SG103350A1 - Slotted substrates and methods and systems for forming same - Google Patents

Slotted substrates and methods and systems for forming same

Info

Publication number
SG103350A1
SG103350A1 SG200204064A SG200204064A SG103350A1 SG 103350 A1 SG103350 A1 SG 103350A1 SG 200204064 A SG200204064 A SG 200204064A SG 200204064 A SG200204064 A SG 200204064A SG 103350 A1 SG103350 A1 SG 103350A1
Authority
SG
Singapore
Prior art keywords
systems
methods
forming same
slotted substrates
slotted
Prior art date
Application number
SG200204064A
Other languages
English (en)
Inventor
T Rivas Rio
Buswell Shen
Khavari Mehrgan
R Pollard Jeffrey
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of SG103350A1 publication Critical patent/SG103350A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B41J2/1634—Manufacturing processes machining laser machining
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
SG200204064A 2002-01-31 2002-07-04 Slotted substrates and methods and systems for forming same SG103350A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/061,828 US6979797B2 (en) 2002-01-31 2002-01-31 Slotted substrates and methods and systems for forming same

Publications (1)

Publication Number Publication Date
SG103350A1 true SG103350A1 (en) 2004-04-29

Family

ID=22038392

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200204064A SG103350A1 (en) 2002-01-31 2002-07-04 Slotted substrates and methods and systems for forming same

Country Status (5)

Country Link
US (1) US6979797B2 (ja)
JP (1) JP2003231262A (ja)
GB (1) GB2384752A (ja)
SG (1) SG103350A1 (ja)
TW (1) TWI222120B (ja)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7051426B2 (en) 2002-01-31 2006-05-30 Hewlett-Packard Development Company, L.P. Method making a cutting disk into of a substrate
US20030140496A1 (en) * 2002-01-31 2003-07-31 Shen Buswell Methods and systems for forming slots in a semiconductor substrate
US6911155B2 (en) * 2002-01-31 2005-06-28 Hewlett-Packard Development Company, L.P. Methods and systems for forming slots in a substrate
US20030155328A1 (en) * 2002-02-15 2003-08-21 Huth Mark C. Laser micromachining and methods and systems of same
US6648454B1 (en) 2002-10-30 2003-11-18 Hewlett-Packard Development Company, L.P. Slotted substrate and method of making
US20050036004A1 (en) * 2003-08-13 2005-02-17 Barbara Horn Methods and systems for conditioning slotted substrates
US20050088477A1 (en) * 2003-10-27 2005-04-28 Barbara Horn Features in substrates and methods of forming
US20050219327A1 (en) 2004-03-31 2005-10-06 Clarke Leo C Features in substrates and methods of forming
US7326356B2 (en) * 2004-08-31 2008-02-05 Hewlett-Packard Development Company, L.P. Substrate and method of forming substrate for fluid ejection device
JP2009061664A (ja) * 2007-09-06 2009-03-26 Canon Inc インクジェットヘッド用基板の製造方法
JP5219439B2 (ja) * 2007-09-06 2013-06-26 キヤノン株式会社 インクジェット記録ヘッド用基板の製造方法
JP4659898B2 (ja) 2009-09-02 2011-03-30 キヤノン株式会社 液体吐出ヘッド用基板の製造方法
JP2014512989A (ja) * 2011-04-13 2014-05-29 オセ−テクノロジーズ ビーブイ 流体排出装置のノズルを形成する方法
US9463485B2 (en) * 2012-04-24 2016-10-11 Hewlett-Packard Development Company, L.P. Fluid ejection device
US9409394B2 (en) 2013-05-31 2016-08-09 Stmicroelectronics, Inc. Method of making inkjet print heads by filling residual slotted recesses and related devices
US9142614B2 (en) * 2013-07-05 2015-09-22 Taiwan Semiconductor Manufacturing Company Limited Isolation trench through backside of substrate
JP2015168143A (ja) * 2014-03-06 2015-09-28 セイコーエプソン株式会社 貫通孔の形成方法、部材、インクジェットヘッド、インクジェットヘッドユニットおよびインクジェット式記録装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05147223A (ja) 1991-12-02 1993-06-15 Matsushita Electric Ind Co Ltd インクジエツトヘツド
US5387314A (en) * 1993-01-25 1995-02-07 Hewlett-Packard Company Fabrication of ink fill slots in thermal ink-jet printheads utilizing chemical micromachining
US5658471A (en) 1995-09-22 1997-08-19 Lexmark International, Inc. Fabrication of thermal ink-jet feed slots in a silicon substrate

Also Published As

Publication number Publication date
GB0301948D0 (en) 2003-02-26
GB2384752A (en) 2003-08-06
JP2003231262A (ja) 2003-08-19
TWI222120B (en) 2004-10-11
US6979797B2 (en) 2005-12-27
US20030140497A1 (en) 2003-07-31

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