SG11201604899SA - Mounting body manufacturing method and anisotropic conductive film - Google Patents
Mounting body manufacturing method and anisotropic conductive filmInfo
- Publication number
- SG11201604899SA SG11201604899SA SG11201604899SA SG11201604899SA SG11201604899SA SG 11201604899S A SG11201604899S A SG 11201604899SA SG 11201604899S A SG11201604899S A SG 11201604899SA SG 11201604899S A SG11201604899S A SG 11201604899SA SG 11201604899S A SG11201604899S A SG 11201604899SA
- Authority
- SG
- Singapore
- Prior art keywords
- conductive film
- anisotropic conductive
- mounting body
- body manufacturing
- manufacturing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0486—Replacement and removal of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0221—Insulating particles having an electrically conductive coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/023—Hard particles, i.e. particles in conductive adhesive at least partly penetrating an electrode
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Non-Insulated Conductors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Combinations Of Printed Boards (AREA)
- Conductive Materials (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013259194 | 2013-12-16 | ||
JP2014235554A JP6505423B2 (en) | 2013-12-16 | 2014-11-20 | Method of manufacturing mounting body, and anisotropic conductive film |
PCT/JP2014/082640 WO2015093362A1 (en) | 2013-12-16 | 2014-12-10 | Mounting body manufacturing method and anisotropic conductive film |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201604899SA true SG11201604899SA (en) | 2016-07-28 |
Family
ID=53402711
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201604899SA SG11201604899SA (en) | 2013-12-16 | 2014-12-10 | Mounting body manufacturing method and anisotropic conductive film |
Country Status (9)
Country | Link |
---|---|
US (1) | US10887999B2 (en) |
EP (1) | EP3086411B1 (en) |
JP (1) | JP6505423B2 (en) |
KR (1) | KR102336897B1 (en) |
CN (1) | CN105981228B (en) |
MY (1) | MY194836A (en) |
SG (1) | SG11201604899SA (en) |
TW (1) | TWI686024B (en) |
WO (1) | WO2015093362A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6346807B2 (en) * | 2014-07-02 | 2018-06-20 | 積水化学工業株式会社 | Conductive particles, bonding composition, bonded structure, and manufacturing method of bonded structure |
JP6944533B2 (en) * | 2017-10-12 | 2021-10-06 | 富士フイルム株式会社 | Anisotropic conductive film and laminate |
JP7424745B2 (en) * | 2018-10-11 | 2024-01-30 | 信越ポリマー株式会社 | Electromagnetic shielding film, printed wiring board with electromagnetic shielding film, and manufacturing method thereof |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06103819A (en) * | 1992-09-21 | 1994-04-15 | Hitachi Chem Co Ltd | Anisotropic conductive adhesive film |
TWI334880B (en) * | 2000-12-28 | 2010-12-21 | Hitachi Chemical Co Ltd | Circuit connecting adhesive with anisotropic conductivity connecting method of circuit board and circuit connecting construction by using the adhesive |
JP2004224942A (en) * | 2003-01-24 | 2004-08-12 | Kinugawa Rubber Ind Co Ltd | Anisotropic conductive elastic body composition and its preparing process |
JP5186157B2 (en) * | 2007-08-24 | 2013-04-17 | デクセリアルズ株式会社 | Anisotropic conductive film and manufacturing method of connection structure using the same |
KR101376002B1 (en) * | 2007-10-05 | 2014-03-19 | 히타치가세이가부시끼가이샤 | Adhesive composition, circuit connecting material using the same, method for connecting circuit members, and circuit connection structure |
WO2009048070A1 (en) * | 2007-10-12 | 2009-04-16 | Hitachi Chemical Company, Ltd. | Circuit connecting material and connection structure for circuit member using the same |
JP5499448B2 (en) * | 2008-07-16 | 2014-05-21 | デクセリアルズ株式会社 | Anisotropic conductive adhesive |
JP5359472B2 (en) * | 2009-04-02 | 2013-12-04 | いすゞ自動車株式会社 | Fuel supply device |
JP5631654B2 (en) * | 2010-07-28 | 2014-11-26 | デクセリアルズ株式会社 | Manufacturing method and connection method of mounting body |
JP5654289B2 (en) * | 2010-08-26 | 2015-01-14 | デクセリアルズ株式会社 | Manufacturing method of mounting body, mounting body, and anisotropic conductive film |
JP2012209097A (en) * | 2011-03-29 | 2012-10-25 | Sekisui Chem Co Ltd | Anisotropic conductive material and connection structure |
-
2014
- 2014-11-20 JP JP2014235554A patent/JP6505423B2/en active Active
- 2014-12-10 WO PCT/JP2014/082640 patent/WO2015093362A1/en active Application Filing
- 2014-12-10 US US15/104,452 patent/US10887999B2/en active Active
- 2014-12-10 EP EP14871737.4A patent/EP3086411B1/en active Active
- 2014-12-10 SG SG11201604899SA patent/SG11201604899SA/en unknown
- 2014-12-10 KR KR1020167015897A patent/KR102336897B1/en active IP Right Grant
- 2014-12-10 MY MYPI2016001107A patent/MY194836A/en unknown
- 2014-12-10 CN CN201480075640.7A patent/CN105981228B/en active Active
- 2014-12-10 TW TW103142945A patent/TWI686024B/en active
Also Published As
Publication number | Publication date |
---|---|
WO2015093362A1 (en) | 2015-06-25 |
US20160316569A1 (en) | 2016-10-27 |
EP3086411A4 (en) | 2017-12-20 |
EP3086411B1 (en) | 2023-05-10 |
KR102336897B1 (en) | 2021-12-08 |
KR20160099571A (en) | 2016-08-22 |
MY194836A (en) | 2022-12-19 |
EP3086411A1 (en) | 2016-10-26 |
TWI686024B (en) | 2020-02-21 |
CN105981228A (en) | 2016-09-28 |
CN105981228B (en) | 2020-01-10 |
JP2015135949A (en) | 2015-07-27 |
JP6505423B2 (en) | 2019-04-24 |
TW201541765A (en) | 2015-11-01 |
US10887999B2 (en) | 2021-01-05 |
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