‧‧‧ First surface of the base plate 130

134‧‧‧ second surface of the base plate 130

136‧‧‧Base plate opening

138a‧‧‧First flange of the base plate

138b‧‧‧Second flange of base plate

140a, 140b‧‧‧ edge of base plate 130

142‧‧‧ alignment pin

144‧‧‧Aligned opening

150‧‧‧ biasing mechanism

152a‧‧‧First Cam

152b‧‧‧second cam

156‧‧‧Lever grip

158a‧‧‧First pivot bolt

158b‧‧‧Second pivot bolt

162‧‧‧Stop the sale

166a‧‧‧First cam hole

168a‧‧‧First flange hole

168b‧‧‧second flange hole

170‧‧‧Substrate

172‧‧‧ First surface of substrate 170

174a, 174b, 174c‧‧‧ mounting bolts

176‧‧‧ second surface of substrate 170

182‧‧‧Microelectronics

184‧‧‧ socket

190‧‧‧support plate

192‧‧‧ openings

Claims (22)

A fastening mechanism comprising: a base plate having a first surface and an opposite second surface, an opening defined therein, extending from the first surface of the base plate on opposite edges of the base plate a first flange and a second flange; a biasing mechanism including a first cam pivotally attached to the first flange of the base plate and a second pivotally attached to the base plate a second cam of the flange; and a load plate adapted to be disposed between the first surface of the base plate and the biasing mechanism and spanning the base plate opening. The holding mechanism of claim 1, wherein the load plate comprises a first surface, an opposite second surface, and a contoured periphery. The holding mechanism of claim 2, wherein the load board and the base board further comprise an alignment structure. For example, the holding mechanism of claim 2, wherein the load board includes a heat dissipating mechanism. The holding mechanism of claim 1, wherein the load plate comprises a stop protrusion. The holding mechanism of claim 5, wherein the load plate stopping protrusion is adapted to contact a stop structure on the base plate to align the load plate. The holding mechanism of claim 5, wherein the load board comprises a heat dissipating mechanism. For example, the detaining institution of claim 1 of the patent scope further includes a A first cam of the biasing mechanism is coupled to the lever grip of the second cam of the biasing mechanism. The fastening mechanism of claim 1, further comprising a support plate attached to the base plate. The holding mechanism of claim 9, wherein the support plate has an opening defined therethrough. A method of loading a fastening mechanism, comprising: attaching a substrate to a substrate, wherein the substrate has a socket attached thereto, wherein the socket is provided with a microelectronic device, wherein the microelectronic device is configured An opening in the base plate is exposed, wherein the base plate has a first flange and a second flange extending from the base plate on opposite edges of the base plate; and a load plate having a contoured corner is The load position is rotated relative to the base plate; the load plate is lowered adjacent to the base plate; the load plate is rotated to align and engage the alignment mechanism on the load plate and the base plate and the load plate Positioned between a biasing mechanism and the base plate, wherein the biasing mechanism includes a first cam pivotally attached to the first flange of the base plate and a pivotally attached to the base plate a second cam of the second flange; and engaging the first cam and the second cam of the biasing mechanism against the load plate to place a desired load against the microelectronic device. A method of loading a fastening mechanism, comprising: attaching a substrate to a substrate, wherein the substrate has a An attached socket, a microelectronic device disposed in the socket, wherein the microelectronic device is exposed through an opening in the base plate, wherein the base plate has an extension from the base plate on an opposite edge of the base plate a first flange and a second flange; sliding a load plate having a stop protrusion on a base plate until the load plate stop protrusion contacts a stop structure on the base plate, the load plate Positioned between a biasing mechanism and the base plate, wherein the biasing mechanism includes a first cam pivotally attached to the first flange of the base plate and a pivotally attached to the base plate a second cam of the second flange; and engaging the first cam and the second cam of the biasing mechanism against the load plate to place a desired load against the microelectronic device. A computer system comprising: a substrate having a socket attached thereto and a microelectronic device disposed in the socket; and a fastening mechanism attached to the substrate, comprising: a substrate board Having a first surface and an opposite second surface, an opening defined therein, a first flange and a second flange extending from the first surface of the base plate on opposite edges of the base plate, wherein The base plate opening substantially surrounds the substrate receptacle; a biasing mechanism including a first cam pivotally attached to the first flange of the base plate and a pivotally attached to the base plate a second cam of the second flange; and A load plate adapted to remain between the first surface of the substrate plate and the biasing mechanism and across the base plate opening to contact the microelectronic device. A computer system as claimed in claim 13 wherein the load plate comprises a contoured perimeter. The computer system of claim 14, wherein the load board and the base board further comprise an alignment structure. The computer system of claim 14, wherein the load board comprises a heat dissipation mechanism. The computer system of claim 13, wherein the load board includes a stop protrusion. The computer system of claim 17, wherein the load plate stop projection is adapted to contact a stop structure on the base plate to align the load plate. The computer system of claim 17, wherein the load board comprises a heat dissipation mechanism. The computer system of claim 13 further comprising a lever grip connecting the first cam of the biasing mechanism to the second cam of the biasing mechanism. A computer system as claimed in claim 13 further comprising a support plate attached to the base plate. The computer system of claim 21, wherein the support plate has an opening defined therethrough.