SG111951A1 - Mold cleaning apparatus - Google Patents

Mold cleaning apparatus

Info

Publication number
SG111951A1
SG111951A1 SG200204125A SG200204125A SG111951A1 SG 111951 A1 SG111951 A1 SG 111951A1 SG 200204125 A SG200204125 A SG 200204125A SG 200204125 A SG200204125 A SG 200204125A SG 111951 A1 SG111951 A1 SG 111951A1
Authority
SG
Singapore
Prior art keywords
cleaning apparatus
mold cleaning
mold
cleaning
Prior art date
Application number
SG200204125A
Other languages
English (en)
Inventor
Shu Chuen Ho
Teng Hock Kuah
Jie Liu
Zhen Rong Huang
Chin Guan Ong
Original Assignee
Asm Tech Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asm Tech Singapore Pte Ltd filed Critical Asm Tech Singapore Pte Ltd
Publication of SG111951A1 publication Critical patent/SG111951A1/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/70Maintenance
    • B29C33/72Cleaning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/1753Cleaning or purging, e.g. of the injection unit

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
SG200204125A 2001-07-09 2002-07-05 Mold cleaning apparatus SG111951A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/901,256 US6736627B2 (en) 2001-07-09 2001-07-09 Mold cleaning apparatus

Publications (1)

Publication Number Publication Date
SG111951A1 true SG111951A1 (en) 2005-06-29

Family

ID=25413828

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200204125A SG111951A1 (en) 2001-07-09 2002-07-05 Mold cleaning apparatus

Country Status (5)

Country Link
US (1) US6736627B2 (de)
EP (1) EP1275484B1 (de)
MY (1) MY122885A (de)
SG (1) SG111951A1 (de)
TW (1) TWI282112B (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070047437A1 (en) * 2005-08-24 2007-03-01 Rainer Bachl Method and apparatus for controlling retransmissions in a wireless communications system
JP2016168732A (ja) * 2015-03-12 2016-09-23 ファナック株式会社 金型清掃を行う射出成形システム
CN108189288B (zh) * 2018-03-01 2024-04-16 日荣半导体(上海)有限公司 扫模板和扫模设备
PL4043173T3 (pl) * 2021-02-15 2024-02-19 Klingspor Windpower Aps Urządzenie do obróbki powierzchni formy i zastosowanie urządzenia

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3872539T2 (de) * 1987-02-10 1993-02-25 Sumitomo Chemical Co Automatische vorrichtung zum reinigen eines extrusionsplastometers fuer thermoplastische materialien.
JPH05192741A (ja) 1992-01-18 1993-08-03 Toyota Motor Corp 金型清掃装置
JPH07156157A (ja) 1993-12-09 1995-06-20 Fujitsu Miyagi Electron:Kk 樹脂成形金型のクリーニング方法及びクリーニング装置
NL1003366C2 (nl) * 1996-06-18 1997-12-19 Fico Bv Inrichting en werkwijze voor het omhullen van produkten.
JPH11151722A (ja) 1997-11-20 1999-06-08 Bando Chem Ind Ltd ワーク取出装置
JP3825161B2 (ja) 1997-12-02 2006-09-20 株式会社サイネックス 半導体モールド装置
JPH11198151A (ja) 1998-01-20 1999-07-27 Hitachi Ltd 成形金型クリーニング用シートおよびそれを用いた成形金型のクリーニング方法
JP3834782B2 (ja) 1998-04-11 2006-10-18 アピックヤマダ株式会社 樹脂成形用モールド金型装置

Also Published As

Publication number Publication date
US6736627B2 (en) 2004-05-18
EP1275484B1 (de) 2006-09-20
MY122885A (en) 2006-05-31
US20030008027A1 (en) 2003-01-09
EP1275484A3 (de) 2003-08-27
EP1275484A2 (de) 2003-01-15
TWI282112B (en) 2007-06-01

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