SG102051A1 - Method of production of lead frame, lead frame, and semiconductor device - Google Patents
Method of production of lead frame, lead frame, and semiconductor deviceInfo
- Publication number
- SG102051A1 SG102051A1 SG200203072A SG200203072A SG102051A1 SG 102051 A1 SG102051 A1 SG 102051A1 SG 200203072 A SG200203072 A SG 200203072A SG 200203072 A SG200203072 A SG 200203072A SG 102051 A1 SG102051 A1 SG 102051A1
- Authority
- SG
- Singapore
- Prior art keywords
- lead frame
- production
- semiconductor device
- lead
- frame
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48095—Kinked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001156789A JP2002353395A (en) | 2001-05-25 | 2001-05-25 | Manufacturing method of lead frame, the lead frame and semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG102051A1 true SG102051A1 (en) | 2004-02-27 |
Family
ID=19000745
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200203072A SG102051A1 (en) | 2001-05-25 | 2002-05-22 | Method of production of lead frame, lead frame, and semiconductor device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2002353395A (en) |
KR (1) | KR20020090328A (en) |
SG (1) | SG102051A1 (en) |
TW (1) | TWI221021B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4807928B2 (en) * | 2003-09-18 | 2011-11-02 | 旭化成エレクトロニクス株式会社 | Surface-mount vertical magnetoelectric transducer |
JP2005123383A (en) * | 2003-10-16 | 2005-05-12 | Asahi Kasei Electronics Co Ltd | Electromagnetic transducer element |
JP4723804B2 (en) * | 2003-10-17 | 2011-07-13 | 旭化成エレクトロニクス株式会社 | Magnetoelectric converter |
JP5248232B2 (en) * | 2008-07-31 | 2013-07-31 | 株式会社三井ハイテック | Lead frame and manufacturing method thereof |
JP6887932B2 (en) * | 2017-10-13 | 2021-06-16 | 株式会社三井ハイテック | Lead frame manufacturing method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62193162A (en) * | 1986-02-19 | 1987-08-25 | Sumitomo Metal Mining Co Ltd | Method for depression of lead frame |
JPH0685151A (en) * | 1992-09-02 | 1994-03-25 | Seiko Epson Corp | Semiconductor device and manufacture thereof |
JPH0964266A (en) * | 1995-08-18 | 1997-03-07 | Sony Corp | Lead frame |
JPH11233702A (en) * | 1998-02-10 | 1999-08-27 | Hitachi Cable Ltd | Lead frame and its manufacture |
-
2001
- 2001-05-25 JP JP2001156789A patent/JP2002353395A/en active Pending
-
2002
- 2002-05-22 SG SG200203072A patent/SG102051A1/en unknown
- 2002-05-23 TW TW091110939A patent/TWI221021B/en not_active IP Right Cessation
- 2002-05-24 KR KR1020020028815A patent/KR20020090328A/en not_active Application Discontinuation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62193162A (en) * | 1986-02-19 | 1987-08-25 | Sumitomo Metal Mining Co Ltd | Method for depression of lead frame |
JPH0685151A (en) * | 1992-09-02 | 1994-03-25 | Seiko Epson Corp | Semiconductor device and manufacture thereof |
JPH0964266A (en) * | 1995-08-18 | 1997-03-07 | Sony Corp | Lead frame |
JPH11233702A (en) * | 1998-02-10 | 1999-08-27 | Hitachi Cable Ltd | Lead frame and its manufacture |
Also Published As
Publication number | Publication date |
---|---|
KR20020090328A (en) | 2002-12-02 |
JP2002353395A (en) | 2002-12-06 |
TWI221021B (en) | 2004-09-11 |
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