US3788827A
(en)
*
|
1972-01-04 |
1974-01-29 |
Corning Glass Works |
Ionic treatment for glass optical waveguide fibers
|
US4652323A
(en)
*
|
1984-01-09 |
1987-03-24 |
Olin Corporation |
Plasma deposition applications for communication cables
|
US4785805A
(en)
*
|
1985-05-28 |
1988-11-22 |
Surgical Laser Technologies, Inc. |
Two-piece disposable laser delivery system
|
GB2186992B
(en)
|
1986-02-21 |
1989-11-08 |
Stc Plc |
Preparing optical fibres for splicing
|
US4812002A
(en)
*
|
1986-10-24 |
1989-03-14 |
Hitachi, Ltd. |
Optical coupling device and method of making the same
|
US5002359A
(en)
*
|
1990-05-22 |
1991-03-26 |
W. L. Gore & Associates, Inc. |
Buffered insulated optical waveguide fiber cable
|
US5074638A
(en)
*
|
1990-12-18 |
1991-12-24 |
Abbott Laboratories |
Method for joining optical fibers at the fiber interface of a beveled angle fiber optic connector
|
DE4117449C1
(en)
*
|
1991-05-28 |
1992-09-17 |
Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe, De |
|
CA2075610A1
(en)
*
|
1991-08-07 |
1993-02-08 |
Chin L. Chang |
Integrated optics chips and laser ablation methods for attachment of optical fibers thereto for linbo3 substrates
|
JPH05173038A
(en)
*
|
1991-12-26 |
1993-07-13 |
Sumitomo Electric Ind Ltd |
Connecting mechanism between optical waveguide and optical fiber
|
JPH06247739A
(en)
*
|
1993-02-25 |
1994-09-06 |
Sumitomo Electric Ind Ltd |
Device for surface-treating and drawing fluoride optical fiber preform and production of fluoride optical fiber
|
TW314546B
(en)
*
|
1996-12-23 |
1997-09-01 |
Nat Science Council |
Adhesive-free adhesion between polymeric surfaces
|
JPH10275913A
(en)
*
|
1997-03-28 |
1998-10-13 |
Sanyo Electric Co Ltd |
Semiconductor device, its manufacture, and manufacture of thin film transistor
|
US6137938A
(en)
*
|
1997-06-04 |
2000-10-24 |
Lasertron, Inc. |
Flat top, double-angled, wedge-shaped fiber endface
|
EP1018153A1
(en)
*
|
1997-08-29 |
2000-07-12 |
Sharon N. Farrens |
In situ plasma wafer bonding method
|
US6043294A
(en)
*
|
1998-01-29 |
2000-03-28 |
Gate Technologies International, Inc. |
Method of and apparatus for optically enhancing chemical reactions
|
JP3455839B2
(en)
*
|
1998-05-18 |
2003-10-14 |
日本電気エンジニアリング株式会社 |
Frame format conversion method and conversion device
|
JPH11337774A
(en)
|
1998-05-27 |
1999-12-10 |
Oki Electric Ind Co Ltd |
Optical coupler and optical fiber
|
US6521989B2
(en)
*
|
1998-10-08 |
2003-02-18 |
Honeywell Inc. |
Methods and apparatus for hermetically sealing electronic packages
|
US6216939B1
(en)
|
1998-12-31 |
2001-04-17 |
Jds Uniphase Photonics C.V. |
Method for making a hermetically sealed package comprising at least one optical fiber feedthrough
|
TW518637B
(en)
*
|
1999-04-15 |
2003-01-21 |
Semiconductor Energy Lab |
Electro-optical device and electronic equipment
|
JP3857876B2
(en)
*
|
1999-12-17 |
2006-12-13 |
古河電気工業株式会社 |
Fiber with lens, manufacturing method thereof, manufacturing apparatus and semiconductor laser module
|
US6320155B1
(en)
*
|
2000-01-11 |
2001-11-20 |
Geomat Insights, Llc |
Plasma enhanced wire bonder
|
KR100332802B1
(en)
*
|
2000-02-07 |
2002-04-18 |
구자홍 |
Apparatus for evaluating plasma polymerized polymer layer using uv spectrometer
|
TW452866B
(en)
*
|
2000-02-25 |
2001-09-01 |
Lee Tien Hsi |
Manufacturing method of thin film on a substrate
|
US6355301B1
(en)
*
|
2000-11-02 |
2002-03-12 |
3M Innovative Properties Company |
Selective fiber metallization
|
FR2818391B1
(en)
*
|
2000-12-19 |
2003-02-14 |
Memscap |
DEVICE FOR POSITIONING AND HOLDING THE END OF AN OPTICAL FIBER WITHIN A SUBSTRATE
|
JP2002254582A
(en)
*
|
2001-03-01 |
2002-09-11 |
Tokai Rubber Ind Ltd |
Adhesive laminate, hose and method for manufacturing them
|
US20050102025A1
(en)
*
|
2001-03-02 |
2005-05-12 |
Gaetan Laroche |
Plasma surface graft process for reducing thrombogenicity
|
GB2373344A
(en)
*
|
2001-03-16 |
2002-09-18 |
Bookham Technology Plc |
Optical coupling using direct bonding
|
WO2002103428A1
(en)
*
|
2001-04-30 |
2002-12-27 |
Schott Glas |
Optical fiber alignment plate using sol-gel inorganic adhesive
|
US6852169B2
(en)
*
|
2001-05-16 |
2005-02-08 |
Nordson Corporation |
Apparatus and methods for processing optical fibers with a plasma
|
KR100492769B1
(en)
*
|
2001-05-17 |
2005-06-07 |
주식회사 엘지이아이 |
An apparatus for continuous plasma polymerizing with a vertical chamber
|
DE10149834A1
(en)
*
|
2001-10-09 |
2003-04-17 |
Nexans |
Process for coating a shaped body made of polymeric material
|
GB2381326A
(en)
*
|
2001-10-26 |
2003-04-30 |
Bookham Technology Plc |
Mounting an optical fibre to an optical chip
|
US6696661B2
(en)
*
|
2001-11-19 |
2004-02-24 |
Geomat Insights, Llc |
Plasma enhanced circuit packaging method and device
|
US6643446B2
(en)
|
2001-11-27 |
2003-11-04 |
Jds Uniphase Inc. |
Hermetic fiber ferrule and feedthrough
|
KR100913647B1
(en)
*
|
2002-07-16 |
2009-08-24 |
타이코 일렉트로닉스 레이켐 엔베 |
Device for oriented cleaving an optical fibre
|
US6822326B2
(en)
*
|
2002-09-25 |
2004-11-23 |
Ziptronix |
Wafer bonding hermetic encapsulation
|
JP2004252290A
(en)
*
|
2003-02-21 |
2004-09-09 |
Nippon Sheet Glass Co Ltd |
Optical fiber array and its manufacturing method
|
KR20050034895A
(en)
|
2003-10-10 |
2005-04-15 |
삼성전기주식회사 |
Micro optical communication device package
|
US7784670B2
(en)
*
|
2004-01-22 |
2010-08-31 |
Bondtech Inc. |
Joining method and device produced by this method and joining unit
|
JP4686377B2
(en)
*
|
2004-01-22 |
2011-05-25 |
ボンドテック株式会社 |
Joining method and joining apparatus
|
US7688689B2
(en)
*
|
2004-02-26 |
2010-03-30 |
Seagate Technology Llc |
Head with optical bench for use in data storage devices
|
US7261793B2
(en)
*
|
2004-08-13 |
2007-08-28 |
Hewlett-Packard Development Company, L.P. |
System and method for low temperature plasma-enhanced bonding
|
FR2876220B1
(en)
*
|
2004-10-06 |
2007-09-28 |
Commissariat Energie Atomique |
METHOD FOR PRODUCING MIXED STACKED STRUCTURES, VARIOUS INSULATING AREAS AND / OR LOCALIZED VERTICAL ELECTRICAL CONDUCTION ZONES.
|
FR2884966B1
(en)
*
|
2005-04-22 |
2007-08-17 |
Soitec Silicon On Insulator |
METHOD OF BONDING TWO SLICES REALIZED IN MATERIALS SELECTED AMONG SEMICONDUCTOR MATERIALS
|
US20070023850A1
(en)
*
|
2005-07-30 |
2007-02-01 |
Chien-Hua Chen |
Bonding surfaces together via plasma treatment on both surfaces with wet treatment on only one surface
|
US20070023904A1
(en)
|
2005-08-01 |
2007-02-01 |
Salmon Peter C |
Electro-optic interconnection apparatus and method
|
US7601271B2
(en)
*
|
2005-11-28 |
2009-10-13 |
S.O.I.Tec Silicon On Insulator Technologies |
Process and equipment for bonding by molecular adhesion
|
KR101258725B1
(en)
*
|
2006-01-11 |
2013-04-26 |
시옵티컬 인코포레이티드 |
Wideband optical coupling into thin soi cmos photonic integrated circuit
|
JP4778340B2
(en)
*
|
2006-03-24 |
2011-09-21 |
株式会社クボタ |
Grain discharge auger position control device in a combine.
|
JP4162094B2
(en)
*
|
2006-05-30 |
2008-10-08 |
三菱重工業株式会社 |
Devices by room temperature bonding, device manufacturing method and room temperature bonding apparatus
|
JP5034353B2
(en)
|
2006-07-26 |
2012-09-26 |
富士通オプティカルコンポーネンツ株式会社 |
Optical device manufacturing method
|
FR2912552B1
(en)
*
|
2007-02-14 |
2009-05-22 |
Soitec Silicon On Insulator |
MULTILAYER STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
|
JP4925902B2
(en)
*
|
2007-04-12 |
2012-05-09 |
信越化学工業株式会社 |
Optical waveguide device and method for manufacturing optical waveguide device
|
US7629031B2
(en)
*
|
2007-07-13 |
2009-12-08 |
Sub-One Technology, Inc. |
Plasma enhanced bonding for improving adhesion and corrosion resistance of deposited films
|
JP4720808B2
(en)
*
|
2007-09-21 |
2011-07-13 |
セイコーエプソン株式会社 |
Adhesive sheet, joining method and joined body
|
US7939424B2
(en)
*
|
2007-09-21 |
2011-05-10 |
Varian Semiconductor Equipment Associates, Inc. |
Wafer bonding activated by ion implantation
|
JP5243011B2
(en)
*
|
2007-12-17 |
2013-07-24 |
三菱レイヨン株式会社 |
Manufacturing method of plastic optical fiber cable
|
US8357457B2
(en)
*
|
2008-08-08 |
2013-01-22 |
Green David E |
Reinforced wood for overcoming interlaminate shear failure
|
JP2010107597A
(en)
*
|
2008-10-28 |
2010-05-13 |
Seiko Epson Corp |
Optical element and method for producing same
|
US8899844B2
(en)
*
|
2008-12-01 |
2014-12-02 |
Ams Research Corporation |
Optical device
|
JP5195354B2
(en)
*
|
2008-12-01 |
2013-05-08 |
セイコーエプソン株式会社 |
Optical element
|
US8278167B2
(en)
*
|
2008-12-18 |
2012-10-02 |
Micron Technology, Inc. |
Method and structure for integrating capacitor-less memory cell with logic
|
CN101533128B
(en)
|
2008-12-19 |
2010-11-10 |
中国科学院微电子研究所 |
Silicon nanometer optical waveguide and optical fiber coupling and encapsulation method
|
JP2011017787A
(en)
*
|
2009-07-07 |
2011-01-27 |
Shinko Electric Ind Co Ltd |
Optical waveguide layer, opto-electro mixed circuit board and method of fabricating opto-electro circuit board
|
US20120006468A1
(en)
*
|
2010-07-07 |
2012-01-12 |
Schlumberger Technology Corporation |
Inline plasma treatment of an optical fiber cable structure
|
JP2012226000A
(en)
*
|
2011-04-15 |
2012-11-15 |
Seiko Epson Corp |
Optical element, projection type video apparatus and method for manufacturing optical element
|
US9329336B2
(en)
|
2012-07-06 |
2016-05-03 |
Micron Technology, Inc. |
Method of forming a hermetically sealed fiber to chip connection
|