SG10202103792YA - Plasma processing apparatus and plasma processing method - Google Patents
Plasma processing apparatus and plasma processing methodInfo
- Publication number
- SG10202103792YA SG10202103792YA SG10202103792YA SG10202103792YA SG10202103792YA SG 10202103792Y A SG10202103792Y A SG 10202103792YA SG 10202103792Y A SG10202103792Y A SG 10202103792YA SG 10202103792Y A SG10202103792Y A SG 10202103792YA SG 10202103792Y A SG10202103792Y A SG 10202103792YA
- Authority
- SG
- Singapore
- Prior art keywords
- plasma processing
- processing apparatus
- processing method
- plasma
- processing
- Prior art date
Links
- 238000003672 processing method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32422—Arrangement for selecting ions or species in the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
- H01J37/32146—Amplitude modulation, includes pulsing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
- H01J37/32266—Means for controlling power transmitted to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma Technology (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020079517 | 2020-04-28 | ||
| JP2021035192A JP7486450B2 (en) | 2020-04-28 | 2021-03-05 | Plasma processing apparatus and plasma processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10202103792YA true SG10202103792YA (en) | 2021-11-29 |
Family
ID=78300546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10202103792YA SG10202103792YA (en) | 2020-04-28 | 2021-04-14 | Plasma processing apparatus and plasma processing method |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240145218A1 (en) |
| JP (1) | JP7486450B2 (en) |
| KR (1) | KR20210133143A (en) |
| SG (1) | SG10202103792YA (en) |
| TW (1) | TW202147442A (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5466480B2 (en) | 2009-02-20 | 2014-04-09 | 東京エレクトロン株式会社 | Plasma etching method, plasma etching apparatus and storage medium |
| JP2012104382A (en) | 2010-11-10 | 2012-05-31 | Tokyo Electron Ltd | Plasma treatment apparatus, plasma treatment method, and plasma treatment bias voltage determination method |
| JP6491888B2 (en) | 2015-01-19 | 2019-03-27 | 株式会社日立ハイテクノロジーズ | Plasma processing method and plasma processing apparatus |
| JP6762410B2 (en) | 2018-10-10 | 2020-09-30 | 東京エレクトロン株式会社 | Plasma processing equipment and control method |
-
2021
- 2021-03-05 JP JP2021035192A patent/JP7486450B2/en active Active
- 2021-04-14 SG SG10202103792YA patent/SG10202103792YA/en unknown
- 2021-04-15 TW TW110113574A patent/TW202147442A/en unknown
- 2021-04-15 KR KR1020210049094A patent/KR20210133143A/en active Search and Examination
-
2023
- 2023-12-27 US US18/397,941 patent/US20240145218A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW202147442A (en) | 2021-12-16 |
| JP7486450B2 (en) | 2024-05-17 |
| JP2021176191A (en) | 2021-11-04 |
| KR20210133143A (en) | 2021-11-05 |
| US20240145218A1 (en) | 2024-05-02 |
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