SG111189A1 - Heterojunction bipolar transistor with self-aligned emitter and sidewall base contact - Google Patents

Heterojunction bipolar transistor with self-aligned emitter and sidewall base contact

Info

Publication number
SG111189A1
SG111189A1 SG200404413A SG200404413A SG111189A1 SG 111189 A1 SG111189 A1 SG 111189A1 SG 200404413 A SG200404413 A SG 200404413A SG 200404413 A SG200404413 A SG 200404413A SG 111189 A1 SG111189 A1 SG 111189A1
Authority
SG
Singapore
Prior art keywords
self
bipolar transistor
base contact
heterojunction bipolar
sidewall base
Prior art date
Application number
SG200404413A
Inventor
Jian Xun Li
Lap Chan
Purakh Raj Verma
Jia Zhen Zheng
Shao-Fu Sanford Chu
Original Assignee
Chartered Semiconductor Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chartered Semiconductor Mfg filed Critical Chartered Semiconductor Mfg
Publication of SG111189A1 publication Critical patent/SG111189A1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66234Bipolar junction transistors [BJT]
    • H01L29/66242Heterojunction transistors [HBT]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/08Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/0804Emitter regions of bipolar transistors
    • H01L29/0817Emitter regions of bipolar transistors of heterojunction bipolar transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70Bipolar devices
    • H01L29/72Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/73Bipolar junction transistors
    • H01L29/737Hetero-junction transistors
    • H01L29/7371Vertical transistors
    • H01L29/7378Vertical transistors comprising lattice mismatched active layers, e.g. SiGe strained layer transistors
SG200404413A 2003-10-09 2004-08-10 Heterojunction bipolar transistor with self-aligned emitter and sidewall base contact SG111189A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/683,142 US6924202B2 (en) 2003-10-09 2003-10-09 Heterojunction bipolar transistor with self-aligned emitter and sidewall base contact

Publications (1)

Publication Number Publication Date
SG111189A1 true SG111189A1 (en) 2005-05-30

Family

ID=34422669

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200404413A SG111189A1 (en) 2003-10-09 2004-08-10 Heterojunction bipolar transistor with self-aligned emitter and sidewall base contact

Country Status (2)

Country Link
US (1) US6924202B2 (en)
SG (1) SG111189A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7049240B2 (en) * 2003-11-10 2006-05-23 United Microelectronics Corp. Formation method of SiGe HBT
US8064493B2 (en) * 2009-06-12 2011-11-22 Binoptics Corporation Surface emitting photonic device
EP2418681B1 (en) * 2010-08-10 2017-10-11 Nxp B.V. Heterojunction Bipolar Transistor and Manufacturing Method
US8501572B2 (en) * 2010-09-02 2013-08-06 Taiwan Semiconductor Manufacturing Company, Ltd. Spacer structure for transistor device and method of manufacturing same
FR2999799A1 (en) 2012-12-19 2014-06-20 St Microelectronics Sa BIPOLAR TRANSISTOR WITH HETEROJUNCTION
US10553633B2 (en) * 2014-05-30 2020-02-04 Klaus Y.J. Hsu Phototransistor with body-strapped base
US9825157B1 (en) * 2016-06-29 2017-11-21 Globalfoundries Inc. Heterojunction bipolar transistor with stress component
US10510685B2 (en) * 2017-09-29 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Dishing prevention columns for bipolar junction transistors

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0785476B2 (en) * 1991-06-14 1995-09-13 インターナショナル・ビジネス・マシーンズ・コーポレイション Emitter-embedded bipolar transistor structure
EP0535350B1 (en) * 1991-09-23 1998-04-08 Siemens Aktiengesellschaft Process for the manufacture of a side-limited monocrystalline region in a bipolar transistor
KR100233834B1 (en) * 1996-12-09 1999-12-01 한흥섭 Method for manufacturing si/sige bipolar transistor
US5773350A (en) * 1997-01-28 1998-06-30 National Semiconductor Corporation Method for forming a self-aligned bipolar junction transistor with silicide extrinsic base contacts and selective epitaxial grown intrinsic base
US6169007B1 (en) * 1999-06-25 2001-01-02 Applied Micro Circuits Corporation Self-aligned non-selective thin-epi-base silicon germanium (SiGe) heterojunction bipolar transistor BicMOS process using silicon dioxide etchback
US6664574B2 (en) * 2001-09-05 2003-12-16 Semiconductor Components Industries Llc Heterojunction semiconductor device and method of manufacturing
US6861323B2 (en) * 2003-02-21 2005-03-01 Micrel, Inc. Method for forming a SiGe heterojunction bipolar transistor having reduced base resistance

Also Published As

Publication number Publication date
US6924202B2 (en) 2005-08-02
US20050079658A1 (en) 2005-04-14

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