SG103816A1 - Adjustable and extended guide rings - Google Patents

Adjustable and extended guide rings

Info

Publication number
SG103816A1
SG103816A1 SG200001837A SG200001837A SG103816A1 SG 103816 A1 SG103816 A1 SG 103816A1 SG 200001837 A SG200001837 A SG 200001837A SG 200001837 A SG200001837 A SG 200001837A SG 103816 A1 SG103816 A1 SG 103816A1
Authority
SG
Singapore
Prior art keywords
adjustable
guide rings
extended guide
extended
rings
Prior art date
Application number
SG200001837A
Other languages
English (en)
Inventor
Quek Ser Wee Sebastian
Original Assignee
Chartered Semiconductor Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chartered Semiconductor Mfg filed Critical Chartered Semiconductor Mfg
Publication of SG103816A1 publication Critical patent/SG103816A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG200001837A 1999-07-29 2000-03-30 Adjustable and extended guide rings SG103816A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/354,853 US6206768B1 (en) 1999-07-29 1999-07-29 Adjustable and extended guide rings

Publications (1)

Publication Number Publication Date
SG103816A1 true SG103816A1 (en) 2004-05-26

Family

ID=23395178

Family Applications (2)

Application Number Title Priority Date Filing Date
SG200001837A SG103816A1 (en) 1999-07-29 2000-03-30 Adjustable and extended guide rings
SG200402737A SG117491A1 (en) 1999-07-29 2000-03-30 Adjustable and extended guide rings

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG200402737A SG117491A1 (en) 1999-07-29 2000-03-30 Adjustable and extended guide rings

Country Status (3)

Country Link
US (2) US6206768B1 (ja)
JP (1) JP2001044151A (ja)
SG (2) SG103816A1 (ja)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6244946B1 (en) 1997-04-08 2001-06-12 Lam Research Corporation Polishing head with removable subcarrier
US6666756B1 (en) * 2000-03-31 2003-12-23 Lam Research Corporation Wafer carrier head assembly
US7029381B2 (en) * 2000-07-31 2006-04-18 Aviza Technology, Inc. Apparatus and method for chemical mechanical polishing of substrates
TW577785B (en) * 2000-07-31 2004-03-01 Silicon Valley Group Apparatus and method for chemical mechanical polishing of substrates
US6652357B1 (en) * 2000-09-22 2003-11-25 Lam Research Corporation Methods for controlling retaining ring and wafer head tilt for chemical mechanical polishing
KR100470227B1 (ko) * 2001-06-07 2005-02-05 두산디앤디 주식회사 화학기계적 연마장치의 캐리어 헤드
KR100416808B1 (ko) * 2002-02-04 2004-01-31 삼성전자주식회사 반도체소자 제조용 씨엠피장치의 연마헤드 및 이를 구비한씨엠피장치
US6716299B1 (en) * 2002-06-28 2004-04-06 Lam Research Corporation Profiled retaining ring for chemical mechanical planarization
JP4490822B2 (ja) * 2002-09-27 2010-06-30 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 研磨装置およびウェーハ研磨方法
AU2003300375A1 (en) 2002-10-11 2004-05-04 Semplastics, L.L.C. Retaining ring for use on a carrier of a polishing apparatus
TW555148U (en) * 2002-11-11 2003-09-21 Nanya Technology Corp Guide-ring disassembling device
US6974371B2 (en) * 2003-04-30 2005-12-13 Applied Materials, Inc. Two part retaining ring
US6869348B1 (en) * 2003-10-07 2005-03-22 Strasbaugh Retaining ring for wafer carriers
US7063604B2 (en) * 2004-03-05 2006-06-20 Strasbaugh Independent edge control for CMP carriers
US20070010180A1 (en) * 2005-07-06 2007-01-11 Agere Systems, Inc. Carrier employing snap-fitted membrane retainer
US7530153B2 (en) * 2005-09-21 2009-05-12 Applied Materials, Inc. Attaching components of a carrier head
US7210991B1 (en) 2006-04-03 2007-05-01 Applied Materials, Inc. Detachable retaining ring
BRPI0713252C1 (pt) 2006-07-14 2021-05-25 Genentech Inc processo para a recuperação de fator de crescimento endotelial vascular (vegf) recombinante reenovelado
KR100814068B1 (ko) 2007-03-30 2008-03-17 티아이씨덕흥 주식회사 Ｃｍｐ 장비의 웨이퍼 연마 헤드
JP5199691B2 (ja) * 2008-02-13 2013-05-15 株式会社荏原製作所 研磨装置
KR100899336B1 (ko) 2009-02-03 2009-05-27 지앤피테크놀로지 주식회사 화학적 기계적 연마 장치의 연마 헤드
US20110275216A1 (en) * 2010-05-04 2011-11-10 Macronix International Co., Ltd. Two step chemical-mechanical polishing process
US9272387B2 (en) * 2011-04-13 2016-03-01 Applied Materials, Inc. Carrier head with shims
US9393668B2 (en) * 2012-07-12 2016-07-19 Taiwan Semiconductor Manufacturing Company Limited Polishing head with alignment gear
KR200465446Y1 (ko) 2012-09-09 2013-02-19 전용준 캐리어 헤드 하우징과 보유 링 간의 결합 상태 점검 기능을 갖는 화학 기계적 연마 장치의 캐리어 헤드
US10898987B2 (en) 2015-06-01 2021-01-26 Ebara Corporation Table for holding workpiece and processing apparatus with the table
JP6398939B2 (ja) * 2015-10-07 2018-10-03 信越半導体株式会社 テンプレートの測定方法及び評価方法
FR3055001B1 (fr) * 2016-08-10 2022-04-01 Safran Aircraft Engines Systeme de changement de pas equipe de moyens de reglage du pas des pales et turbomachine correspondante
CN110802507A (zh) * 2019-11-11 2020-02-18 上海华力微电子有限公司 研磨头和化学机械研磨设备
CN111347345B (zh) * 2020-04-16 2020-10-16 华海清科股份有限公司 一种用于化学机械抛光的保持环和承载头
CN111702656B (zh) * 2020-07-04 2021-08-17 林燕 一种间距可控的化学机械研磨头
CN112757143B (zh) * 2020-12-30 2022-11-25 上海理工大学 用于轴承外圈内滚道的可替换式气囊抛光装置

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5377451A (en) * 1993-02-23 1995-01-03 Memc Electronic Materials, Inc. Wafer polishing apparatus and method
US5624299A (en) * 1993-12-27 1997-04-29 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved carrier and method of use
US5423716A (en) 1994-01-05 1995-06-13 Strasbaugh; Alan Wafer-handling apparatus having a resilient membrane which holds wafer when a vacuum is applied
JP2933488B2 (ja) * 1994-08-10 1999-08-16 日本電気株式会社 研磨方法および研磨装置
JP3158934B2 (ja) * 1995-02-28 2001-04-23 三菱マテリアル株式会社 ウェーハ研磨装置
US5681215A (en) 1995-10-27 1997-10-28 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
US5569062A (en) * 1995-07-03 1996-10-29 Speedfam Corporation Polishing pad conditioning
US5876273A (en) 1996-04-01 1999-03-02 Kabushiki Kaisha Toshiba Apparatus for polishing a wafer
JP3183388B2 (ja) * 1996-07-12 2001-07-09 株式会社東京精密 半導体ウェーハ研磨装置
JP3106418B2 (ja) * 1996-07-30 2000-11-06 株式会社東京精密 研磨装置
US5851140A (en) 1997-02-13 1998-12-22 Integrated Process Equipment Corp. Semiconductor wafer polishing apparatus with a flexible carrier plate
US6244946B1 (en) * 1997-04-08 2001-06-12 Lam Research Corporation Polishing head with removable subcarrier
DE69813374T2 (de) * 1997-05-28 2003-10-23 Tokyo Seimitsu Co Ltd Halbleiterscheibe Poliervorrichtung mit Halterring
US5993302A (en) * 1997-12-31 1999-11-30 Applied Materials, Inc. Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus
US5989104A (en) * 1998-01-12 1999-11-23 Speedfam-Ipec Corporation Workpiece carrier with monopiece pressure plate and low gimbal point
US6030275A (en) * 1998-03-17 2000-02-29 International Business Machines Corporation Variable control of carrier curvature with direct feedback loop
US6196904B1 (en) * 1998-03-25 2001-03-06 Ebara Corporation Polishing apparatus
US5985094A (en) * 1998-05-12 1999-11-16 Speedfam-Ipec Corporation Semiconductor wafer carrier
US6089960A (en) * 1998-06-03 2000-07-18 One Source Manufacturing Semiconductor wafer polishing mechanism
US6283828B1 (en) * 1998-11-09 2001-09-04 Tokyo Seimitsu Co., Ltd. Wafer polishing apparatus
US6089961A (en) * 1998-12-07 2000-07-18 Speedfam-Ipec Corporation Wafer polishing carrier and ring extension therefor
US6276998B1 (en) * 1999-02-25 2001-08-21 Applied Materials, Inc. Padless substrate carrier
US6368189B1 (en) * 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
JP3294600B1 (ja) * 2001-02-28 2002-06-24 不二越機械工業株式会社 ウェーハの研磨装置

Also Published As

Publication number Publication date
US6206768B1 (en) 2001-03-27
US20010041521A1 (en) 2001-11-15
JP2001044151A (ja) 2001-02-16
SG117491A1 (en) 2005-12-29
US6645057B2 (en) 2003-11-11

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