SG11201500066RA - Method of forming a hermetically sealed fiber to chip connection - Google Patents

Method of forming a hermetically sealed fiber to chip connection

Info

Publication number
SG11201500066RA
SG11201500066RA SG11201500066RA SG11201500066RA SG11201500066RA SG 11201500066R A SG11201500066R A SG 11201500066RA SG 11201500066R A SG11201500066R A SG 11201500066RA SG 11201500066R A SG11201500066R A SG 11201500066RA SG 11201500066R A SG11201500066R A SG 11201500066RA
Authority
SG
Singapore
Prior art keywords
forming
hermetically sealed
chip connection
sealed fiber
fiber
Prior art date
Application number
SG11201500066RA
Inventor
Roy Meade
Gurtej Sandhu
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Publication of SG11201500066RA publication Critical patent/SG11201500066RA/en

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4251Sealed packages
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/25Preparing the ends of light guides for coupling, e.g. cutting
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/255Splicing of light guides, e.g. by fusion or bonding
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • G02B6/262Optical details of coupling light into, or out of, or between fibre ends, e.g. special fibre end shapes or associated optical elements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236Fixing or mounting methods of the aligned elements
    • G02B6/424Mounting of the optical light guide
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • G02B6/30Optical coupling means for use between fibre and thin-film device
    • G02B6/305Optical coupling means for use between fibre and thin-film device and having an integrated mode-size expanding section, e.g. tapered waveguide
SG11201500066RA 2012-07-06 2013-06-18 Method of forming a hermetically sealed fiber to chip connection SG11201500066RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/543,156 US9329336B2 (en) 2012-07-06 2012-07-06 Method of forming a hermetically sealed fiber to chip connection
PCT/US2013/046237 WO2014007978A1 (en) 2012-07-06 2013-06-18 Method of forming a hermetically sealed fiber to chip connection

Publications (1)

Publication Number Publication Date
SG11201500066RA true SG11201500066RA (en) 2015-02-27

Family

ID=48699995

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201500066RA SG11201500066RA (en) 2012-07-06 2013-06-18 Method of forming a hermetically sealed fiber to chip connection

Country Status (8)

Country Link
US (4) US9329336B2 (en)
EP (1) EP2870495B1 (en)
JP (1) JP5965063B2 (en)
KR (1) KR101675702B1 (en)
CN (1) CN104541191B (en)
SG (1) SG11201500066RA (en)
TW (1) TWI494625B (en)
WO (1) WO2014007978A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9329336B2 (en) * 2012-07-06 2016-05-03 Micron Technology, Inc. Method of forming a hermetically sealed fiber to chip connection

Family Cites Families (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3788827A (en) * 1972-01-04 1974-01-29 Corning Glass Works Ionic treatment for glass optical waveguide fibers
US4652323A (en) * 1984-01-09 1987-03-24 Olin Corporation Plasma deposition applications for communication cables
US4785805A (en) * 1985-05-28 1988-11-22 Surgical Laser Technologies, Inc. Two-piece disposable laser delivery system
GB2186992B (en) 1986-02-21 1989-11-08 Stc Plc Preparing optical fibres for splicing
US4812002A (en) * 1986-10-24 1989-03-14 Hitachi, Ltd. Optical coupling device and method of making the same
US5002359A (en) * 1990-05-22 1991-03-26 W. L. Gore & Associates, Inc. Buffered insulated optical waveguide fiber cable
US5074638A (en) * 1990-12-18 1991-12-24 Abbott Laboratories Method for joining optical fibers at the fiber interface of a beveled angle fiber optic connector
DE4117449C1 (en) * 1991-05-28 1992-09-17 Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe, De
CA2075610A1 (en) * 1991-08-07 1993-02-08 Chin L. Chang Integrated optics chips and laser ablation methods for attachment of optical fibers thereto for linbo3 substrates
JPH05173038A (en) * 1991-12-26 1993-07-13 Sumitomo Electric Ind Ltd Connecting mechanism between optical waveguide and optical fiber
JPH06247739A (en) * 1993-02-25 1994-09-06 Sumitomo Electric Ind Ltd Device for surface-treating and drawing fluoride optical fiber preform and production of fluoride optical fiber
TW314546B (en) * 1996-12-23 1997-09-01 Nat Science Council Adhesive-free adhesion between polymeric surfaces
JPH10275913A (en) * 1997-03-28 1998-10-13 Sanyo Electric Co Ltd Semiconductor device, its manufacture, and manufacture of thin film transistor
US6137938A (en) * 1997-06-04 2000-10-24 Lasertron, Inc. Flat top, double-angled, wedge-shaped fiber endface
EP1018153A1 (en) * 1997-08-29 2000-07-12 Sharon N. Farrens In situ plasma wafer bonding method
US6043294A (en) * 1998-01-29 2000-03-28 Gate Technologies International, Inc. Method of and apparatus for optically enhancing chemical reactions
JP3455839B2 (en) * 1998-05-18 2003-10-14 日本電気エンジニアリング株式会社 Frame format conversion method and conversion device
JPH11337774A (en) 1998-05-27 1999-12-10 Oki Electric Ind Co Ltd Optical coupler and optical fiber
US6521989B2 (en) * 1998-10-08 2003-02-18 Honeywell Inc. Methods and apparatus for hermetically sealing electronic packages
US6216939B1 (en) 1998-12-31 2001-04-17 Jds Uniphase Photonics C.V. Method for making a hermetically sealed package comprising at least one optical fiber feedthrough
TW518637B (en) * 1999-04-15 2003-01-21 Semiconductor Energy Lab Electro-optical device and electronic equipment
JP3857876B2 (en) * 1999-12-17 2006-12-13 古河電気工業株式会社 Fiber with lens, manufacturing method thereof, manufacturing apparatus and semiconductor laser module
US6320155B1 (en) * 2000-01-11 2001-11-20 Geomat Insights, Llc Plasma enhanced wire bonder
KR100332802B1 (en) * 2000-02-07 2002-04-18 구자홍 Apparatus for evaluating plasma polymerized polymer layer using uv spectrometer
TW452866B (en) * 2000-02-25 2001-09-01 Lee Tien Hsi Manufacturing method of thin film on a substrate
US6355301B1 (en) * 2000-11-02 2002-03-12 3M Innovative Properties Company Selective fiber metallization
FR2818391B1 (en) * 2000-12-19 2003-02-14 Memscap DEVICE FOR POSITIONING AND HOLDING THE END OF AN OPTICAL FIBER WITHIN A SUBSTRATE
JP2002254582A (en) * 2001-03-01 2002-09-11 Tokai Rubber Ind Ltd Adhesive laminate, hose and method for manufacturing them
US20050102025A1 (en) * 2001-03-02 2005-05-12 Gaetan Laroche Plasma surface graft process for reducing thrombogenicity
GB2373344A (en) * 2001-03-16 2002-09-18 Bookham Technology Plc Optical coupling using direct bonding
WO2002103428A1 (en) * 2001-04-30 2002-12-27 Schott Glas Optical fiber alignment plate using sol-gel inorganic adhesive
US6852169B2 (en) * 2001-05-16 2005-02-08 Nordson Corporation Apparatus and methods for processing optical fibers with a plasma
KR100492769B1 (en) * 2001-05-17 2005-06-07 주식회사 엘지이아이 An apparatus for continuous plasma polymerizing with a vertical chamber
DE10149834A1 (en) * 2001-10-09 2003-04-17 Nexans Process for coating a shaped body made of polymeric material
GB2381326A (en) * 2001-10-26 2003-04-30 Bookham Technology Plc Mounting an optical fibre to an optical chip
US6696661B2 (en) * 2001-11-19 2004-02-24 Geomat Insights, Llc Plasma enhanced circuit packaging method and device
US6643446B2 (en) 2001-11-27 2003-11-04 Jds Uniphase Inc. Hermetic fiber ferrule and feedthrough
KR100913647B1 (en) * 2002-07-16 2009-08-24 타이코 일렉트로닉스 레이켐 엔베 Device for oriented cleaving an optical fibre
US6822326B2 (en) * 2002-09-25 2004-11-23 Ziptronix Wafer bonding hermetic encapsulation
JP2004252290A (en) * 2003-02-21 2004-09-09 Nippon Sheet Glass Co Ltd Optical fiber array and its manufacturing method
KR20050034895A (en) 2003-10-10 2005-04-15 삼성전기주식회사 Micro optical communication device package
US7784670B2 (en) * 2004-01-22 2010-08-31 Bondtech Inc. Joining method and device produced by this method and joining unit
JP4686377B2 (en) * 2004-01-22 2011-05-25 ボンドテック株式会社 Joining method and joining apparatus
US7688689B2 (en) * 2004-02-26 2010-03-30 Seagate Technology Llc Head with optical bench for use in data storage devices
US7261793B2 (en) * 2004-08-13 2007-08-28 Hewlett-Packard Development Company, L.P. System and method for low temperature plasma-enhanced bonding
FR2876220B1 (en) * 2004-10-06 2007-09-28 Commissariat Energie Atomique METHOD FOR PRODUCING MIXED STACKED STRUCTURES, VARIOUS INSULATING AREAS AND / OR LOCALIZED VERTICAL ELECTRICAL CONDUCTION ZONES.
FR2884966B1 (en) * 2005-04-22 2007-08-17 Soitec Silicon On Insulator METHOD OF BONDING TWO SLICES REALIZED IN MATERIALS SELECTED AMONG SEMICONDUCTOR MATERIALS
US20070023850A1 (en) * 2005-07-30 2007-02-01 Chien-Hua Chen Bonding surfaces together via plasma treatment on both surfaces with wet treatment on only one surface
US20070023904A1 (en) 2005-08-01 2007-02-01 Salmon Peter C Electro-optic interconnection apparatus and method
US7601271B2 (en) * 2005-11-28 2009-10-13 S.O.I.Tec Silicon On Insulator Technologies Process and equipment for bonding by molecular adhesion
KR101258725B1 (en) * 2006-01-11 2013-04-26 시옵티컬 인코포레이티드 Wideband optical coupling into thin soi cmos photonic integrated circuit
JP4778340B2 (en) * 2006-03-24 2011-09-21 株式会社クボタ Grain discharge auger position control device in a combine.
JP4162094B2 (en) * 2006-05-30 2008-10-08 三菱重工業株式会社 Devices by room temperature bonding, device manufacturing method and room temperature bonding apparatus
JP5034353B2 (en) 2006-07-26 2012-09-26 富士通オプティカルコンポーネンツ株式会社 Optical device manufacturing method
FR2912552B1 (en) * 2007-02-14 2009-05-22 Soitec Silicon On Insulator MULTILAYER STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
JP4925902B2 (en) * 2007-04-12 2012-05-09 信越化学工業株式会社 Optical waveguide device and method for manufacturing optical waveguide device
US7629031B2 (en) * 2007-07-13 2009-12-08 Sub-One Technology, Inc. Plasma enhanced bonding for improving adhesion and corrosion resistance of deposited films
JP4720808B2 (en) * 2007-09-21 2011-07-13 セイコーエプソン株式会社 Adhesive sheet, joining method and joined body
US7939424B2 (en) * 2007-09-21 2011-05-10 Varian Semiconductor Equipment Associates, Inc. Wafer bonding activated by ion implantation
JP5243011B2 (en) * 2007-12-17 2013-07-24 三菱レイヨン株式会社 Manufacturing method of plastic optical fiber cable
US8357457B2 (en) * 2008-08-08 2013-01-22 Green David E Reinforced wood for overcoming interlaminate shear failure
JP2010107597A (en) * 2008-10-28 2010-05-13 Seiko Epson Corp Optical element and method for producing same
US8899844B2 (en) * 2008-12-01 2014-12-02 Ams Research Corporation Optical device
JP5195354B2 (en) * 2008-12-01 2013-05-08 セイコーエプソン株式会社 Optical element
US8278167B2 (en) * 2008-12-18 2012-10-02 Micron Technology, Inc. Method and structure for integrating capacitor-less memory cell with logic
CN101533128B (en) 2008-12-19 2010-11-10 中国科学院微电子研究所 Silicon nanometer optical waveguide and optical fiber coupling and encapsulation method
JP2011017787A (en) * 2009-07-07 2011-01-27 Shinko Electric Ind Co Ltd Optical waveguide layer, opto-electro mixed circuit board and method of fabricating opto-electro circuit board
US20120006468A1 (en) * 2010-07-07 2012-01-12 Schlumberger Technology Corporation Inline plasma treatment of an optical fiber cable structure
JP2012226000A (en) * 2011-04-15 2012-11-15 Seiko Epson Corp Optical element, projection type video apparatus and method for manufacturing optical element
US9329336B2 (en) 2012-07-06 2016-05-03 Micron Technology, Inc. Method of forming a hermetically sealed fiber to chip connection

Also Published As

Publication number Publication date
JP5965063B2 (en) 2016-08-03
US9329336B2 (en) 2016-05-03
WO2014007978A1 (en) 2014-01-09
CN104541191B (en) 2018-03-20
US20210141174A1 (en) 2021-05-13
US20180024304A1 (en) 2018-01-25
US20160216465A1 (en) 2016-07-28
TW201407215A (en) 2014-02-16
JP2015522179A (en) 2015-08-03
US11536915B2 (en) 2022-12-27
US20140010494A1 (en) 2014-01-09
US10935739B2 (en) 2021-03-02
KR101675702B1 (en) 2016-11-11
US9804350B2 (en) 2017-10-31
CN104541191A (en) 2015-04-22
KR20150032735A (en) 2015-03-27
EP2870495A1 (en) 2015-05-13
TWI494625B (en) 2015-08-01
EP2870495B1 (en) 2019-10-30

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