SG11201500281YA - Etching fluid for forming texture and texture-forming method using same - Google Patents

Etching fluid for forming texture and texture-forming method using same

Info

Publication number
SG11201500281YA
SG11201500281YA SG11201500281YA SG11201500281YA SG11201500281YA SG 11201500281Y A SG11201500281Y A SG 11201500281YA SG 11201500281Y A SG11201500281Y A SG 11201500281YA SG 11201500281Y A SG11201500281Y A SG 11201500281YA SG 11201500281Y A SG11201500281Y A SG 11201500281YA
Authority
SG
Singapore
Prior art keywords
texture
forming
same
etching fluid
forming method
Prior art date
Application number
SG11201500281YA
Inventor
Kazunori Nakagawa
Shigeru Kigasawa
Masayuki Hashimoto
Original Assignee
Dai Ichi Kogyo Seiyaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Ichi Kogyo Seiyaku Co Ltd filed Critical Dai Ichi Kogyo Seiyaku Co Ltd
Publication of SG11201500281YA publication Critical patent/SG11201500281YA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0236—Special surface textures
    • H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Photovoltaic Devices (AREA)
  • ing And Chemical Polishing (AREA)
SG11201500281YA 2012-08-10 2013-07-29 Etching fluid for forming texture and texture-forming method using same SG11201500281YA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012178128 2012-08-10
JP2012178129 2012-08-10
JP2013073434 2013-03-29
PCT/JP2013/004586 WO2014024414A1 (en) 2012-08-10 2013-07-29 Etching fluid for forming texture and texture-forming method using same

Publications (1)

Publication Number Publication Date
SG11201500281YA true SG11201500281YA (en) 2015-03-30

Family

ID=50067674

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201500281YA SG11201500281YA (en) 2012-08-10 2013-07-29 Etching fluid for forming texture and texture-forming method using same

Country Status (7)

Country Link
JP (2) JP6138794B2 (en)
CN (1) CN104584232B (en)
MY (1) MY168909A (en)
PH (1) PH12015500079A1 (en)
SG (1) SG11201500281YA (en)
TW (1) TWI554592B (en)
WO (1) WO2014024414A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102122049B1 (en) * 2013-07-19 2020-06-11 동우 화인켐 주식회사 Texture etching solution composition and texture etching method of crystalline silicon wafers
JP6282507B2 (en) * 2014-03-27 2018-02-21 第一工業製薬株式会社 Texture forming etching solution and texture forming method using the same
JP6859111B2 (en) * 2017-01-19 2021-04-14 信越化学工業株式会社 Manufacturing method of high photoelectric conversion efficiency solar cell

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3772456B2 (en) * 1997-04-23 2006-05-10 三菱電機株式会社 Solar cell, method for manufacturing the same, and semiconductor manufacturing apparatus
DE10241300A1 (en) * 2002-09-04 2004-03-18 Merck Patent Gmbh Etching for silicon surfaces and layers, used in photovoltaic, semiconductor and high power electronics technology, for producing photodiode, circuit, electronic device or solar cell, is thickened alkaline liquid
TW200745313A (en) * 2006-05-26 2007-12-16 Wako Pure Chem Ind Ltd Substrate etching liquid
JP2011515872A (en) * 2008-03-25 2011-05-19 アプライド マテリアルズ インコーポレイテッド Surface cleaning and uneven formation process of crystalline solar cell
DE102009028762A1 (en) * 2009-08-20 2011-03-03 Rena Gmbh Process for etching silicon surfaces
JP2011205058A (en) * 2009-12-17 2011-10-13 Rohm & Haas Electronic Materials Llc Improved method of texturing semiconductor substrate
JP5479301B2 (en) * 2010-05-18 2014-04-23 株式会社新菱 Etching solution and silicon substrate surface processing method
WO2011154875A1 (en) * 2010-06-09 2011-12-15 Basf Se Aqueous alkaline etching and cleaning composition and method for treating the surface of silicon substrates
US20120295447A1 (en) * 2010-11-24 2012-11-22 Air Products And Chemicals, Inc. Compositions and Methods for Texturing of Silicon Wafers

Also Published As

Publication number Publication date
TW201412947A (en) 2014-04-01
PH12015500079B1 (en) 2015-03-02
JP6138794B2 (en) 2017-05-31
JPWO2014024414A1 (en) 2016-07-25
PH12015500079A1 (en) 2015-03-02
CN104584232A (en) 2015-04-29
JP2017118143A (en) 2017-06-29
CN104584232B (en) 2017-03-08
MY168909A (en) 2018-12-04
WO2014024414A1 (en) 2014-02-13
JP6129455B1 (en) 2017-05-17
TWI554592B (en) 2016-10-21

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