SG11201406479QA - Aluminium coated copper bond wire and method of making the same - Google Patents

Aluminium coated copper bond wire and method of making the same

Info

Publication number
SG11201406479QA
SG11201406479QA SG11201406479QA SG11201406479QA SG11201406479QA SG 11201406479Q A SG11201406479Q A SG 11201406479QA SG 11201406479Q A SG11201406479Q A SG 11201406479QA SG 11201406479Q A SG11201406479Q A SG 11201406479QA SG 11201406479Q A SG11201406479Q A SG 11201406479QA
Authority
SG
Singapore
Prior art keywords
making
same
coated copper
bond wire
aluminium coated
Prior art date
Application number
SG11201406479QA
Other languages
English (en)
Inventor
Eugen Milke
Peter Prenosil
Sven Thomas
Original Assignee
Heraeus Materials Tech Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Materials Tech Gmbh filed Critical Heraeus Materials Tech Gmbh
Publication of SG11201406479QA publication Critical patent/SG11201406479QA/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21F—WORKING OR PROCESSING OF METAL WIRE
    • B21F9/00—Straining wire
    • B21F9/005—Straining wire to affect the material properties of the wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
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    • H01L2924/20303—Ultrasonic frequency [f] 50 Khz=<f< 75 KHz
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12736—Al-base component
    • Y10T428/1275—Next to Group VIII or IB metal-base component

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
SG11201406479QA 2012-05-07 2013-05-07 Aluminium coated copper bond wire and method of making the same SG11201406479QA (en)

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EP12003604.1A EP2662890B1 (en) 2012-05-07 2012-05-07 Method for making an aluminium coated copper bond wire
PCT/EP2013/059520 WO2013167609A1 (en) 2012-05-07 2013-05-07 Aluminium coated copper bond wire and method of making the same

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EP2662889A1 (en) * 2012-05-07 2013-11-13 Heraeus Materials Technology GmbH & Co. KG Aluminium coated copper ribbon
CN104064252A (zh) * 2014-06-13 2014-09-24 安徽省宁国天成电工有限公司 一种镀铝铜线
US20170200534A1 (en) * 2014-07-11 2017-07-13 Heraeus Deutschland GmbH & Co. KG Process for manufacturing of a thick copper wire for bonding applications
CN105355616B (zh) * 2015-11-20 2017-12-19 广东梅雁吉祥实业投资股份有限公司 一种抗氧化金属制品
CN105934803B (zh) * 2016-04-29 2018-02-02 深圳顺络电子股份有限公司 复合导线及其制备方法和一种功率电感的制备方法
US10658326B2 (en) * 2016-07-20 2020-05-19 Samsung Electronics Co., Ltd. Bonding wire having a silver alloy core, wire bonding method using the bonding wire, and electrical connection part of semiconductor device using the bonding wire
JP7293674B2 (ja) * 2019-01-31 2023-06-20 株式会社プロテリアル ボンディングワイヤ
US11532580B2 (en) * 2019-08-29 2022-12-20 Taiwan Semiconductor Manufacturing Company Ltd. Interconnect structure, semiconductor structure including interconnect structure and method for forming the same
CN113981270B (zh) * 2021-10-26 2022-07-12 江西云泰铜业有限公司 一种耐高温铜线的制备方法

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JPS6442138A (en) * 1987-08-07 1989-02-14 Mitsubishi Electric Corp Manufacture of bonding wire for semiconductor element
JP2000031194A (ja) * 1998-07-10 2000-01-28 Fuji Electric Co Ltd ボンディングワイヤおよび半導体装置
KR100717667B1 (ko) * 2000-09-18 2007-05-11 신닛뽄세이테쯔 카부시키카이샤 반도체용 본딩 와이어 및 그 제조 방법
JP2004064033A (ja) * 2001-10-23 2004-02-26 Sumitomo Electric Wintec Inc ボンディングワイヤー
DE102006023167B3 (de) * 2006-05-17 2007-12-13 Infineon Technologies Ag Bonddraht, Herstellungsverfahren für einen Bonddraht und Wedge-Wedge-Drahtbondverfahren
US7935885B2 (en) * 2008-07-11 2011-05-03 Ford Global Technologies, Llc Insulated assembly of insulated electric conductors

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DK2662890T3 (da) 2019-08-26
WO2013167609A1 (en) 2013-11-14
EP2662890B1 (en) 2019-07-03
JP2015519746A (ja) 2015-07-09
KR20150011826A (ko) 2015-02-02
US9966355B2 (en) 2018-05-08
PH12014502393A1 (en) 2014-12-22
US20150155252A1 (en) 2015-06-04
CN104272455B (zh) 2018-09-21
CN104272455A (zh) 2015-01-07
EP2662890A1 (en) 2013-11-13

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