SG11201502953QA - Laser line beam improvement apparatus and laser processing apparatus - Google Patents
Laser line beam improvement apparatus and laser processing apparatusInfo
- Publication number
- SG11201502953QA SG11201502953QA SG11201502953QA SG11201502953QA SG11201502953QA SG 11201502953Q A SG11201502953Q A SG 11201502953QA SG 11201502953Q A SG11201502953Q A SG 11201502953QA SG 11201502953Q A SG11201502953Q A SG 11201502953QA SG 11201502953Q A SG11201502953Q A SG 11201502953QA
- Authority
- SG
- Singapore
- Prior art keywords
- laser
- line beam
- processing apparatus
- beam improvement
- laser processing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0738—Shaping the laser spot into a linear shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
- H01L21/02678—Beam shaping, e.g. using a mask
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- High Energy & Nuclear Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Recrystallisation Techniques (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012234158A JP5717146B2 (en) | 2012-10-23 | 2012-10-23 | Laser line beam improving apparatus and laser processing apparatus |
PCT/JP2013/078043 WO2014065168A1 (en) | 2012-10-23 | 2013-10-16 | Laser line beam improvement device and laser processor |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201502953QA true SG11201502953QA (en) | 2015-05-28 |
Family
ID=50544548
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201502953QA SG11201502953QA (en) | 2012-10-23 | 2013-10-16 | Laser line beam improvement apparatus and laser processing apparatus |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP5717146B2 (en) |
KR (1) | KR102096829B1 (en) |
CN (1) | CN104737276B (en) |
SG (1) | SG11201502953QA (en) |
TW (1) | TWI632012B (en) |
WO (1) | WO2014065168A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6469455B2 (en) * | 2015-01-21 | 2019-02-13 | 住友重機械工業株式会社 | Laser annealing equipment |
KR102416569B1 (en) * | 2015-08-27 | 2022-07-04 | 삼성디스플레이 주식회사 | Laser crystalling apparatus |
JP2017056489A (en) * | 2015-08-31 | 2017-03-23 | 株式会社リコー | Optical processing device and method for producing optical workpiece |
KR102435765B1 (en) * | 2015-09-14 | 2022-08-24 | 삼성디스플레이 주식회사 | Laser crystalling apparatus |
JP6803189B2 (en) | 2016-10-06 | 2020-12-23 | 株式会社日本製鋼所 | Manufacturing method of laser irradiation device and semiconductor device |
JP7105187B2 (en) * | 2016-10-20 | 2022-07-22 | Jswアクティナシステム株式会社 | LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD |
CN113042922B (en) * | 2021-05-17 | 2023-01-13 | 深圳市艾雷激光科技有限公司 | Laser welding method |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19520187C1 (en) * | 1995-06-01 | 1996-09-12 | Microlas Lasersystem Gmbh | Optical system for excimer laser |
JPH10223554A (en) * | 1997-02-07 | 1998-08-21 | Japan Steel Works Ltd:The | Laser beam irradiator |
JPH11283933A (en) * | 1998-01-29 | 1999-10-15 | Toshiba Corp | Laser beam irradiating device, manufacture of non-single crystal semiconductor film, and manufacture of liquid crystal display device |
JP2000066133A (en) * | 1998-06-08 | 2000-03-03 | Sanyo Electric Co Ltd | Laser light irradiation device |
TW436639B (en) * | 1998-06-08 | 2001-05-28 | Sanyo Electric Co | Laser beam producing device |
JP3751772B2 (en) * | 1999-08-16 | 2006-03-01 | 日本電気株式会社 | Semiconductor thin film manufacturing equipment |
JP4203635B2 (en) * | 1999-10-21 | 2009-01-07 | パナソニック株式会社 | Laser processing apparatus and laser processing method |
JP2002252455A (en) | 2001-02-14 | 2002-09-06 | Unipac Optoelectronics Corp | Method and device for peeling ic chip |
US7387922B2 (en) * | 2003-01-21 | 2008-06-17 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation method, method for manufacturing semiconductor device, and laser irradiation system |
JP2005217209A (en) * | 2004-01-30 | 2005-08-11 | Hitachi Ltd | Laser annealing method and laser annealer |
JP4610201B2 (en) * | 2004-01-30 | 2011-01-12 | 住友重機械工業株式会社 | Laser irradiation device |
WO2007069516A1 (en) * | 2005-12-16 | 2007-06-21 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation apparatus, laser irradiation method, and manufacturing method of semiconductor device |
KR100766300B1 (en) | 2006-07-12 | 2007-10-12 | (주)미래컴퍼니 | Laser slit and laser machining apparatus |
JP5191674B2 (en) * | 2007-03-05 | 2013-05-08 | 株式会社アルバック | Laser annealing apparatus and laser annealing method |
JP5235073B2 (en) * | 2007-03-05 | 2013-07-10 | 株式会社アルバック | Laser annealing apparatus and laser annealing method |
JP2009283691A (en) * | 2008-05-22 | 2009-12-03 | Japan Steel Works Ltd:The | Method for irradiating laser light and laser light irradiation device |
JP5240764B2 (en) * | 2008-05-28 | 2013-07-17 | 株式会社日本製鋼所 | Laser beam irradiation device |
CN102077318B (en) * | 2008-06-26 | 2013-03-27 | 株式会社Ihi | Method and apparatus for laser annealing |
JP4678700B1 (en) * | 2009-11-30 | 2011-04-27 | 株式会社日本製鋼所 | Laser annealing apparatus and laser annealing method |
JP6030451B2 (en) * | 2011-06-15 | 2016-11-24 | 株式会社日本製鋼所 | Laser processing apparatus and laser processing method |
-
2012
- 2012-10-23 JP JP2012234158A patent/JP5717146B2/en active Active
-
2013
- 2013-10-16 KR KR1020157008922A patent/KR102096829B1/en active IP Right Grant
- 2013-10-16 CN CN201380055297.5A patent/CN104737276B/en active Active
- 2013-10-16 SG SG11201502953QA patent/SG11201502953QA/en unknown
- 2013-10-16 WO PCT/JP2013/078043 patent/WO2014065168A1/en active Application Filing
- 2013-10-22 TW TW102137987A patent/TWI632012B/en active
Also Published As
Publication number | Publication date |
---|---|
TW201417921A (en) | 2014-05-16 |
KR102096829B1 (en) | 2020-04-03 |
CN104737276A (en) | 2015-06-24 |
KR20150073967A (en) | 2015-07-01 |
TWI632012B (en) | 2018-08-11 |
JP5717146B2 (en) | 2015-05-13 |
JP2014086554A (en) | 2014-05-12 |
WO2014065168A1 (en) | 2014-05-01 |
CN104737276B (en) | 2017-05-31 |
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