SG11201501617YA - Method and structure for forming contact pads on a printed circuit board using zero under- cut technology - Google Patents

Method and structure for forming contact pads on a printed circuit board using zero under- cut technology

Info

Publication number
SG11201501617YA
SG11201501617YA SG11201501617YA SG11201501617YA SG11201501617YA SG 11201501617Y A SG11201501617Y A SG 11201501617YA SG 11201501617Y A SG11201501617Y A SG 11201501617YA SG 11201501617Y A SG11201501617Y A SG 11201501617YA SG 11201501617Y A SG11201501617Y A SG 11201501617YA
Authority
SG
Singapore
Prior art keywords
circuit board
printed circuit
contact pads
forming contact
zero under
Prior art date
Application number
SG11201501617YA
Inventor
Turpuseema Dan
v russell James
Original Assignee
R&D Circuits Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by R&D Circuits Inc filed Critical R&D Circuits Inc
Publication of SG11201501617YA publication Critical patent/SG11201501617YA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
SG11201501617YA 2012-09-07 2013-08-09 Method and structure for forming contact pads on a printed circuit board using zero under- cut technology SG11201501617YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261743596P 2012-09-07 2012-09-07
PCT/US2013/000185 WO2014039072A1 (en) 2012-09-07 2013-08-09 Method and structure for forming contact pads on a printed circuit board using zero under- cut technology

Publications (1)

Publication Number Publication Date
SG11201501617YA true SG11201501617YA (en) 2015-04-29

Family

ID=50232085

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201501617YA SG11201501617YA (en) 2012-09-07 2013-08-09 Method and structure for forming contact pads on a printed circuit board using zero under- cut technology

Country Status (7)

Country Link
US (1) US9468108B2 (en)
EP (1) EP2893783A4 (en)
JP (1) JP2015532010A (en)
KR (1) KR20150052053A (en)
CN (1) CN104798452B (en)
SG (1) SG11201501617YA (en)
WO (1) WO2014039072A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10201080B2 (en) * 2014-12-18 2019-02-05 Flextronics Ap, Llc Integrated system of an electronic module and conductive fabric and method of making the same
CN107102703A (en) * 2017-05-03 2017-08-29 北京新松佳和电子系统股份有限公司 Computer card for embedded product
US10568202B2 (en) * 2017-07-25 2020-02-18 International Business Machines Corporation Tamper-respondent assembly with interconnect characteristic(s) obscuring circuit layout

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU902682A3 (en) * 1974-07-12 1982-01-30 Сименс Аг (Фирма) Method of producing microstructures
JPH05275820A (en) * 1992-03-24 1993-10-22 Nitto Denko Corp Double-sided circuit board with interconnection path and manufacture thereof
EP0575292B1 (en) * 1992-06-15 1996-03-13 Dyconex Patente Ag Process for manufacturing substrates with through-holes
RU2040128C1 (en) * 1992-08-14 1995-07-20 Научно-исследовательский институт измерительных систем Process of manufacturing boards for hybrid integrated circuits
JP2680234B2 (en) * 1992-11-12 1997-11-19 株式会社日立製作所 Wiring pattern forming method
JPH06252529A (en) * 1993-03-02 1994-09-09 Nec Corp Manufacture of printed wiring board
JP3224010B2 (en) * 1995-05-12 2001-10-29 インターナショナル・ビジネス・マシーンズ・コーポレーション Electrical interconnection structure with cap and method of making same
WO1997017824A1 (en) * 1995-11-10 1997-05-15 Ibiden Co., Ltd. Multilayered printed wiring board and its manufacture
JPH1022610A (en) * 1996-07-05 1998-01-23 Otsuka Chem Co Ltd Manufacture of printed circuit board
JP3524441B2 (en) * 1999-08-10 2004-05-10 新光電気工業株式会社 Wiring formation method
US6586683B2 (en) * 2001-04-27 2003-07-01 International Business Machines Corporation Printed circuit board with mixed metallurgy pads and method of fabrication
US6815126B2 (en) * 2002-04-09 2004-11-09 International Business Machines Corporation Printed wiring board with conformally plated circuit traces
JP2004103605A (en) * 2002-09-04 2004-04-02 Murata Mfg Co Ltd Method of forming fine wiring
TWI287956B (en) * 2005-04-11 2007-10-01 Phoenix Prec Technology Corp Conducting bump structure of circuit board and fabricating method thereof
KR100688833B1 (en) * 2005-10-25 2007-03-02 삼성전기주식회사 Method for plating on printed circuit board and printed circuit board produced therefrom
JP4730220B2 (en) * 2005-11-29 2011-07-20 凸版印刷株式会社 Circuit board manufacturing method
JP5258045B2 (en) * 2006-06-30 2013-08-07 日本電気株式会社 Wiring board, semiconductor device using the wiring board, and manufacturing method thereof
US20080216704A1 (en) * 2007-03-09 2008-09-11 Fisher Controls International Llc Conformal Coating
JP5281831B2 (en) * 2008-06-30 2013-09-04 株式会社荏原製作所 Method for forming conductive material structure
CN102576701B (en) * 2009-09-02 2016-08-17 凯信公司 IC packaging part and manufacture method thereof
RU2406280C1 (en) * 2009-12-21 2010-12-10 Открытое акционерное общество "Научно-исследовательский институт приборостроения имени В.В. Тихомирова" Method of microstrip shf cards manufacture

Also Published As

Publication number Publication date
WO2014039072A1 (en) 2014-03-13
US20140069704A1 (en) 2014-03-13
CN104798452B (en) 2018-03-30
CN104798452A (en) 2015-07-22
EP2893783A4 (en) 2016-08-24
US9468108B2 (en) 2016-10-11
JP2015532010A (en) 2015-11-05
EP2893783A1 (en) 2015-07-15
KR20150052053A (en) 2015-05-13

Similar Documents

Publication Publication Date Title
HK1199096A1 (en) Inkjetsystem for printing a printed circuit board
EP2800463A4 (en) Printed circuit board and fabricating method thereof
EP2826623A4 (en) Copper foil with carrier, method for manufacturing copper foil with carrier, copper foil with carrier for printed circuit board, and printed circuit board
EP2801123A4 (en) Printed circuit board with reduced cross-talk
TWI562696B (en) Printed circuit board and method for manufacturing the same
EP2684431A4 (en) Printed circuit board design for high speed application
GB2494919B (en) Method for connecting printed circuit boards.
EP2647267A4 (en) Method for manufacturing printed circuit board
EP2930722A4 (en) Process for manufacturing conductive film and printed wiring board
EP2705735A4 (en) Method for manufacturing printed circuit board
EP2904884A4 (en) The printed circuit board and the method for manufacturing the same
EP2713683A4 (en) Method for manufacturing circuit board, circuit board and electronic apparatus
EP2931008A4 (en) Printed circuit board and manufacturing method therefor
EP2750490A4 (en) Component-mounting printed circuit board and manufacturing method for same
HK1214463A1 (en) Method for manufacturing shield printed circuit board, and shield film and shield printed circuit board
RS61026B1 (en) System for manufacturing printed circuit boards
PL2771145T3 (en) Method and device for cooling soldered printed circuit boards
EP2790476A4 (en) Multilayer printed circuit board and manufacturing method thereof
TWI562697B (en) Printed circuit board
EP2792026A4 (en) Electrical connectors for use with printed circuit boards
HK1201993A1 (en) Device for contacting a circuit board
EP2820927A4 (en) The printed circuit board and the method for manufacturing the same
EP2915415A4 (en) Printed circuit board
EP2870837A4 (en) Device and Method for Printed Circuit Board with Embedded Cable
TWI561129B (en) Light-pervious printed circuit board method for manufacturing same