SG111095A1 - Procedure for the fixation of chip carriers - Google Patents

Procedure for the fixation of chip carriers

Info

Publication number
SG111095A1
SG111095A1 SG200207449A SG200207449A SG111095A1 SG 111095 A1 SG111095 A1 SG 111095A1 SG 200207449 A SG200207449 A SG 200207449A SG 200207449 A SG200207449 A SG 200207449A SG 111095 A1 SG111095 A1 SG 111095A1
Authority
SG
Singapore
Prior art keywords
fixation
procedure
chip carriers
carriers
chip
Prior art date
Application number
SG200207449A
Inventor
Bauer Alfred
Hartmann Horst
Kolodzei Gunter
Original Assignee
Heraeus Gmbh W C
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Gmbh W C filed Critical Heraeus Gmbh W C
Publication of SG111095A1 publication Critical patent/SG111095A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
SG200207449A 2002-01-21 2002-12-05 Procedure for the fixation of chip carriers SG111095A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10202257A DE10202257B4 (en) 2002-01-21 2002-01-21 Method for fixing chip carriers

Publications (1)

Publication Number Publication Date
SG111095A1 true SG111095A1 (en) 2005-05-30

Family

ID=7712737

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200207449A SG111095A1 (en) 2002-01-21 2002-12-05 Procedure for the fixation of chip carriers

Country Status (7)

Country Link
EP (1) EP1329952A3 (en)
JP (1) JP2003218172A (en)
KR (1) KR20030063103A (en)
CN (1) CN1434497A (en)
DE (1) DE10202257B4 (en)
SG (1) SG111095A1 (en)
TW (1) TWI223862B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100971037B1 (en) * 2008-09-26 2010-07-20 주식회사 더존뉴턴스 Calendar for a desk
DE102010005771B4 (en) 2010-01-25 2012-12-13 Heraeus Materials Technology Gmbh & Co. Kg Modular metal strip, process for its manufacture and component with improved flatness
DE102012103583B4 (en) * 2012-02-29 2017-06-22 Heraeus Deutschland GmbH & Co. KG Substrate with enlarged chip island and method for its production

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0581284A2 (en) * 1992-07-30 1994-02-02 Mitsubishi Denki Kabushiki Kaisha Non-contact IC card and manufacturing and testing methods of the same
DE19703058C1 (en) * 1996-12-20 1998-06-10 Siemens Ag Non-conductive substrate for chip card carrier element
DE19922473A1 (en) * 1999-05-19 2000-11-30 Giesecke & Devrient Gmbh Chip carrier module has cut-outs forming large-area setting material holders with boundary forming setting material flow barrier, bridges mechanically connecting adjacent contact areas

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5265670A (en) * 1975-11-27 1977-05-31 Mitsubishi Electric Corp Production of semiconductor device
JPS5381076A (en) * 1976-12-27 1978-07-18 Hitachi Ltd Lroduction of resin seal semiconductor device
JPS5478087A (en) * 1977-12-05 1979-06-21 Toshiba Corp Manufacture of semiconductor
JPS6362366A (en) * 1986-09-03 1988-03-18 Matsushita Electronics Corp Lead frame
JP2617218B2 (en) * 1989-02-06 1997-06-04 ローム株式会社 Semiconductor component manufacturing method and lead frame used in the manufacturing method
JP3157947B2 (en) * 1993-03-26 2001-04-23 株式会社東芝 Semiconductor device and manufacturing method thereof
DE19800646C2 (en) * 1998-01-09 2000-05-04 Siemens Ag Carrier element for a semiconductor chip
DE19816066A1 (en) 1998-04-09 1999-10-14 Philips Patentverwaltung Foil as a carrier for integrated circuits
DE10038120A1 (en) * 2000-08-04 2001-10-18 Infineon Technologies Ag System support used for packing semiconductor chips in electronic components has a number of component assembly regions lying over each other with component assembly region limits on the support

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0581284A2 (en) * 1992-07-30 1994-02-02 Mitsubishi Denki Kabushiki Kaisha Non-contact IC card and manufacturing and testing methods of the same
DE19703058C1 (en) * 1996-12-20 1998-06-10 Siemens Ag Non-conductive substrate for chip card carrier element
DE19922473A1 (en) * 1999-05-19 2000-11-30 Giesecke & Devrient Gmbh Chip carrier module has cut-outs forming large-area setting material holders with boundary forming setting material flow barrier, bridges mechanically connecting adjacent contact areas

Also Published As

Publication number Publication date
EP1329952A2 (en) 2003-07-23
TWI223862B (en) 2004-11-11
TW200305243A (en) 2003-10-16
CN1434497A (en) 2003-08-06
KR20030063103A (en) 2003-07-28
DE10202257A1 (en) 2003-08-07
JP2003218172A (en) 2003-07-31
EP1329952A3 (en) 2009-03-04
DE10202257B4 (en) 2005-12-01

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