SG11201602845UA - Pyrometer background elimination - Google Patents

Pyrometer background elimination

Info

Publication number
SG11201602845UA
SG11201602845UA SG11201602845UA SG11201602845UA SG11201602845UA SG 11201602845U A SG11201602845U A SG 11201602845UA SG 11201602845U A SG11201602845U A SG 11201602845UA SG 11201602845U A SG11201602845U A SG 11201602845UA SG 11201602845U A SG11201602845U A SG 11201602845UA
Authority
SG
Singapore
Prior art keywords
pyrometer
background elimination
elimination
background
pyrometer background
Prior art date
Application number
SG11201602845UA
Inventor
Wolfgang R Aderhold
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11201602845UA publication Critical patent/SG11201602845UA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
    • G01J5/0007—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter of wafers or semiconductor substrates, e.g. using Rapid Thermal Processing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0879—Optical elements not provided otherwise, e.g. optical manifolds, holograms, cubic beamsplitters, non-dispersive prisms or particular coatings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
    • G01J2005/065—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity by shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/48—Thermography; Techniques using wholly visual means
    • G01J5/485—Temperature profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
SG11201602845UA 2013-11-12 2014-10-23 Pyrometer background elimination SG11201602845UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361903079P 2013-11-12 2013-11-12
PCT/US2014/062016 WO2015073185A1 (en) 2013-11-12 2014-10-23 Pyrometer background elimination

Publications (1)

Publication Number Publication Date
SG11201602845UA true SG11201602845UA (en) 2016-05-30

Family

ID=53043790

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201602845UA SG11201602845UA (en) 2013-11-12 2014-10-23 Pyrometer background elimination

Country Status (6)

Country Link
US (2) US9759615B2 (en)
KR (2) KR102535623B1 (en)
CN (2) CN105765706B (en)
SG (1) SG11201602845UA (en)
TW (1) TWI644084B (en)
WO (1) WO2015073185A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240007688A (en) 2018-06-26 2024-01-16 어플라이드 머티어리얼스, 인코포레이티드 Method and apparatus for measuring temperature
DE102018121854A1 (en) * 2018-09-07 2020-03-12 Aixtron Se Process for setting up or operating a CVD reactor
US11342209B2 (en) 2019-12-09 2022-05-24 Applied Materials, Inc. Methods and apparatus for measuring edge ring temperature
CN113488367A (en) * 2020-12-14 2021-10-08 北京屹唐半导体科技股份有限公司 Workpiece processing apparatus having a plasma processing system and a thermal processing system
WO2023192402A1 (en) * 2022-03-31 2023-10-05 Lam Research Corporation Radiative heat windows and wafer support pads in vapor etch reactors

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0555145A (en) * 1991-08-27 1993-03-05 Hitachi Ltd Substrate heater
JPH07211663A (en) * 1994-01-27 1995-08-11 Hitachi Ltd Production of semiconductor
US5716133A (en) * 1995-01-17 1998-02-10 Applied Komatsu Technology, Inc. Shielded heat sensor for measuring temperature
JP3515904B2 (en) * 1998-06-25 2004-04-05 オリオン機械株式会社 Semiconductor wafer temperature test equipment
US6168668B1 (en) 1998-11-25 2001-01-02 Applied Materials, Inc. Shadow ring and guide for supporting the shadow ring in a chamber
JP2001313269A (en) * 2000-04-28 2001-11-09 Dainippon Screen Mfg Co Ltd Heat treating apparatus
US6521292B1 (en) * 2000-08-04 2003-02-18 Applied Materials, Inc. Substrate support including purge ring having inner edge aligned to wafer edge
JP2002100583A (en) * 2000-09-26 2002-04-05 Dainippon Screen Mfg Co Ltd Heat treatment device
JP4025497B2 (en) * 2000-09-29 2007-12-19 京セラ株式会社 Wafer heating device
JP2002299275A (en) * 2001-03-29 2002-10-11 Dainippon Screen Mfg Co Ltd Heat treatment device
JP2002292275A (en) 2001-03-29 2002-10-08 Kanagawa Acad Of Sci & Technol Microchip pile-up type chemical reaction system
KR100396216B1 (en) * 2001-06-19 2003-09-02 코닉 시스템 주식회사 Method for measuring temperature of a wafer in a rapid thermal processing apparatus
JP3795788B2 (en) * 2001-10-26 2006-07-12 大日本スクリーン製造株式会社 Substrate heat treatment method
US6868302B2 (en) * 2002-03-25 2005-03-15 Dainippon Screen Mfg. Co., Ltd. Thermal processing apparatus
US6835914B2 (en) 2002-11-05 2004-12-28 Mattson Technology, Inc. Apparatus and method for reducing stray light in substrate processing chambers
JP2005012073A (en) * 2003-06-20 2005-01-13 Hitachi Kokusai Electric Inc Substrate processing apparatus
US7115837B2 (en) 2003-07-28 2006-10-03 Mattson Technology, Inc. Selective reflectivity process chamber with customized wavelength response and method
US8658945B2 (en) * 2004-02-27 2014-02-25 Applied Materials, Inc. Backside rapid thermal processing of patterned wafers
KR100677981B1 (en) 2004-12-29 2007-02-02 동부일렉트로닉스 주식회사 Rapid thermal processing apparatus
JP2006237516A (en) * 2005-02-28 2006-09-07 Hitachi Kokusai Electric Inc Substrate treatment equipment
US7642205B2 (en) * 2005-04-08 2010-01-05 Mattson Technology, Inc. Rapid thermal processing using energy transfer layers
JP2006310535A (en) * 2005-04-28 2006-11-09 Hitachi Kokusai Electric Inc Substrate processor
JP2007005399A (en) * 2005-06-21 2007-01-11 Hitachi Kokusai Electric Inc Substrate processing apparatus
US20080242117A1 (en) * 2007-03-30 2008-10-02 Panchapakesan Ramanarayanan Apparatus to reduce wafer edge temperature and breakage of wafers
US8283607B2 (en) * 2008-04-09 2012-10-09 Applied Materials, Inc. Apparatus including heating source reflective filter for pyrometry
US8367983B2 (en) * 2008-04-09 2013-02-05 Applied Materials, Inc. Apparatus including heating source reflective filter for pyrometry
TWI476836B (en) * 2008-05-02 2015-03-11 Applied Materials Inc System for non radial temperature control for rotating substrates
US7985945B2 (en) 2008-05-09 2011-07-26 Applied Materials, Inc. Method for reducing stray light in a rapid thermal processing chamber by polarization
US8434937B2 (en) * 2008-05-30 2013-05-07 Applied Materials, Inc. Method and apparatus for detecting the substrate temperature in a laser anneal system
US8452166B2 (en) * 2008-07-01 2013-05-28 Applied Materials, Inc. Apparatus and method for measuring radiation energy during thermal processing
TWI381452B (en) * 2008-08-29 2013-01-01 Applied Materials Inc Method and apparatus for extended temperature pyrometry
JP5038381B2 (en) * 2009-11-20 2012-10-03 株式会社東芝 Susceptor and deposition system
US9640412B2 (en) 2009-11-20 2017-05-02 Applied Materials, Inc. Apparatus and method for enhancing the cool down of radiatively heated substrates
US8744250B2 (en) * 2011-02-23 2014-06-03 Applied Materials, Inc. Edge ring for a thermal processing chamber
US8506161B2 (en) 2011-06-21 2013-08-13 Advanced Energy Industries, Inc. Compensation of stray light interference in substrate temperature measurement
US8980767B2 (en) * 2012-01-13 2015-03-17 Applied Materials, Inc. Methods and apparatus for processing a substrate
WO2013112313A1 (en) * 2012-01-26 2013-08-01 Applied Materials, Inc. Thermal processing chamber with top substrate support assembly

Also Published As

Publication number Publication date
CN110783233A (en) 2020-02-11
US20170328775A1 (en) 2017-11-16
KR20160085823A (en) 2016-07-18
KR102535623B1 (en) 2023-05-26
KR102416963B1 (en) 2022-07-05
TW201518698A (en) 2015-05-16
WO2015073185A1 (en) 2015-05-21
US9759615B2 (en) 2017-09-12
US20150131699A1 (en) 2015-05-14
TWI644084B (en) 2018-12-11
CN110783233B (en) 2023-10-27
CN105765706B (en) 2019-10-25
US10330535B2 (en) 2019-06-25
CN105765706A (en) 2016-07-13
KR20220103798A (en) 2022-07-22

Similar Documents

Publication Publication Date Title
IL246002A0 (en) Novel methods
DK3689865T3 (en) Hidtil ukendte aminopyrimidinderivater
DK3088517T3 (en) Humant anti-il-33-neutraliserende monoklonalt antistof
DK3736291T3 (en) Anti-FCRH5-antistoffer
DK3354246T3 (en) Udstyrsmonteringssystem
DK3077519T3 (en) Cmv-vacciner
EP3000028A4 (en) Auto-calendaring
HK1217316A1 (en) Photo-alignable object
DK3470074T3 (en) Probiotika
EP2970310A4 (en) 5-bromo-indirubins
EP2853297A4 (en) Kendama
SG11201602845UA (en) Pyrometer background elimination
DK3056208T3 (en) Immunpotentiator
DK2979701T3 (en) Antitumormiddel indbefattende irinotecanhydrochloridhydrat
AU353643S (en) Stamphousing
EP3014557A4 (en) Phone-on-file
GB201300001D0 (en) Envirep - environment replicater
DK2989854T3 (en) Strømstyret opvarmningssystem
AU4899P (en) Herbie53 Iresine herbstii
AU4953P (en) Flogazora Gazania rigens
AU4977P (en) Harrosy Gaura lindheimeri
GB201318451D0 (en) W/C Sani-vent
AU353331S (en) Kettlebell
AU353330S (en) Kettlebell
AU353329S (en) Kettlebell