SG11201601245VA - Plating apparatus and sensing device using same - Google Patents
Plating apparatus and sensing device using sameInfo
- Publication number
- SG11201601245VA SG11201601245VA SG11201601245VA SG11201601245VA SG11201601245VA SG 11201601245V A SG11201601245V A SG 11201601245VA SG 11201601245V A SG11201601245V A SG 11201601245VA SG 11201601245V A SG11201601245V A SG 11201601245VA SG 11201601245V A SG11201601245V A SG 11201601245VA
- Authority
- SG
- Singapore
- Prior art keywords
- same
- sensing device
- plating apparatus
- plating
- sensing
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
- C23C18/163—Supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/002—Cell separation, e.g. membranes, diaphragms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/008—Current shielding devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Automation & Control Theory (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013169504A JP6226229B2 (ja) | 2013-08-19 | 2013-08-19 | めっき装置及びこれを用いたセンサ装置 |
PCT/JP2014/070252 WO2015025693A1 (ja) | 2013-08-19 | 2014-07-31 | めっき装置及びこれを用いたセンサ装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201601245VA true SG11201601245VA (en) | 2016-03-30 |
Family
ID=52483474
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201601245VA SG11201601245VA (en) | 2013-08-19 | 2014-07-31 | Plating apparatus and sensing device using same |
Country Status (7)
Country | Link |
---|---|
US (1) | US20160230285A1 (ja) |
EP (1) | EP3037573B1 (ja) |
JP (1) | JP6226229B2 (ja) |
KR (1) | KR101773308B1 (ja) |
CN (1) | CN105473770B (ja) |
SG (1) | SG11201601245VA (ja) |
WO (1) | WO2015025693A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11085885B2 (en) * | 2017-01-19 | 2021-08-10 | Aegion Coating Services, Llc | Pipe joint inspection |
JP6993288B2 (ja) * | 2018-05-07 | 2022-01-13 | 株式会社荏原製作所 | めっき装置 |
JP7193418B2 (ja) * | 2019-06-13 | 2022-12-20 | 株式会社荏原製作所 | めっき装置 |
CN115142104B (zh) * | 2022-07-28 | 2024-04-26 | 福州一策仪器有限公司 | 电镀装置、多通道电镀装置组和电镀反应系统 |
KR20240079097A (ko) * | 2022-11-28 | 2024-06-04 | (주)애니캐스팅 | 기판과 전원 연결이 용이한 s-ecam 프린팅 장치 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2711270A1 (de) * | 1976-03-16 | 1977-09-22 | Ici Ltd | Organische materialien mit spezifisch reaktiven gruppen |
JPS61172167U (ja) * | 1985-04-15 | 1986-10-25 | ||
KR200142727Y1 (ko) * | 1996-11-08 | 1999-06-01 | 정몽규 | Egr밸브 장착구조 |
JPH11195622A (ja) * | 1997-12-26 | 1999-07-21 | Ebara Corp | ウエハのメッキ用治具 |
TW589399B (en) * | 1998-03-02 | 2004-06-01 | Ebara Corp | Apparatus for plating a substrate |
JP3939456B2 (ja) * | 1998-03-05 | 2007-07-04 | 株式会社荏原製作所 | 基板のめっき方法及び装置 |
US20060049038A1 (en) * | 2003-02-12 | 2006-03-09 | Surfect Technologies, Inc. | Dynamic profile anode |
JP2006299367A (ja) * | 2005-04-22 | 2006-11-02 | Yamamoto Mekki Shikenki:Kk | 電気めっき試験器 |
JP2006348373A (ja) * | 2005-06-20 | 2006-12-28 | Yamamoto Mekki Shikenki:Kk | 電気めっき用治具 |
US7935230B2 (en) * | 2006-06-29 | 2011-05-03 | Semitool, Inc. | Electro-chemical processor |
JP2008076143A (ja) * | 2006-09-20 | 2008-04-03 | Citizen Holdings Co Ltd | ヘモグロビン濃度測定装置 |
CN101250726B (zh) * | 2007-11-28 | 2010-08-18 | 北京矿冶研究总院 | 密闭式电解槽及电解系统 |
JP4939484B2 (ja) * | 2008-05-30 | 2012-05-23 | 株式会社山本鍍金試験器 | 電気めっき用陰極カートリッジ |
CN201713591U (zh) * | 2009-12-30 | 2011-01-19 | 中国电子科技集团公司第二研究所 | 硅太阳能电池片电极电镀设备 |
JP5540789B2 (ja) * | 2010-03-17 | 2014-07-02 | マツダ株式会社 | 電気自動車のバッテリ及びモータの搭載構造 |
AT510593B1 (de) * | 2010-12-15 | 2012-05-15 | Markus Dipl Ing Dr Hacksteiner | Vorrichtung zum metallisieren von wafern |
JP5719687B2 (ja) * | 2011-05-19 | 2015-05-20 | 日東電工株式会社 | 無電解めっき装置、無電解めっき方法および配線回路基板の製造方法 |
JP5576848B2 (ja) * | 2011-12-07 | 2014-08-20 | 株式会社山本鍍金試験器 | 板状部材保持用冶具 |
-
2013
- 2013-08-19 JP JP2013169504A patent/JP6226229B2/ja active Active
-
2014
- 2014-07-31 US US14/912,698 patent/US20160230285A1/en not_active Abandoned
- 2014-07-31 CN CN201480045566.4A patent/CN105473770B/zh active Active
- 2014-07-31 KR KR1020167006661A patent/KR101773308B1/ko active IP Right Grant
- 2014-07-31 WO PCT/JP2014/070252 patent/WO2015025693A1/ja active Application Filing
- 2014-07-31 EP EP14837234.5A patent/EP3037573B1/en active Active
- 2014-07-31 SG SG11201601245VA patent/SG11201601245VA/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN105473770A (zh) | 2016-04-06 |
EP3037573A4 (en) | 2017-04-19 |
WO2015025693A1 (ja) | 2015-02-26 |
KR20160045758A (ko) | 2016-04-27 |
CN105473770B (zh) | 2017-09-08 |
US20160230285A1 (en) | 2016-08-11 |
KR101773308B1 (ko) | 2017-08-30 |
JP6226229B2 (ja) | 2017-11-08 |
EP3037573B1 (en) | 2018-03-14 |
JP2015038232A (ja) | 2015-02-26 |
EP3037573A1 (en) | 2016-06-29 |
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