SG106070A1 - Method for elelctroless deposition of a metal layer on selected portions of a substrate - Google Patents

Method for elelctroless deposition of a metal layer on selected portions of a substrate

Info

Publication number
SG106070A1
SG106070A1 SG200202366A SG200202366A SG106070A1 SG 106070 A1 SG106070 A1 SG 106070A1 SG 200202366 A SG200202366 A SG 200202366A SG 200202366 A SG200202366 A SG 200202366A SG 106070 A1 SG106070 A1 SG 106070A1
Authority
SG
Singapore
Prior art keywords
elelctroless
deposition
substrate
metal layer
selected portions
Prior art date
Application number
SG200202366A
Other languages
English (en)
Inventor
Madhukar Bhangale Sunil
Zhongli Li
Malcolm Moran Peter
Original Assignee
Agency Science Tech & Res
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency Science Tech & Res filed Critical Agency Science Tech & Res
Priority to SG200202366A priority Critical patent/SG106070A1/en
Priority to CNB038088843A priority patent/CN100359045C/zh
Priority to AU2003262956A priority patent/AU2003262956A1/en
Priority to JP2003587999A priority patent/JP2005523993A/ja
Priority to PCT/SG2003/000093 priority patent/WO2003091477A1/en
Priority to US10/512,113 priority patent/US20050118436A1/en
Publication of SG106070A1 publication Critical patent/SG106070A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
    • C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
SG200202366A 2002-04-23 2002-04-23 Method for elelctroless deposition of a metal layer on selected portions of a substrate SG106070A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
SG200202366A SG106070A1 (en) 2002-04-23 2002-04-23 Method for elelctroless deposition of a metal layer on selected portions of a substrate
CNB038088843A CN100359045C (zh) 2002-04-23 2003-04-23 在基质的选择部分上无电沉积金属层的方法
AU2003262956A AU2003262956A1 (en) 2002-04-23 2003-04-23 Method for electroless deposition of a metal layer on selected portions of a substrate
JP2003587999A JP2005523993A (ja) 2002-04-23 2003-04-23 基板のうち選択部分上へのメタルレイヤーの無電解メッキ方法
PCT/SG2003/000093 WO2003091477A1 (en) 2002-04-23 2003-04-23 Method for electroless deposition of a metal layer on selected portions of a substrate
US10/512,113 US20050118436A1 (en) 2002-04-23 2003-04-23 Method for electroless deposition of a metal layer on selected portions of a substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200202366A SG106070A1 (en) 2002-04-23 2002-04-23 Method for elelctroless deposition of a metal layer on selected portions of a substrate

Publications (1)

Publication Number Publication Date
SG106070A1 true SG106070A1 (en) 2004-09-30

Family

ID=29268180

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200202366A SG106070A1 (en) 2002-04-23 2002-04-23 Method for elelctroless deposition of a metal layer on selected portions of a substrate

Country Status (6)

Country Link
US (1) US20050118436A1 (zh)
JP (1) JP2005523993A (zh)
CN (1) CN100359045C (zh)
AU (1) AU2003262956A1 (zh)
SG (1) SG106070A1 (zh)
WO (1) WO2003091477A1 (zh)

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US8435603B2 (en) 2003-12-05 2013-05-07 Conductive Inkjet Technology Limited Formation of solid layers on substrates
GB0401825D0 (en) * 2003-12-05 2004-03-03 Conductive Inkjet Tech Ltd Formation of solid layers on substrates
DE102004001107B4 (de) * 2004-01-05 2005-12-29 Siemens Ag Strukturierung auf Oberflächen mittels Folie
WO2012092301A2 (en) * 2010-12-29 2012-07-05 Intevac, Inc. Method and apparatus for masking substrates for deposition
CN102508583B (zh) * 2011-09-30 2014-05-21 南京熊猫电子股份有限公司 电容式触摸屏金属引线的制备方法
WO2013086217A1 (en) 2011-12-06 2013-06-13 Masco Corporation Of Indiana Ozone distribution in a faucet
EP2610366A3 (en) * 2011-12-31 2014-07-30 Rohm and Haas Electronic Materials LLC Plating catalyst and method
EP2610365B1 (en) * 2011-12-31 2020-02-26 Rohm and Haas Electronic Materials LLC Electroless plating method
CN102776495B (zh) * 2012-07-13 2014-05-07 南京航空航天大学 一种用于在电容式触摸屏ito走线上的化学镀镍方法
KR20140122338A (ko) 2013-04-09 2014-10-20 쓰리엠 이노베이티브 프로퍼티즈 캄파니 터치패널, 그 제조방법 및 터치패널용 Ag-Pd-Nd 합금
US9904386B2 (en) 2014-01-23 2018-02-27 3M Innovative Properties Company Method for patterning a microstructure
WO2015200008A1 (en) 2014-06-23 2015-12-30 3M Innovative Properties Company Method of patterning a metal on a transparent conductor
US10168805B2 (en) 2014-08-18 2019-01-01 3M Innovative Properties Company Conductive layered structure and methods of making same
CN115093008B (zh) 2015-12-21 2024-05-14 德尔塔阀门公司 包括消毒装置的流体输送系统

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US4264646A (en) * 1979-03-12 1981-04-28 Xerox Corporation Selectively electrolessly depositing a metal pattern on the surface of a laminar film
JPS60241291A (ja) * 1984-05-16 1985-11-30 株式会社東芝 印刷配線板の製造方法
JPS6370486A (ja) * 1986-09-11 1988-03-30 日立化成工業株式会社 銅張積層板の無電解銅めつき方法
DE3705251A1 (de) * 1987-02-19 1988-09-01 Standard Elektrik Lorenz Ag Verfahren zur herstellung einer stromlos abgeschiedenen, loetbaren metallschicht
EP0340968A3 (en) * 1988-04-30 1992-05-06 Seiko Epson Corporation Thin film device and method of manufacturing the same
US5405656A (en) * 1990-04-02 1995-04-11 Nippondenso Co., Ltd. Solution for catalytic treatment, method of applying catalyst to substrate and method of forming electrical conductor
EP0518422B1 (en) * 1991-06-12 1995-09-06 Koninklijke Philips Electronics N.V. Method of selectively metallizing a pattern of a material other than glass on a glass substrate by electroless metallization
US5798811A (en) * 1993-12-21 1998-08-25 U.S. Philips Corporation Picture display device with partially clear contact areas
WO1995030178A1 (en) * 1994-04-28 1995-11-09 Philips Electronics N.V. Method of photolithographically producing a copper pattern on a plate of an electrically insulating material
WO1996032521A1 (fr) * 1995-04-10 1996-10-17 Kao Corporation Procede de metallisation au bain chaud, et procede et equipement de production de matrices
US5731364A (en) * 1996-01-24 1998-03-24 Shipley Company, L.L.C. Photoimageable compositions comprising multiple arylsulfonium photoactive compounds
US5981135A (en) * 1997-08-13 1999-11-09 Morton International, Inc. High resolution positive acting dry film photoresist
JP2000144439A (ja) * 1998-10-30 2000-05-26 Kizai Kk 不導体素材へのめっき処理方法とそのための無電解処理液組成物
JP2002068782A (ja) * 2000-08-29 2002-03-08 Mitsuboshi Belting Ltd ガラス基板表面のパターンメッキ方法及びこれを用いてパターンメッキを施したガラス基板
JP2002094218A (ja) * 2000-09-18 2002-03-29 Sankyo Kasei Co Ltd 成形回路部品の製造方法
GB0025989D0 (en) * 2000-10-24 2000-12-13 Shipley Co Llc Plating catalysts
GB0029315D0 (en) * 2000-12-01 2001-01-17 Koninkl Philips Electronics Nv Method of increasing the conductivity of a transparent conductive layer

Also Published As

Publication number Publication date
US20050118436A1 (en) 2005-06-02
AU2003262956A1 (en) 2003-11-10
WO2003091477A1 (en) 2003-11-06
JP2005523993A (ja) 2005-08-11
CN100359045C (zh) 2008-01-02
CN1646728A (zh) 2005-07-27

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