SG11201407822VA - Device and method for separating, at least partially drying and inspecting electronic components - Google Patents
Device and method for separating, at least partially drying and inspecting electronic componentsInfo
- Publication number
- SG11201407822VA SG11201407822VA SG11201407822VA SG11201407822VA SG11201407822VA SG 11201407822V A SG11201407822V A SG 11201407822VA SG 11201407822V A SG11201407822V A SG 11201407822VA SG 11201407822V A SG11201407822V A SG 11201407822VA SG 11201407822V A SG11201407822V A SG 11201407822VA
- Authority
- SG
- Singapore
- Prior art keywords
- international
- separating
- electronic components
- heating source
- partially drying
- Prior art date
Links
- 238000001035 drying Methods 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 2
- 239000000306 component Substances 0.000 abstract 5
- 238000010438 heat treatment Methods 0.000 abstract 3
- 230000008520 organization Effects 0.000 abstract 1
- 238000011179 visual inspection Methods 0.000 abstract 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B3/00—Drying solid materials or objects by processes involving the application of heat
- F26B3/28—Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun
- F26B3/283—Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun in combination with convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microbiology (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Drying Of Solid Materials (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Meat, Egg Or Seafood Products (AREA)
Abstract
(12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 9 January 2014 (09.01.2014) WIPOIPCT (10) International Publication Number WO 2014/007619 A1 (51) International Patent Classification: H01L 21/677 (2006.01) H01L 21/84 (2006.01) H01L 21/67 (2006.01) H01L 29/786 (2006.01) H01L 21/268 (2006.01) H01L 21/02 (2006.01) (21) International Application Number: (22) International Filing Date: (25) Filing Language: (26) Publication Language: PCT/NL2013/050486 3 July 2013 (03.07.2013) English (30) Priority Data: 2009147 6 July 2012 (06.07.2012) English NL (71) Applicant: BESI NETHERLANDS B.V. [NL/NL]; Ratio 6, NL-6921 RW Duiven (NL). (72) Inventor: HUISSTEDE, Jurgen Hendrikus Gerhardus; Oude Haaksbergerweg 18, NL-7471 LM Goor (NL). (74) Agent: VAN DEN HEUVEL, Ir. H.Th.; Julianaplein 4, NL-5211 BC's Hertogenbosch (NL). (81) Designated States (unless otherwise indicated, for every kind of national protection available)'. AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available)'. ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Declarations under Rule 4.17 : — as to applicant's entitlement to apply for and be granted a patent (Rule 4.17(H)) Published: — with international search report (Art. 21(3)) (54) Title: DEVICE AND METHOD FOR SEPARATING, AT LEAST PARTIALLY DRYING AND INSPECTING ELECTRON IC COMPONENTS 32 31 40 41 45 o\ i-H l> o o Fig. 3 © CJ O & (57) Abstract: The invention relates to a device for separating, at least partially drying and inspecting electronic components, com prising: separating means, carrier a for the electronic components, heating source a for generating radiant heat, displacing means for displacing the carrier for the electronic components relative to the heating source, and visual inspection means. The heating source is configured to generate radiant heat in order to selectively heat and evaporate moisture present on the separated electronic compon - ents.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL2009147A NL2009147C2 (en) | 2012-07-06 | 2012-07-06 | DEVICE AND METHOD FOR SEPARATING, AT LEAST PARTIAL DRYING AND INSPECTION OF ELECTRONIC COMPONENTS. |
PCT/NL2013/050486 WO2014007619A1 (en) | 2012-07-06 | 2013-07-03 | Device and method for separating, at least partially drying and inspecting electronic components |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201407822VA true SG11201407822VA (en) | 2014-12-30 |
Family
ID=46800349
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201407822VA SG11201407822VA (en) | 2012-07-06 | 2013-07-03 | Device and method for separating, at least partially drying and inspecting electronic components |
Country Status (11)
Country | Link |
---|---|
US (1) | US9435584B2 (en) |
KR (1) | KR102354147B1 (en) |
CN (1) | CN104396001A (en) |
DE (1) | DE112013003413T5 (en) |
MX (1) | MX344327B (en) |
MY (1) | MY165968A (en) |
NL (1) | NL2009147C2 (en) |
PH (1) | PH12014502583B1 (en) |
SG (1) | SG11201407822VA (en) |
TW (1) | TWI614842B (en) |
WO (1) | WO2014007619A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL2009147C2 (en) * | 2012-07-06 | 2014-01-07 | Fico Bv | DEVICE AND METHOD FOR SEPARATING, AT LEAST PARTIAL DRYING AND INSPECTION OF ELECTRONIC COMPONENTS. |
CN108789892B (en) * | 2018-07-26 | 2020-06-02 | 浙江贝盛新材料科技有限公司 | Cutting production line of high-efficient type monocrystalline silicon piece |
CN108943453B (en) * | 2018-07-26 | 2020-05-22 | 浙江贝盛新材料科技有限公司 | Texturing cutting device for producing monocrystalline silicon wafers |
CN112338833A (en) * | 2020-11-24 | 2021-02-09 | 夏爱成 | Detect computer storage USB flash disk intelligence manufacture equipment of humidity |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02312233A (en) * | 1989-05-26 | 1990-12-27 | Mitsubishi Electric Corp | Drying up process for semiconductor wafer |
US5732476A (en) * | 1992-02-10 | 1998-03-31 | Pare; J.R. Jocelyn | Microwave-assisted separations using volatiles, and apparatus therefor |
KR20060113734A (en) * | 2003-11-18 | 2006-11-02 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Electroluminescent devices and methods of making electroluminescent devices including a color conversion element |
JP2005191550A (en) * | 2003-12-01 | 2005-07-14 | Tokyo Ohka Kogyo Co Ltd | Method for sticking substrates |
US7974739B2 (en) * | 2006-06-27 | 2011-07-05 | Illinois Tool Works Inc. | System and method having arm with cable passage through joint to infrared lamp |
JP2008160011A (en) * | 2006-12-26 | 2008-07-10 | Tokyo Electron Ltd | Substrate treating equipment |
JP5404064B2 (en) * | 2008-01-16 | 2014-01-29 | 株式会社半導体エネルギー研究所 | Laser processing apparatus and semiconductor substrate manufacturing method |
NL2001642C2 (en) * | 2008-05-30 | 2009-12-01 | Fico Bv | Device and method for drying separated electronic components. |
ITUD20080136A1 (en) * | 2008-06-13 | 2009-12-14 | Baccini S P A | PLANT FOR PROCESSING PLATES FOR ELECTRONIC CIRCUITS |
DE102008063229A1 (en) * | 2008-12-19 | 2010-07-01 | Dehn, Michael C. | Felt material with barrier function and component made of felt |
NL2005626C2 (en) * | 2010-11-04 | 2012-05-07 | Fico Bv | CARRIER FOR SEPARATED ELECTRONIC COMPONENTS AND METHOD FOR VISUAL INSPECTION OF SEPARATED ELECTRONIC COMPONENTS. |
NL2009147C2 (en) * | 2012-07-06 | 2014-01-07 | Fico Bv | DEVICE AND METHOD FOR SEPARATING, AT LEAST PARTIAL DRYING AND INSPECTION OF ELECTRONIC COMPONENTS. |
US8904668B2 (en) * | 2012-10-11 | 2014-12-09 | Eastman Kodak Company | Applying heating liquid to remove moistening liquid |
-
2012
- 2012-07-06 NL NL2009147A patent/NL2009147C2/en not_active IP Right Cessation
-
2013
- 2013-07-03 KR KR1020147034968A patent/KR102354147B1/en active IP Right Grant
- 2013-07-03 CN CN201380034390.8A patent/CN104396001A/en active Pending
- 2013-07-03 US US14/412,024 patent/US9435584B2/en active Active
- 2013-07-03 SG SG11201407822VA patent/SG11201407822VA/en unknown
- 2013-07-03 MX MX2014014608A patent/MX344327B/en active IP Right Grant
- 2013-07-03 MY MYPI2014003171A patent/MY165968A/en unknown
- 2013-07-03 DE DE112013003413.1T patent/DE112013003413T5/en not_active Withdrawn
- 2013-07-03 WO PCT/NL2013/050486 patent/WO2014007619A1/en active Application Filing
- 2013-07-05 TW TW102124105A patent/TWI614842B/en active
-
2014
- 2014-11-19 PH PH12014502583A patent/PH12014502583B1/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW201411779A (en) | 2014-03-16 |
KR102354147B1 (en) | 2022-01-24 |
DE112013003413T5 (en) | 2015-03-26 |
KR20150035600A (en) | 2015-04-06 |
CN104396001A (en) | 2015-03-04 |
MX2014014608A (en) | 2015-07-06 |
TWI614842B (en) | 2018-02-11 |
MY165968A (en) | 2018-05-18 |
US9435584B2 (en) | 2016-09-06 |
NL2009147C2 (en) | 2014-01-07 |
US20150143711A1 (en) | 2015-05-28 |
PH12014502583A1 (en) | 2015-01-21 |
MX344327B (en) | 2016-12-13 |
PH12014502583B1 (en) | 2015-01-21 |
WO2014007619A1 (en) | 2014-01-09 |
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