SG11201400765SA - Electrochemical processor alignment system - Google Patents

Electrochemical processor alignment system

Info

Publication number
SG11201400765SA
SG11201400765SA SG11201400765SA SG11201400765SA SG11201400765SA SG 11201400765S A SG11201400765S A SG 11201400765SA SG 11201400765S A SG11201400765S A SG 11201400765SA SG 11201400765S A SG11201400765S A SG 11201400765SA SG 11201400765S A SG11201400765S A SG 11201400765SA
Authority
SG
Singapore
Prior art keywords
alignment system
electrochemical processor
processor alignment
electrochemical
processor
Prior art date
Application number
SG11201400765SA
Inventor
Bryan Puch
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11201400765SA publication Critical patent/SG11201400765SA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49764—Method of mechanical manufacture with testing or indicating
    • Y10T29/49778—Method of mechanical manufacture with testing or indicating with aligning, guiding, or instruction

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
SG11201400765SA 2011-10-06 2012-08-24 Electrochemical processor alignment system SG11201400765SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/267,693 US8968532B2 (en) 2011-10-06 2011-10-06 Electrochemical processor alignment system
PCT/US2012/052230 WO2013052211A1 (en) 2011-10-06 2012-08-24 Electrochemical processor alignment system

Publications (1)

Publication Number Publication Date
SG11201400765SA true SG11201400765SA (en) 2014-09-26

Family

ID=48041122

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201400765SA SG11201400765SA (en) 2011-10-06 2012-08-24 Electrochemical processor alignment system

Country Status (7)

Country Link
US (1) US8968532B2 (en)
KR (1) KR20140085491A (en)
CN (1) CN103843116B (en)
DE (1) DE112012004188T5 (en)
SG (1) SG11201400765SA (en)
TW (1) TWI506169B (en)
WO (1) WO2013052211A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11795566B2 (en) 2020-10-15 2023-10-24 Applied Materials, Inc. Paddle chamber with anti-splashing baffles

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7264698B2 (en) * 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
JP2002220692A (en) 2001-01-24 2002-08-09 Ebara Corp Plating equipment and method
US20030159921A1 (en) * 2002-02-22 2003-08-28 Randy Harris Apparatus with processing stations for manually and automatically processing microelectronic workpieces
US6956223B2 (en) 2002-04-10 2005-10-18 Applied Materials, Inc. Multi-directional scanning of movable member and ion beam monitoring arrangement therefor
CA2511345C (en) * 2002-12-23 2008-08-05 Kenneth Wargon Apparatus and method for displaying numeric values corresponding to the volume of segments of an irregularly shaped item
CN1732371A (en) * 2002-12-23 2006-02-08 肯尼思·沃冈 Apparatus and method for displaying numeric values corresponding to the volume of segments of an irregularly shaped item
JP4303484B2 (en) 2003-01-21 2009-07-29 大日本スクリーン製造株式会社 Plating equipment
CN1829823A (en) * 2003-06-06 2006-09-06 塞米用具公司 Integrated tool with interchangeable processing components for processing microfeature workpieces and automated calibration systems
US7313462B2 (en) * 2003-06-06 2007-12-25 Semitool, Inc. Integrated tool with automated calibration system and interchangeable wet processing components for processing microfeature workpieces
US20050223837A1 (en) * 2003-11-10 2005-10-13 Blueshift Technologies, Inc. Methods and systems for driving robotic components of a semiconductor handling system
CN1902031A (en) * 2003-11-10 2007-01-24 布卢希弗特科技公司 Methods and systems for handling workpieces in a vacuum-based semiconductor handling system
US8082932B2 (en) 2004-03-12 2011-12-27 Applied Materials, Inc. Single side workpiece processing
EP1626283B1 (en) 2004-08-13 2011-03-23 STMicroelectronics Srl Micro-electromechanical structure, in particular accelerometer, with improved insensitivity to thermomechanical stresses
US7452568B2 (en) 2005-02-04 2008-11-18 International Business Machines Corporation Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation
DE102005011197B4 (en) 2005-03-09 2013-03-07 Komet Group Gmbh Rotary transmission and thus equipped machine frame
JP2009517543A (en) 2005-11-23 2009-04-30 セミトゥール・インコーポレイテッド Apparatus and method for vibrating liquids during wet chemical processing of microstructured workpieces
CN101389415A (en) * 2006-02-22 2009-03-18 赛迈有限公司 Single side workpiece processing
KR20080023172A (en) * 2006-09-08 2008-03-12 주성엔지니어링(주) Apparatus for etching substrate edge
US20080061034A1 (en) * 2006-09-08 2008-03-13 Jusung Engineering Co., Ltd. Etching apparatus and etching method using the same
US7811422B2 (en) 2007-02-14 2010-10-12 Semitool, Inc. Electro-chemical processor with wafer retainer

Also Published As

Publication number Publication date
DE112012004188T5 (en) 2014-06-26
KR20140085491A (en) 2014-07-07
US8968532B2 (en) 2015-03-03
US20130086787A1 (en) 2013-04-11
WO2013052211A1 (en) 2013-04-11
TW201315841A (en) 2013-04-16
CN103843116A (en) 2014-06-04
TWI506169B (en) 2015-11-01
CN103843116B (en) 2016-10-19

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