CN101389415A - Single side workpiece processing - Google Patents

Abstract

A centrifugal workpiece processor for processing semiconductor wafers and similar workpieces includes a head which holds and spins the workpiece. The head includes a rotor having a gas system. Gas is sprayed or jetted from inlets in the rotor to create a rotational gas flow. The rotational gas flow causes pressure conditions which hold the edges of a first side of the workpiece against contact pins on the rotor. The rotor and the workpiece rotate together. Guide pins adjacent to a perimeter may help to align the workpiece with the rotor. The rotor may have cylindrical side walls joined to a top plate, and with the gas inlets located in the cylindrical sidewalls. The head is moveable into engagement with a bowl. Spray nozzles in the bowl spray a process liquid onto the second side of the workpiece, as the workpiece is spinning, to process the workpiece.

Description

Single side workpiece is handled

Background technology

[0001] in past few years, the marked improvement in the field of microelectronic devices has brought various types of more practical and more cheap electronic products.This has also brought brand-new product category.A principal element of microelectronic component development is to be used to make its machine and method.The manufacturing of microelectronic component needs high precision, extremely pure material and spick-and-span manufacturing environment.Even the particle of microscopic can both cause the flaw and the damage of device.

[0002] microelectronic component is made on the front side of semiconductor wafer or device-side usually.Usually, there is not microelectronic component to be positioned on the rear side of wafer.Yet, the pollutant on the wafer rear side, for example metallic, residue, film etc. if it is not removed, can damage the device of wafer front side.For example, some metal such as the copper that adopt in the fabrication schedule can pass wafer and move to the front side from rear side, and they can cause the flaw of microelectronic component at this.Therefore very important to the processing at wafer back.

[0003] rear side of wafer can adopt existing technology to handle, to remove pollutant.These technology comprise wafer when rotation usually, apply process fluid (process fluid) on rear side.Yet if the front side of process fluid contact wafer, process flow is known from experience the damage microelectronic component.Therefore, usually when rear side is handled, or during one-sided processing, process fluid is preferably accomplished minimum or is that opposite side does not contact with the front side of wafer.Because process fluid comprises liquid, gas or steam, and when it was used, wafer normally rotated, and in present processing of wafers technology, this target still can't realize to a great extent.

[0004] the processing of wafers machine has adopted various design, to attempt to solve the problem how when handling rear side process fluid to be got rid of from the front side.Some adopts inert gas in these machines, attempts process fluid is limited to rear side.Other some machines adopt the mechanical seal or the barrier of packing ring, film or other type, so that process fluid is avoided the top side of wafer.Yet in the machine that uses air-flow, some process fluid still tends to the front side or the device-side of contact wafer.In the machine that uses mechanical seal, sealing must contact with the device-side physics of wafer.This physics contact may damage microelectronic component.Therefore, the use of sealing or physical barrier may have serious defective.

[0005] contacts with the physics of wafer by sealing, finger piece (finger), clip or other sealing, fixing or setting element,, can produce pollution risk because particle takes place or particle discharges just as what at present common handling machine, adopted.The element of these types can also be upset evenly flowing of process fluid on wafer, cause different processing ranks in the zones of different of wafer.Therefore, no matter be to handle one or both sides, minimize to contact usually and can obtain better result with the physics of wafer (wafer).On the other hand, in processing, wafer must suitably be placed and be fixing.Therefore, need better machine and method,, and contact (physical contact) with the less physics of wafer generation usually when handling so that provide single side wafers to handle.

Summary of the invention

[0006] the invention provides that the wafer rear side that is used to solve this class problem is handled and the new handling machine and the method for wafer physics contact problems.These machines and method are being made microelectronics and are similarly being produced significant the improvement in the device.On the one hand, in the present invention, recyclegas is provided for a side of wafer.In the processing procedure of wafer rear side, recyclegas produces air pressure and flox condition, thereby keeps process fluid away from the front side.Therefore, can adopt the chemicals of relative broad range to handle rear side, not damage the microelectronic component danger of side before and can not bring.

[0007] recyclegas flow can also be by gas pressure, during handling, wafer is retained on the appropriate location.Air-flow that recyclegas produced and pressure condition can apply retain strength at Waffer edge, and the not supporting zone of wafer central authorities is only applied relatively little power or do not apply power.Thereby wafer firmly is retained on the appropriate location during handling, and imposes on the stress minimum of wafer.Like this, during handling front side or rear side or both, contact with the physics of wafer and to be minimized.This has reduced the possibility of polluting, and has improved chip yield.Thereby, can go out the device chip that more share from each wafer manufacture.

[0008] adopts the processing of wafers machine of recyclegas can comprise groove seat (bowl), be used for process fluid is applied to first side of wafer with one or more process fluid inlets.This machine has the head that can be set to engage with the groove seat (engagement) during workpiece is handled.Produce rotation gas in the rotor on being supported in head.A method that produces swirling eddy is, in rotor according to tangent with direction of rotation or near tangent direction release pressurized gas.Swirling eddy is retained on appropriate location on the rotor or in the rotor with wafer, and contacts minimum with the physics of wafer.When wafer rotated around rotor, fluid intake was applied to one or more process fluids on first side of wafer.Except wafer is retained on the appropriate location, for one-sided processing, the swirling eddy in the rotor also can be used for process fluid is got rid of outside second side of wafer.In a design, wafer can be arranged on the rotor, and is provided with the gap around the edge of wafer.The part or all of recyclegas that enters rotor overflows from this gap and around the edge of wafer.Any process fluid having avoided being applied on first side that outwards flows of this gas arrives second side.

[0009] in another design, near the edge of wafer, rotor can have a kind of ring edge contact ring, and it contacts with wafer or seals the butt wafer.The air flow path relevant with the EDGE CONTACT ring will guide the edge away from wafer from the gas that rotor overflows.The process fluid that is applied on the wafer bottom surface centers on the edge of wafer, and only flows on one on wafer top surface fringe region that clearly limits.Rotor also can have the ring edge contact ring of another kind of type, the edge of its contact wafer, and stop any process fluid to move on the end face of wafer basically.The present invention also comprises other compound mode of its service machine and method.

Description of drawings

[0010] in the drawings, identical Reference numeral is represented components identical.For the sake of clarity, omitted the pipe-line of electric wire and gas and liquid among the figure.

[0011] Fig. 1 has shown the cutaway view of operating principle of the present invention.

[0012] Figure 1A is the cutaway view along the line 1A-1A of Fig. 1.

[0013] Figure 1B is the cutaway view of another kind of design.

[0014] Fig. 2 is the top perspective view of workpiece processor.

[0015] Fig. 3 is the side view of processor shown in Figure 2, is positioned to open or the position of load/unload.

[0016] Fig. 4 is the cutaway view along the line 4-4 among Fig. 2.

[0017] Fig. 5 is the cutaway view of processor shown in Figure 3.

[0018] Fig. 6 is the top perspective view of head shown in Fig. 2-5, and in order to illustrate, lid is removed.

[0019] Fig. 7 is the top perspective view of rotor shown in the Figure 4 and 5.

[0020] Fig. 8 is the face upwarding stereogram of rotor shown in Figure 7.

[0021] Fig. 9 is the cutaway view along the line 9-9 among Fig. 7.

[0022] Fig. 9 A is the amplification view at the edge of rotor shown in Fig. 7-9.

[0023] Fig. 9 B is the amplification view at the edge of another kind of rotor.

[0024] Fig. 9 C is the amplification view at the edge of another rotor.

[0025] Fig. 9 D is the part amplification view of another rotor.

[0026] Figure 10 is a kind of face upwarding stereogram of selectable rotor design.

[0027] Figure 11 is the cutaway view along the line 11-11 among Figure 10.

[0028] Figure 12 be a kind of comprise several shown in Fig. 2-9 stereogram of the Work piece processing system of processor.

[0029] Figure 13 is the plane of system shown in Figure 12.

[0030] Figure 14 is the element shown in Figure 12 or the stereogram of subsystem.

[0031] Figure 15 is a kind of selected element of selectable treatment system and the stereogram of subsystem.

[0032] Figure 16 is the stereogram of one of processing components shown in Figure 15.

[0033] Figure 17 is the cutaway view along the line 17-17 among Figure 16.

[0034] Figure 18 is the stereogram of the groove seat shown in Figure 16 and 17.

[0035] Figure 19 is a kind of schematic diagram of selectable treatment system.

The specific embodiment

[0036] the present invention relates to handle the apparatus and method of workpiece such as semiconductor wafer.Term workpiece, wafer or semiconductor wafer are represented the medium or the article of any plane, comprise that semiconductor wafer and other substrate or wafer, glass, blindage and optics or memory media, MEMS substrate or any other have the workpiece of microelectronic, micromechanics or micro electronmechanical device.

[0037] consult Fig. 1, processor 20 can carry out one-sided processing to be handled.One-sided processing is only represented to apply one or more process fluids in a side (being expressed as rear side herein) of wafer, and process fluid second of contact wafer (preceding) side not fully.Selectively, the hypotenuse that process fluid can contact wafer.Process fluid can be liquid, gas or steam.In Fig. 1, processor 20 comprises the rotor 24 that links to each other with the rotation motor of head 22.Pilot pin 25 can be along the periphery setting of rotor 24, thereby helps guiding wafer 100 in-positions.Gas nozzle or enter the mouth 26 to the spraying of direction or eject gas, it produces gas swirl and flows in rotor 24.The direction of having represented air-flow at the arrow 23 of Fig. 1 and 1A.Produce negative pressure or area of low pressure in the space of this air-flow above wafer 100.Thereby, can utilize pressure that wafer 100 is remained on the rotor 24.

[0038] consult Fig. 1, rotor 24 can design like this, and the edge of wafer and the annular opening between the rotor are unique overflow paths of gas.In this design, because gas overflows or flow and to leave rotor 24, gas has stoped wafer 100 to contact with rotor 24 basically.The wafer main support is on the motion gas backing, or the passive movement gas backing holds up.Pilot pin 25 can minimize, and perhaps limits any lateral movement of wafer in rotor 24.

[0039] still consult Fig. 1, head 22 can be placed on or move to pedestal or groove seat 28 and collimate mutually or engage.The one or more nozzles or enter the mouth of process fluid from the groove seat 28 29 are applied on the rear side of wafer.During handling, motor 84 drives rotor 24 rotations.Wafer 100 is with rotor 24 rotations.Process fluid is applied to the rear side of wafer.In Fig. 1, rear side is to lower surface.The air-flow that overflows from rotor 24 is as the isolation barrier of wafer front side.Because gas constantly outwards flows, and does not have process fluid can be moved in the rotor 24 or the top side of contact wafer.Therefore, can obtain single side wafers processing efficiently.

[0040] consult Fig. 1 and 1A now, air-flow is by arrow 23 expressions.Rotor is designed to produce swirling eddy.Near inlet 26 (periphery of adjacent rotor), air velocity is higher relatively, and air pressure is relatively lower.Towards or in centre of rotor, air velocity is relatively low, and air pressure is relatively higher.Therefore, wafer is remained on the pressure on the appropriate location of rotor, (negative pressure is the highest herein) is the highest near Waffer edge, and is minimum towards the center.Towards or in centre of rotor, air velocity can be zero or near zero.Therefore the Pneumatic pipe cleaner regular meeting in internal rotor zone is small negative pressure, neutrality or even small malleation.Thereby the fringe region of wafer can keep and the rotor butt securely, and minimum pressure is applied to the center of wafer.Therefore can reduce the bending stress on the wafer.

[0041] Figure 1B has represented a kind of design, and rotor 24B has the diameter bigger than wafer 100.In this design, wafer is positioned at rotor 24B fully.Rotor 24B according to Fig. 1 and 1A in the same mode of rotor move.Yet wafer is by leg or sell 27 surfaces that are kept away from rotor 24B.In this design, do not need pilot pin 25, because the cylindrical side wall energy of rotor prevents that wafer 100 from excessively moving away from the center.

[0042] in each design described herein, gas can change from the mode that rotor overflows.In Fig. 1, gas overflows through the annular opening between Waffer edge and the rotor.In the design shown in Figure 1B, overflow the annular gap between the edge of gas process wafer and the cylindrical side wall of rotor.Yet, can adopt other gas to overflow opening, adopt separately or combine employing with opening and the gap shown in Fig. 1 and the 1B.For example, the gas vent shown in the dotted line of Fig. 1 147 can adopt in rotor.Gas vent 147 can be hole, groove or other opening.Gas vent 147 can be positioned at epitrochanterian any position, and can adopt any form that helps aforesaid swirling eddy.

[0043], can adopt with wafer and produce the sealing that physics contacts for some technology and wafer.In these application scenarios, the contact potted component, sealing ring 149 for example shown in Figure 1 provides physical seal during also being used in processing between rotor and wafer.Above-mentioned negative pressure or vacuum condition make the edge of wafer and sealing ring 149 firmly keep butt.Gas vent 147 in the rotor provides overflow path for air-flow.Because wafer contacts with the physics of sealing ring, alignment pin 25 can omit, and has avoided any the moving of wafer during handling to a great extent.

[0044] Fig. 2-5 has represented an example of processor 50, and it can adopt the above-mentioned principle relevant with Fig. 1 to move.Yet Fig. 2-5 has represented the present invention and non-essential various add ons.Shown in Fig. 2-5, processor 50 comprises head 80 and groove seat 78.Groove seat 78 can be supported on the installing plate 70 that is connected on the deck 52.Shown in Fig. 6 and 7, rotation motor 84 can be supported on the base plate 88 of head 80, and is covered by head-shield 82.Rotor 92 is driven and rotation in head 80 by rotation motor 84 usually.Yet motor 84 can omit with other technology of convenient employing and come rotor.

[0045] head 80 engages with groove seat 78.Especially, in order to handle, head 80 can move to the position with groove seat 78 adjacent (but not contacting), and perhaps head 80 can contact with groove seat 78 physics, perhaps even with groove seat 78 seals butts, as shown in Figure 4.

[0046] shown in Figure 4 and 5, groove seat 78 has liquid spray nozzles or enters the mouth 112, so that process fluid is applied to the back side that remains on the workpiece 100 in the head 80 or to lower surface.Nozzle or enter the mouth and 112 can be fixed on the side of groove seat 78 or the position of bottom surface.Selectively, some or all in the nozzle 112 can move, for example, and on rocking arm.Also can adopt the combination of fixing and moving nozzle 112.Have the fixing or mobile injection spray pipe of a plurality of nozzles or inlet, also can in groove seat 78, adopt.Can also gas or steam be applied on the workpiece 100 via nozzle 112.Drainpipe 114 is collected the process fluid of inefficacy so that it is discharged from groove seat 78.One or more valves 116 can be associated with drainpipe 114.Groove seat leg 110 if adopt, is connected on the groove seat and upwards protrudes out from the groove seat 78 workpiece 100 on headward 80.As shown in Figure 5, head 80 can be left groove seat 78 by vertical-lift by the head lifter (not shown) that is connected on the head via head lift arm 90, as shown in Figure 4.

[0047] Fig. 6 has represented head 80, and for clear, lid 82 and other element are removed.Head gas feedthroughs 102 carries gas or clean dry air to pass base plate 88 to gas ports 96 easily, thereby provides air-flow moving between base plate 88 and rotor 92.Process fluid is avoided in the mobile help of this head gas or clean dry air, and steam or gas move into head 80, reduces the corrosion of head elements thus.But head ring 94 connecting rings are around the outside of base plate 88.Expansion sealing element 98 can be provided in the groove of head ring, and it can make head 80 sealing butt groove seats 78 during handling.Element shown in Figure 6 is the part of head 80, is supported by head lift arm 90, and does not rotate.

[0048] consult Fig. 7 now, 8 and 9, in the example shown, rotor 92 has the drive plate 130 on the axostylus axostyle 124 that is connected to wheel hub 122.Axostylus axostyle 124 locks onto on the rotation motor 84 of head 80.Chuck 132 is connected on the drive plate 130 by screw 128 or other securing member.Shown in Fig. 8 and 9, pilot pin 134 is from the outer rim 142 of chuck 132 extend out (or downwards).Pilot pin 134 can have taper or tapered portion 135.As shown in Figure 9, contact plug 154 protrudes out out from chuck outer rim 142 a little.Contact plug 154 is than pilot pin 134 short and radial settings in pilot pin 134.

[0049] still consult Fig. 9, chuck 132 has usually vertical junction haply and is incorporated into cylindrical side wall 138 on top board or the web 148.O shape ring or other seal 144 if adopt, are connected on the drive plate 130 outer surface of chuck 132 or periphery sealing.The web of chuck 132 or top plate portion 148 are usually by clearance G and drive plate 130 be spaced apart (except securing member 128 tie points).

[0050] gas is supplied with, for example nitrogen, perhaps clean dry air, under pressure, connect the supply line of head 80, through being connected to labyrinth type cap 126 (Fig. 4 of motor shell, 5 and 7 represent), and enter into the suction line 86 that extends through the sleeve pipe 125 in the axostylus axostyle 124.Sleeve pipe 125 is connected on the drive plate 130, and rotation in cap 126.

[0051] air-flow moving (being expressed as in design downwards) that offers head 80 passes suction line 86, and as shown in Figure 9, radially outward flows in the clearance G between chuck 132 and drive plate 130, shown in Fig. 7 and 9, arrives gas access 136.Dish-like clearance G provide from suction line 86 to the gas access 136 flow channel.The gas access 136 that is positioned at the sidewall 138 of chuck 132 is arranged to according to tangent fully with cylindrical side wall 138 or spray or spray gas to the tangent direction of small part.Inlet is directed so that make gas direction and sidewall tangent, or in 40,30,20 or 10 of tangent line is spent.A plurality of gas accesses 136, for example, 3,4,5,6,7 or 8 gas accesses 136 advantageously are spaced apart radially and are arranged on the sidewall 138, near the top board or the web 148 of chuck 132.The number of gas access 136, shape, structure and position naturally can change, and make workpiece 100 remain on the stream condition of appropriate location on the rotor 92 because can produce with various design.O shape ring or seal 144 can be used for stoping gas except through the gas access 136, overflow from clearance G.

[0052] sidewall 138 of the outer rim 142 on the chuck plate 132 forms the space specified haply 155 with diameter D and the degree of depth or height H on chuck 132, as shown in Figure 9.Size H is consistent haply, except centering on the middle section of wheel hub 122.

[0053] purpose in order to aim at can provide central opening on chuck plate 132.If adopt, before rotor 92 was brought into use, opening was closed by embolism 146.Consult Fig. 8 and 9 now, pilot pin 134 is placed on diameter DD place, and diameter DD is less times greater than the diameter (it is successively less times greater than cylindrical or dish-like space 155 diameter D) of workpiece 100.Therefore, workpiece is placed in the rotor 92, as shown in Figure 4, between the edge of pilot pin 134 and workpiece, only have only very little radially or the side direction clearance.

[0054] consult Fig. 3, processor 50 be positioned at upwards or open position so that load or unload.Shown in design in, head lift arm 90 raises head 82 from groove seat 78.Workpiece 100 is moved the position that enters between head 82 and the groove seat 78, and workpiece 100 is aimed at rotor 92 haply.Workpiece is moved vertically upward subsequently, and pilot pin 134 is around the outer ledge of workpiece.Workpiece is positioned at or is higher than the plane P of pilot pin 134 at this moment, as shown in figure 11.The loading campaign of these workpiece can manually be carried out, or by manipulator, as further describing hereinafter.

[0055] gas is fed into rotor 92 subsequently.Consult Fig. 8 this moment, because the tangential direction roughly of gas access 136 and air-flow gateway 136 is high-speed relatively, produces swirling eddy or eddy current in space 155, between the top board 148 of workpiece and chuck 132.Air-flow in the space 155 is annular.Gas can leave the space by flowing around the edge of workpiece 100 and enter in the groove seat 78 subsequently.155 perimeter produces negative pressure or vacuum in the space for this, causes workpiece to be held up and breaks away from manipulator 44.The negative pressure of workpiece 100 tops connects the end face of workpiece and contact plug 154 in the outer areas space 155.This has stoped workpiece with respect to rotor 92 rotations or mobile.Contact plug 154 can comprise the bulb that in fact contacts with wafer point.Selectively, contact plug can have contacted end on very little area, for example, and on the diameter of 0.2-3mm.

[0056] normal force that is used to make workpiece 100 and contact plug 154 to connect is dependent on the pressure differential that is produced by the eddy current air-flow, and at the surf zone of workpiece upward pressure effect.Normal force can be adjusted by the control air-flow.Generally, normal force can obviously surpass the weight of workpiece, so workpiece keeps and contact plug 154 connects, no matter it is with respect to the direction of gravity.Contact plug 154 can be unique surface of supporting workpiece, is arranged on the 2-10 of the edge of work usually, 4-8, or in the 5-7mm.

[0057] subsequently, head lifter reduces head lift arm 90 and head 80, head from as shown in Figure 5 open position move to as shown in Figure 4 close or handle the position.If adopt seal 98, it can expand, and forms part or complete sealing between head 80 and groove seat 78.

[0058] unique overflow path of gas is a little annular opening between the wheel rim 142 of workpiece and chuck 132 in space 155.When gas 155 overflows from the space, it is easy to prevent that workpiece 100 from contacting with any part of chuck 132 or rotor 92 or processor 50, except contact plug 154.Otherwise in fact workpiece 100 can be suspended in the air-flow.If necessary, pilot pin 134 can be used for preventing that workpiece 100 from moving the center of too far leaving the rotating shaft of rotor 92.Yet usually, around the air-flow of the edge of work, and the normal force that keeps workpiece and contact plug 154 to connect, can be tending towards workpiece is remained on the center.

[0059] rotation motor 84 is opened, rotor 92 and workpiece 100.Generally, stream swirl is rotated according to the direction identical with the rotor rotation in rotor.Process fluid is from nozzle or enter the mouth and 112 sprayed or be ejected into the bottom surface of rotational workpieces 100 or on lower surface.Also can adopt and handle gas or steam.Centrifugal force helps process fluid is assigned on the whole bottom surface of workpiece 100.Air-flow in the rotor 92 also helps to stop the end face of any process fluid or gas contact workpiece 100, because the space of the space above workpiece below workpiece has constant gas flow.

[0060] after applying process fluid and/or gas, wafer can be selected to be rinsed and/or be dry, equally in as shown in Figure 4 position.When in the processor 50 all are finished dealing with, with the step of above-mentioned reverse order after workpiece 100 unloaded.

[0061] when rotor keeps workpiece 100, the air-flow that flows to rotor 92 interrupts, and may cause the mobile of workpiece 100 or drop out rotor 92.In order to reduce the possibility of damaging in this case, as shown in Figure 4, groove seat strut 110 is arranged in the groove seat 78 and in the below of workpiece 100 (when being positioned at the processing position) and extends upward about 10-15 millimeter.Interrupt if air-flow takes place, workpiece only can fall one section very short distance and be supported on the pillar 110.

[0062] after gas flowed out from rotor 92, it entered gas discharge pressure stabilizing chamber 120 and flows away from processor 50 subsequently.Depend on the particular procedure of operation in processor 50, chuck 132 and drive plate 130 can be selected to adopt corrosion-resistant material to make, for example PVDF plastic material or equivalent.The rotor 92 that is as above disclosed, and in fact whole head 80 can be used for any centrifugal treating, wherein handles chemicals, is generally liquid, is applied on the only side of workpiece.Processor 50 is expressed as and is positioned at upright and vertical position, but it also can be in other position or direction use.Therefore, provided herein is for examples shown is described for end face or bottom surface and upward and description downwards, and and nonessential or necessary running parameters.

[0063] in described each embodiment, the front side of wafer or device side can towards or deviate from rotor.For rear side cleans or handles, wafer be placed in the rotor and device side towards rotor.In order to clean or to handle in the front side, wafer is placed in the rotor and the front side deviates from rotor.Can pass through robot or manual handle, obtain the face up/face down orientation of the expectation of rotor.Also can adopt independent upset or wafer counter-rotating work station.

[0064] generally, the gas that offers rotor is inertia, and just, it can not produce obvious chemical reaction with wafer.Yet, also can adopt the processing chemical gas to replace inert gas.Provide the processing chemical gas to allow wafer face is carried out chemical treatment to the side of rotor to rotor, can select to adopt simultaneously same processing chemical gas to handle the another side of wafer, or adopt different processing chemical gas or liquid.

[0065] is appreciated that by top description head 50 does not need to keep or the moving component of fixation workpiece 100.Because air-flow is used for workpiece is remained on the appropriate location, head 80 can adopt relatively simply design.In addition, generally, most of element can adopt chemically compatible plastic material.This has reduced the demand to the hardware that may cause polluting.Not having barrier or element is positioned on the workpiece 100 or covers workpiece 100.This makes the process fluid that is assigned on the workpiece very consistent, causes more unified with consistent processing.Pilot pin 134 is the edge of contact workpiece only.Contact plug 154 is the very little zone of contact workpiece 100 front sides or top side only.Therefore, be minimized with contacting of workpiece 100.

[0066] Fig. 9 A is the enlarged drawing of the external margin of rotor 92 shown in Figure 9.The gas that offers in the rotor 92 outwards flows out rotor, as shown by arrow G.Be applied to the bottom surface of wafer 100 or outwards flow, drive by centrifugal force towards the edges of wafer to the process fluid 101 of lower surface.Depend on different factors, rotary speed for example, flow and viscosity, process fluid 101 can surround the edge of wafer and the inside a bit of distance of motion (common some millimeters) on end face.The outside motion of gas is tending towards reducing the inside motion of process fluid on end face, and can form variation the line of demarcation (on end face near with the perimeter at the contacted edge of process fluid, and not between the interior zone of contact process fluid).Make in the processing at some, preferably have consistent line of demarcation.

[0067] Fig. 9 B has represented a kind of selectable rotor design 400, and except described herein, it is identical with rotor 92.Rotor 400 has the EDGE CONTACT ring 404 that is connected to rotor ring 402.EDGE CONTACT ring 404 can be the separation annular loop member that is connected on the rotor ring 402, and for example, by securing member, perhaps it can be used as the part manufacturing of rotor ring 402.Air flow path roughly by 408 expressions, forms between EDGE CONTACT ring 404 and rotor ring 402 in Fig. 9 B.Air flow path 408 can be entered the chamfering annular groove 410 in the rotor ring 402 and be connected the gas vent 412 that enters in the cell body 410 and form by cutting.Enter the lower inside opening place that air flow path 408 interior inlets 415 are positioned at cell body 410.

[0068] still consults Fig. 9 B, the edge of internal edge 405 contact wafers 100 of EDGE CONTACT ring 404.In use, be applied to outwards motion and can be of process fluid on the bottom surface of wafer 100 around the edge of wafer 100, shown in Fig. 9 A.The internal edge 405 of EDGE CONTACT ring 404 is as the sealing or the physical barriers of the process fluid on the wafer top surface.Internal edge 405 can be flexible and have the smooth bottom surface of sealing butt wafer top surface.Process fluid can contact internal edge 405, does not cross it but process fluid can not move.The gas of supplying with rotor 400 flows out from rotor by air flow path 408.The pressure of gas is tending towards preventing the motion between the internal edge 405 of EDGE CONTACT ring 404 and wafer 100 of any process fluid.Thereby the processing of rotor 400 forms very consistent line of demarcation.Consult Fig. 9 B, rotor 400 only allows process fluid at annular outer edge area 416 places contact upper surface.The width of annular outer edge area 416 is set to the size at the edge 418 of wafer 100 by the internal edge 405 from EDGE CONTACT ring 404, and usually about 1 or 2 to about 8 or 10mm, more typical is about 2 or 3mm.

[0069] Fig. 9 C represents except described herein, another rotor 420 identical with rotor 92.Rotor 420 has the edge ring contact site 424 that is connected to rotor ring 422.Similar with rotor 400, in rotor 420, form air flow path 428.Air flow path 428 is formed with extending internally to pass rotor ring and be connected the gas vent that enters cell body 430 by annular trough body 430.Waffer edge contact surface 434 on the edge ring contact site 424 is orientated angle EA.On cutaway view, the bottom surface 435 of contact surface 434 and rotor 420 forms the recess 436 of isosceles-trapezium-shaped.Contact surface 434 forms chamfering sidewall outwards tapered to the bottom from the top or that taper is extended.The angle EA of contact surface 434 is usually in about 15 to 45 ° of scopes.

[0070] in use, wafer 100 remains in the rotor 420, and the top edge of wafer or chamfering contact with surface 434, shown in Fig. 9 C.This has produced the linear of contact 440 between wafer 100 and surface 434.Air-flow flows out rotor 420 through air flow path 428.The process flow that is applied on the wafer bottom surface is known from experience the edge that outwards flow to wafer, shown in Fig. 9 A.Process flow cognition flows to the edge of wafer and arrives on the edge of wafer, but does not arrive on the end face of wafer.The linear of contact 440 stops process fluid to move on the end face of wafer 100 as sealing or barrier.Gas pressure in the air flow path 428 also is tending towards avoiding any process fluid motion to cross contact wire 440.Thereby, contact with process fluid the zone and and the discontiguous zone of process fluid between the line of demarcation, be positioned on the edge of wafer 100.On the wafer with smooth edge and upper and lower chamfer surface, contact wire 440 (and the line of demarcation that produces) is positioned on the upper bevel.On the wafer with radial or circular edge, contact wire 440 is positioned on the first half of circular edge.

[0071] still consult Fig. 9 C, the angle EA on surface 434 can change according to the edge configuration of the wafer that will handle.Thereby can conveniently choosing, angle EA provides contact wire 440, preferably the contact area of a broad.Therefore, surface 434 does not advantageously lie low and is resisted against the chamfer surface of wafer 100.Nominally the diameter DD that selects annular surface 434 midpoint is complementary with the diameter of the wafer that will handle, for example 200 or 300mm.The diameter of wafer may change a little according to manufacturing tolerance, and any given wafer can high slightly or low slightly placement on surface 434.In Fig. 9 B and 9C, the arrow with afterbody has been represented the gas motion of process rotor.Rotor shown in Fig. 9 A-D can be mainly or fully by plastic material manufacturing, for example PVDF.

[0072] Fig. 9 D has represented another kind of rotor 450, and except rotor 450 was more suitable for being used for LED reverse mounting type, it was identical with rotor 92 shown in Figure 9.About 0.030 inch (0.75mm) is thick for the silicon wafer of standard.Yet LED reverse mounting type uses in many application now.Common 0.002 to 0.010 inch of this class LED reverse mounting type (0.05 to 0.25mm) is thick, and more typical be that 0.003,0.004 or 0.007 inch (0.08,0.10 or 0.18mm) is thick.Because these LED reverse mounting types are more frangible than standard wafer, the machine and the method that are used for operating and handle standard wafer but can not be worked for LED reverse mounting type well.

[0073] in Fig. 9 D, be supported near the edge of wafer 100 on the contact plug 154, cylindrical or dish-like space or opening 155 are on wafer.As mentioned above, in Fig. 9 D, because the speed of air-flow is being the highest near periphery P P place in the rotor, the pressure differential between the space of the space of wafer top and wafer below is being the highest near periphery P P place also.Thereby, be the highest also by the normal force that vortex gas produced and keep wafer to enter in the rotor near periphery P P place.Because contact plug 154 is provided with near periphery P P, giving wafer by normal force is lower near the bending stress that peripheral place applies.

[0074] speed of gas, and normal force reduces towards the centre of rotor place.Yet, still have usually some normal force near or work around centre of rotor.When in rotor 92 as shown in Figure 9, handling the wafer of standard thickness,, thereby be the enough low wafer of avoiding damaging in the pressure and the deflection that cause by normal force away from periphery P P place.Yet, in rotor 92, handle LED reverse mounting type and may cause excessive deflection (being bent upwards) and broken or other damage.

[0075] consults Fig. 9 D,, use embolism 146 in order to offset the trend that LED reverse mounting type is bent upwards.This allows gas to flow downward and comes out and direct end face at the center of wafer bump wafer from gas access pipeline 86.This gas flow is with respect to the normal force effect that makes progress.Therefore near the active force up and down the center of wafer is roughly offset.Being bent upwards of LED reverse mounting type is reduced or avoids subsequently.Therefore rotor 450 can handle thin wafers and do not damage them.Still consult Fig. 9 D, can be chosen in provides one or more mechanical support pins 454 on the rotor, so that avoid excessively being bent upwards of LED reverse mounting type.Yet, adopt air-flow to avoid being bent upwards the effect that can reach identical, and, therefore, reduce the possibility that causes pollution or flaw without the physical basis wafer.

[0076] shown in Fig. 9 D, nozzle 452 can be arranged on the bottom of gas access pipeline 86.Nozzle can improve the speed that gas flows out from gas access pipeline 86, forms bigger downward active force in the center of wafer or the center of close wafer.Also can provide other similar gas vent or nozzle in other position of rotor, on other zone of wafer, apply downward power.The gas that comes out from the outlet of nozzle 452 moves downward, and the end face of contact wafer outwards moves towards the edge of wafer 100 then, overflows from rotor together with the gas from gas access 136.Outside air-flow is tending towards avoiding the liquid of any wafer bottom surface that is applied to or steam along the border movement of wafer and arrive the end face of wafer.Therefore improved one-sided, or the only processing of bottom side.

[0077] Figure 10 and 11 has represented a kind of selectable rotor 160.Except following described difference, rotor 160 is similar with rotor 92.As shown in figure 10, on a side, rotor 160 has short guide pins 162.All the other pilot pins 134 are full length guide pins, and the tip of pilot pin 134 is extended wheel rim 142 size K and arrived plane P.The size that full height guide pins 134 and workpiece retainer 166 are spaced apart is bigger than the diameter of workpiece 100.L shaped workpiece retainer 166 is connected on the drive plate 130 and has the radial horizontal leg that extends internally.Short guide pins 162 produces access path 164, allows workpiece 100 laterally to move into rotor 160 (different with the above-mentioned vertical workpiece motion s with respect to rotor shown in Fig. 7-9).By transverse movement, manipulator 44 can be aimed at rotor 160 with wafer 100 haply, moves then workpiece 100 is placed on the retainer 166.Each retainer 166 preferably have the flat area 168 of supporting workpiece 100 to the upper end.Thereby manipulator 44 can be regained other function in the executive system 30 then, does not work even include the processor of rotor 160.Therefore, although there is not gas flow to pass through rotor 160, workpiece 100 also can be placed and enter in the rotor 160.

[0078] at rotor shown in Figure 11 160, contrast rotor 92 shown in Figure 9, be to be designed for the workpiece of operation than minor diameter.For example, rotor 92 shown in Figure 9 is designed for the workpiece of 300mm diameter, and rotor 160 shown in Figure 11 is designed for the workpiece of 200mm diameter.Certainly, rotor can manufacture various other size and is used to handle the workpiece with different size.

[0079] above-mentioned processor can be used for automated processing system.Figure 12 has represented the example of a treatment system 30.Treatment system 30 has shell 32 usually, control/display 34 and I/O or docking station (docking station) 36.(for example, wafer in FOUPs) or workpiece are removed and processing system 30 in by slave box 38 places at 36 places, I/O station for shell or machine box 38.

[0080] consult Figure 13, treatment system 30 preferably includes framework 48, its in shell 32 on the deck array of 52 upper support workpiece processor 50.End face in system 30 provides the simple and easy air intake 42 together with air cleaner.Each workpiece processor 50 can be configured to handle workpiece, and for example 200 or the semiconductor wafer of 300mm diameter or similar workpiece, it can be arranged in the machine box 38 of sealing, in the box body of opening, or in other carrier or the container.

[0081] ten workpiece processor 50 have been supported in framework 48 expressions of Figure 13, but can comprise the processor 50 of any desired quantity.Framework 42 preferably comprises one or more centralized positioning tracks 46 between processor 50.Thereby one or more manipulators 44 can move on track 46 and workpiece loading or unloading are entered processor 50 and come out from processor 50.

[0082] consults Figure 12-14, in use, workpiece or wafer 100 are moved in the container 38 of treatment system 30 usually, and for example front openings modular housing (front opening unified pods) is (FOUPs) or similarly in the closable or sealable container.Selectively, can adopt the container of opening, for example box body or other carrier.At docking station or I/O station 36,, generally can remove via subsystem manipulator or automation if container 38 has door or lid.If in shell 32, comprise any loading side port (port door) or window, can be opened.Manipulator 44 is removed workpiece 100 and it is transported to one of processor 20 or 50 from container 38.Workpiece 100 is ready for being loaded into processor subsequently.Natural, the order of step, and the element or the device that are used for workpiece 100 is moved to processor can change, and be not most important to the present invention.Yet for illustrative purposes, the order shown in above-mentioned and Figure 12-14 has been represented an example.

[0083] consults Fig. 5 now.Flow-sensint unit in the head 80 can be used for checking air-flow, can regain safely to controller 34 indication manipulators 44.Manipulator 44 moves down and away from rotor 92.Inductor examining workpieces 100 on the manipulator 44 no longer is positioned on the manipulator 44.Robot arm retrieves and away from processor 50 then.The above-mentioned operation of processor operation then.

[0084] Figure 15-18 has represented another selectable system 180.The said elements and the operation of consulting Figure 12 are applicable to system shown in Figure 15 180 too.System 180 shown in Figure 15 is similar with the system 30 shown in Figure 12-14.Yet processor module 182 is mounted on the deck 52 in the shell 32, replaces processor 50.Shown in Figure 16 and 17, one or more processor modules 182 comprise the processor 184 that can be connected on the installing plate 188, and lifting/rotary unit 186.Promote rotary unit 186 and be connected to head 80, replace being used for the head lifter that the system 30 shown in Figure 12-14 is adopted by head lift arm 90.Except with head 80 vertical lift and away from the groove seat 78, lifting/rotary unit 186 can also overturn or rotate head 80 and enter upside down position.

[0085] as shown in figure 16, airhood 190 is arranged on the end face of wheel rim 192, wheel rim 192 be supported on the wheel rim pillar 194 and be positioned at processor 184 above.Electric wire passes line guiding 198, and line guiding 198 extends to installing plate 188 from the end face near shell 32 haply.Consult Figure 16 and 17, dry processing rocking arm 196 is supported on the rocking arm actuator 200 that is positioned on the installing plate 188 and by it and drives, and is positioned at a side of processor 184.

[0086] head 80 shown in Figure 17 with shown in Fig. 2-9 and above-mentioned head 80 similar or identical.Head 80 shown in Figure 17 can engage with groove seat 204.Groove seat 204 advantageously comprises the top 210 with cylindrical upper end 212, mid portion 208 and base plate 206.Groove seat 204 also comprises the reciprocal spraying rocking arm 220 that is driven by actuator 222.One or more sprayings or injection nozzle are provided on rocking arm 220 or enter the mouth 218.Groove seat 204 is similar with above-mentioned groove seat 78 in addition.By the processing chemicals that nozzle or inlet applied on groove seat 78 or 204 can be aq acid soln, HF for example, HCL, nitric acid or thiosulfonic acid.Selectively, handle chemicals and can comprise liquid flux.Lifting rotary unit 186 can be arranged on head 80 the various upright position with respect to pedestal.

[0087] consult Fig. 4 and 17, processor module 50 and 182 is expressed as vertical direction, and arrow U refers to (just, the direction with gravity is opposite) vertically upward.Arrow U also is expressed as and the rotor rotating shaft coaxle.Joggle or angular region 302 are in the cylindrical upper end 212 at the top 210 of groove seat 204, and cylindrical extension between the cover 304 down.Cylindrical upper end 212 and cylindrical down cover 304 can be vertical haply or near vertical surface.The angular region 302 that connects them is oriented in the angle with the about 20-70 of vertical direction ° or 30-60 ° or 40-50 ° degree.The lower end of angular region 302 (under this angular region 302 connects, covering 304) haply with the end face of exhaust pressure stabilizing chamber 120 near or be positioned at same upright position.Cover 304 lower end and angular region 304 down a little at interval, annular air-flow path 305 is provided.

[0088] edge of rotation wafer haply with angular region 302 perpendicular alignmnets, the liquid of breaking through wafer 100 be tending towards downward bias from, towards the bottom of groove seat 204.This has reduced splashing back and forth on wafer.Annular lip outlet duct or pressure stabilizing chamber 120 are around cover 304 settings down.The gas outlet pipe that is positioned at haply on the groove seat opposite side connects 306, enters in the passing away 120.Slight vacuum can be applied to pipe and connect, and guiding is from the air-flow of groove seat, arrives passing aways 120 and connects 306 via pipe subsequently through passage 305 and discharge from processor.Through the typical airflow of processor at about 60-200, the scope of 100-170 or 120-150 litre per minute.

[0089] head 80 of processor 184 is according to the same way as operation of the head 80 relevant with above-mentioned Fig. 2-9.Nozzle on the rocking arm 220 or enter the mouth 218 is applied to process fluid on the bottom surface of workpiece 100.Also can adopt the fixed nozzle or the inlet that have or do not have the rocking arm nozzle.When this is finished dealing with, lifting/rotary unit 186 head 80 is raise and the rotation head to position upwards, just, be positioned at processing position shown in Figure 17 wafer to lower surface, be moved to upwards position.Rotor 92 rotations, the dry rocking arm 196 of handling is applied to drying fluid on the workpiece 100.Dry processing rocking arm 196 is from workpiece centre or close workpiece centre place begins and radially outside edge towards workpiece moves, thereby as the 11/075th, No. 099 described such dry workpiece of U.S. Patent application, is incorporated herein by and consults.Opening in the outer cover 190 helps to disperse and/or the downward air of control process processor module 182 flows.

[0090] consults Figure 18, optical end point detector 310 can be set on rocking arm 220.End point detector can adopt as the 11/288th, No. 770 described element of U.S. Patent application or step, is incorporated herein by and consults.Controller can comprise the software of the signal that integration is provided by mobile terminal point probe 310.This can be by reducing over etching cripetura processing time and improve output.

[0091] when the inswept workpiece of arm to upper surface the time, the dry rocking arm 196 of handling applies ionized water (DI) and nitrogen and solvent usually, such as IPA vapor (isopropyl alcohol vapor).Similarly processing can be selected to be carried out by the rocking arm on the groove seat 204 220.Other process fluid or gas comprise ozone gas (ozone gas), perhaps dissolve and/or are present in ozone gas in the liquid such as DI for example, also can be applied in via fixing or moving nozzle or the inlet in groove seat 78 or 204.

[0092] is inverted or during when head, keeps continuously through the air-flow of rotor 92, thereby keep workpiece 100 to make its butt contact plug 154 towards the top.When head from as shown in figure 17 when upper/lower positions rotates to upwards the position, keep workpiece to make it be connected to that normal force remains on workpiece 100 on the rotor 92 equally on the contact plug 154.

[0093] Figure 19 has represented a kind of selectable system design 230, and it has processor or processor module 50 or 182, and they are arranged on the arc 234, or other array or form, rather than the linear array shown in Figure 12 and 15.Workpiece 100 can move into processor 50 or 182 by independent manipulator 232 and also therefrom come out.Represented and automation described or robot system 30 and 180, head 80 and rotor 92 and 160 can be used to comprise other various system of manual operation and/or separate processor machine.

[0094] term is cylindrical, circle, or annular also comprises manifold shape.That term engages or engage and comprise the actual physical contact, and allow to cooperate with each other between the element and do not have the close position of physics contact between them.Term eddy current or stream swirl represent to have haply the gas flow of annular feature, and comprise spiral helicine, helical and similarly mobile.Term gas comprises basic gas, nitrogen for example, oxygen, ozone, carbon dioxide, and other is used for the gas that semiconductor is made, and they and air and steam mixture.The plural number that adopt in this place also comprises odd number, and vice versa.Term is connected to or is supported in and comprises simultaneously directly and be connected or interact indirectly.Term is upper and lower, and end face and bottom surface, can intercourse use, unless can clear and definite a certain direction from context or the position be necessary.Expression has also been described new system and method.Naturally, can make the various variation that is equal to, substitute and use, and do not break away from the spirit and scope of the present invention.Therefore, except being equal to of following claim and they replaced it, the present invention should not be limited.

[0095] the application is to be on January 3rd, 2007 and present unsettled U.S. Patent application the 11/619th applying date, No. 515 part continuity application, and this application is to be on February 22nd, 2006 and present unsettled U.S. Patent application the 11/359th applying date, No. 969 part continuity application, and the 11/359th, No. 969 is to be on March 8th, 2005 and present unsettled U.S. Patent application the 11/075th applying date, No. 099 part continuity application, and requiring the applying date is the priority of No. the 60/552nd, 642, the U.S. Provisional Patent Application on March 12nd, 2004.The application also is to be the part continuity application of No. the 11/172nd, 162, on June 30th, 2005 and at present unsettled U.S. Patent application the applying date.The application also is to be the part continuity application of No. the 11/288th, 770, on November 28th, 2005 and at present unsettled U.S. Patent application the applying date.These applications are incorporated herein by consults.

Claims (59)

1, a kind of workpiece processor, it comprises:

Groove seat with one or more process fluid inlets;

In workpiece processing processing procedure, the head that can engage with described groove seat;

Be supported on the described head, and can be with respect to described head rotor rotated; And

Swirling eddy system in described rotor.

2, processor as claimed in claim 1, wherein, described swirling eddy system comprises the gas access that is provided for producing swirling eddy.

3, processor as claimed in claim 1, it further comprises the pilot pin of contiguous described rotor periphery.

4, processor as claimed in claim 1, wherein, described rotor comprises drive plate and is connected to the chuck plate and the air flow path between described drive plate and chuck plate of this drive plate.

5, processor as claimed in claim 4, it further comprises the sealing between described drive plate and chuck plate.

6, processor as claimed in claim 4, wherein, described rotor comprises chuck plate, and this chuck plate has the cylindrical side wall on the surface plate of being connected to, and described gas access is positioned on the described cylindrical side wall.

7, processor as claimed in claim 1, it further comprises and is arranged in the motor that described head is used for rotating said rotor.

8, processor as claimed in claim 1, wherein, the process fluid inlet in the described groove seat comprises the nozzle that sprays described process fluid on lower surface that is used at described workpiece.

9, a kind of centrifugal workpiece processor comprises:

Groove seat with one or more process fluid inlets;

Head above described groove seat; And

Being connected to also can be with respect to described head rotor rotated on the described head, and wherein, described rotor has cylindrical side wall haply, and has one or more gas accesses on this sidewall.

10, processor as claimed in claim 9, the pilot pin that it further comprises the neighboring that is positioned at described rotor, the position that makes workpiece remain on the described rotor, be limited by described pilot pin inboard.

11, processor as claimed in claim 9, it further comprises and is positioned at described epitrochanterian contact plug.

12, processor as claimed in claim 9, it further comprises and is arranged in the air flow path that described rotor is connected with described gas access.

13, processor as claimed in claim 12, it further comprises being positioned at and is connected to the axostylus axostyle on the plate on the described rotor and has the head that is connected to motor on the described rotor, wherein, described air flow path comprises the inlet cannula that extends through described motor, axostylus axostyle and plate.

14, a kind of centrifugal workpiece processor, it comprises:

Pedestal with one or more process fluid inlets;

Be movable to the head on the described pedestal;

Be positioned at the rotor on the described head, it has plate and the cylindrical side wall that is connected on this plate;

The device that is used for rotating said rotor;

With the airflow apparatus that described rotor is cooperated, it is used for producing partial vacuum at the periphery place of described rotor.

15, processor as claimed in claim 14, it further comprises, with the guiding device that described rotor is cooperated, its be used to keep workpiece basically with described rotor alignment.

16, processor as claimed in claim 14, wherein, described gas device is included in the interior device that produces the eddy current air-flow of cylindrical side wall of described rotor.

17, a kind of method of handling workpiece, it comprises:

Thereby guiding gas enters in the space of rotor between a surface of first side of described workpiece and described rotor and produces stream swirl, described stream swirl produces negative pressure in the edge of closing on described workpiece, and this negative pressure keeps the edge of described workpiece to be positioned on the described rotor;

Rotating said rotor and workpiece; And

Contact second side of described workpiece with process fluid.

18, method as claimed in claim 17, it further comprises, contacts the edge of described workpiece by described epitrochanterian pilot pin, and described workpiece is aimed at the rotating shaft of described rotor.

19, method as claimed in claim 17, wherein, portion gas overflows between the edge of described workpiece and described rotor at least, and the described gas that overflows has stoped described process fluid to contact first side of described workpiece basically.

20, method as claimed in claim 17, it further comprises, is connected on the described epitrochanterian seal by the edge of described negative pressure described workpiece, thereby with the edge and the described rotor seal butt of described workpiece.

21, method as claimed in claim 17, wherein, to the tangent direction of the cylindrical side wall of small part and described rotor, the gas under the release pressure makes it enter described rotor, flows thereby produce eddy current.

22, method as claimed in claim 17, wherein, described rotor supports and further comprises and moves described head so that close with a groove seated connection on head, and by the atomizing of liquids that makes progress of the one or more nozzles from this groove seat, thereby contact second side of described workpiece with process liquid.

23, a kind of centrifugal Work piece processing system, it comprises:

The array of processor, wherein, at least one described processor comprises:

Groove seat with at least one process fluid inlet;

With the head that described groove seat engages, this head comprises rotor, and this rotor has plate and the sidewall that is connected on this plate, wherein, is provided with directed gas access in the described rotor, so that provide swirling eddy in described sidewall; And

At least one manipulator, it is transported to one or more described processors with workpiece.

24, system as claimed in claim 23, it further comprises, around the shell of described processor array and the I/O station that is positioned at described shell one side, wherein, described manipulator moves to one or more described processors from described I/O station.

25, a kind of workpiece processor, it comprises:

Head;

Be supported on described head, and can be with respect to this head rotor rotated, this rotor has the gas access, it is arranged in and produces swirling eddy in the described rotor; Described swirling eddy provides lower pressure region closing on place, described gas access, and provides higher pressure span at contiguous described centre of rotor place.

26, workpiece processor as claimed in claim 1, it further comprises and being positioned at or near the gas access of the central position of described rotor.

27, workpiece processor as claimed in claim 1, it further is included in described epitrochanterian EDGE CONTACT ring, this EDGE CONTACT ring has internal edge, be suitable for described rotor in workpiece contact in the edge of this workpiece.

28, workpiece processor as claimed in claim 3, wherein, described pilot pin is arranged on the ring with diameter D1, and further on described rotor, comprise the EDGE CONTACT ring, this EDGE CONTACT ring comprises the internal edge with diameter D2, and wherein, D2 is than the little 4-20mm of D1.

29, workpiece processor as claimed in claim 27, wherein, the internal edge of described EDGE CONTACT ring is suitable for contacting with described workpiece in the inside position of 2-7mm radially from the edge of described workpiece.

30, workpiece processor as claimed in claim 27, it further comprises the air flow path in the described rotor, this air flow path has the air flow path inlet at the internal edge place of described EDGE CONTACT ring.

31, workpiece processor as claimed in claim 30, wherein, described inlet is to be formed by the annular trough body that the Plane of rotation with described rotor acutangulates extension.

32, workpiece processor as claimed in claim 30, wherein, described air flow path is suitable for guiding gas to leave from the edge of work that is retained in the described rotor.

33, workpiece processor as claimed in claim 1, it further is included in described epitrochanterian EDGE CONTACT ring, and it has and is suitable for the EDGE CONTACT surface of touching with the side edge of workpiece.

34, workpiece processor as claimed in claim 1, it further is included in described epitrochanterian one or more leg pins, its contiguous described epitrochanterian middle position, the wafer that is used for avoiding being retained on described rotor excessively is bent upwards.

35, method as claimed in claim 17, it further comprises the moving step that arrives first side of described wafer of steering current.

36, method as claimed in claim 17, wherein, described process fluid flows around the edge of described wafer, and arrives on first side of described wafer.

37, method as claimed in claim 36, it further comprises, in the edge near described wafer, makes the ring edge contact ring contact first side of described wafer, thereby described process fluid is limited in outer edge zone may on described wafer first side.

38, method as claimed in claim 37, it comprises that further guiding is from the edge of described rotor effluent air away from wafer.

39, method as claimed in claim 17, it further comprises the edge that contacts described wafer with an edge contact surface, moves on first side of described wafer to stop described process fluid.

40, a kind of workpiece processor, it comprises:

Groove seat with one or more process fluid inlets;

Angular region in described groove seat;

In the workpiece processing procedure, the head that can engage with described groove seat;

Be supported on the described head, and can be with respect to the head rotor rotated, this head can move to a position, the workpiece in this position is retained on described rotor is aimed at the angular region of described groove seat haply.

41, processor as claimed in claim 40, wherein, that described groove seat further comprises is upper end, described contiguous angular region, columniform groove seat upper end, and lower end, contiguous described angular region basically, columniform cover down basically.

42, processor as claimed in claim 41, wherein, coaxial and parallel with described cover down basically on the described groove seat.

43, processor as claimed in claim 41, wherein, the diameter of described groove seat upper end is approximately the described 75-99% of cover diameter down.

44, processor as claimed in claim 41, it further comprises and is positioned at sealing on the described head, that can combine with groove seat upper end.

45, processor as claimed in claim 41, it further comprises basically around the described passing away of cover down.

46, processor as claimed in claim 41, it further comprises the passing away that is arranged in described pedestal, and be arranged in described groove seat sidewall, connect this passing away passage.

47, processor as claimed in claim 40, wherein, described groove seat comprises first and is connected to the second portion of first; Wherein, described angular region is positioned in the first, described first have upper end, contiguous described angular region, basically columniform groove seat upper end and lower end, contiguous described angular region, columniform cover down basically.

48, processor as claimed in claim 47, wherein, described second portion have with described down cover almost coaxial, columniform sidewall basically.

49, processor as claimed in claim 40, it further comprises the swirling eddy system, this swirling eddy system has the gas access that is used to produce swirling eddy.

50, processor as claimed in claim 40, it further comprises the pilot pin of the periphery of contiguous described rotor.

51, processor as claimed in claim 40, wherein, described rotor comprises drive plate and is connected to the chuck plate of this drive plate, and the air flow path between described drive plate and chuck plate.

52, a kind of workpiece processor, it comprises:

Groove seat with one or more process fluid inlets;

Rocking arm in the described groove seat;

End point detector on the described rocking arm;

Head, it has can be with respect to its rotor rotated, and

Be connected to the head lifter on the described head.

53, workpiece processor as claimed in claim 52, wherein, described end point detector further comprises light source and photo-detector, and transparent (translucent) lid of cover this light source of dress and photo-detector.

54, a kind of centrifugal workpiece processor, it comprises:

Pedestal with one or more process fluid inlets;

Mobile head on the described pedestal;

Be suitable for keeping the rotor of workpiece on the described head;

Be connected to the motor of described rotor in the described head; And

Mobile end points sniffer in the described pedestal.

55, processor as claimed in claim 54, wherein said mobile end points sniffer comprises rocking arm.

56, a kind of method of handling workpiece, it comprises:

Guiding gas enters rotor, thereby produce stream swirl in the space between a surface of first side of workpiece and described rotor, this stream swirl produces negative pressure in the edge of contiguous described workpiece, and this negative pressure is retained on the edge of described workpiece on the described rotor;

Rotating said rotor and workpiece;

Contact second side of described workpiece with process fluid; And

Make the process fluid deflection of breaking through described workpiece leave described workpiece by angled surface.

57, method as claimed in claim 56, it further comprises, contacts the edge of described workpiece by making described epitrochanterian pilot pin, thereby described workpiece is aimed at the rotating shaft of described rotor.

58, a kind of method that is used to handle workpiece, it comprises:

Fixing workpiece on rotor;

Around rotating shaft rotating said rotor and workpiece;

Contact second side of described workpiece with process fluid;

With respect to described rotating shaft mobile terminal point probe, to detect end points to be processed.

59, method as claimed in claim 58, it comprises that further described end point detector is moved in front and back on a rocking arm.

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