SG10202102724VA - Polishing apparatus, information processing system, polishing method, and computer-readable storage medium - Google Patents
Polishing apparatus, information processing system, polishing method, and computer-readable storage mediumInfo
- Publication number
- SG10202102724VA SG10202102724VA SG10202102724VA SG10202102724VA SG 10202102724V A SG10202102724V A SG 10202102724VA SG 10202102724V A SG10202102724V A SG 10202102724VA SG 10202102724V A SG10202102724V A SG 10202102724VA
- Authority
- SG
- Singapore
- Prior art keywords
- computer
- storage medium
- information processing
- processing system
- readable storage
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title 2
- 230000010365 information processing Effects 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/10—Geometric CAD
- G06F30/17—Mechanical parametric or variational design
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
- G06F30/27—Design optimisation, verification or simulation using machine learning, e.g. artificial intelligence, neural networks, support vector machines [SVM] or training a model
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N20/00—Machine learning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Evolutionary Computation (AREA)
- Geometry (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Software Systems (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Artificial Intelligence (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Medical Informatics (AREA)
- Mathematical Physics (AREA)
- Mathematical Optimization (AREA)
- Pure & Applied Mathematics (AREA)
- Mathematical Analysis (AREA)
- Computational Mathematics (AREA)
- Computing Systems (AREA)
- Data Mining & Analysis (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020048666A JP7390945B2 (en) | 2020-03-19 | 2020-03-19 | Polishing equipment, information processing system and program |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202102724VA true SG10202102724VA (en) | 2021-10-28 |
Family
ID=77747361
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202102724V SG10202102724VA (en) | 2020-03-19 | 2021-03-17 | Polishing apparatus, information processing system, polishing method, and computer-readable storage medium |
Country Status (6)
Country | Link |
---|---|
US (1) | US11897078B2 (en) |
JP (1) | JP7390945B2 (en) |
KR (1) | KR20210117954A (en) |
CN (1) | CN113492356A (en) |
SG (1) | SG10202102724VA (en) |
TW (1) | TW202135979A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20240125594A (en) * | 2021-12-17 | 2024-08-19 | 가부시키가이샤 에바라 세이사꾸쇼 | Information processing device, inference device, machine learning device, information processing method, inference method, and machine learning method |
JP2024124092A (en) * | 2023-03-02 | 2024-09-12 | 株式会社Screenホールディングス | Learning device, information processing device, substrate processing device, learning model generating method, and processing condition determining method |
CN117415682B (en) * | 2023-11-29 | 2024-05-24 | 深圳市摆渡微电子有限公司 | Tungsten steel nozzle machining and polishing method and device |
CN118024035B (en) * | 2024-04-12 | 2024-07-12 | 中唯精密工业有限公司 | Machine learning-based polishing solution replacement early warning method and device |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000343380A (en) * | 1999-05-31 | 2000-12-12 | Toshiba Mach Co Ltd | Method for determining condition of operating in machine tool |
JP2009004442A (en) * | 2007-06-19 | 2009-01-08 | Renesas Technology Corp | Polishing method for semiconductor wafer |
JP5511600B2 (en) * | 2010-09-09 | 2014-06-04 | 株式会社荏原製作所 | Polishing equipment |
JP6373796B2 (en) | 2014-05-29 | 2018-08-15 | 株式会社荏原製作所 | Substrate polishing equipment |
JP6357260B2 (en) * | 2016-09-30 | 2018-07-11 | 株式会社荏原製作所 | Polishing apparatus and polishing method |
SG11201902651QA (en) | 2016-10-18 | 2019-05-30 | Ebara Corp | Substrate processing control system, substrate processing control method, and program |
JP7323541B2 (en) * | 2018-03-13 | 2023-08-08 | アプライド マテリアルズ インコーポレイテッド | Machine learning system for monitoring semiconductor processing |
JP7269074B2 (en) * | 2018-04-26 | 2023-05-08 | 株式会社荏原製作所 | Polishing device and polishing system equipped with polishing pad surface texture measuring device |
JP7084811B2 (en) | 2018-07-13 | 2022-06-15 | 株式会社荏原製作所 | Polishing equipment and polishing method |
JP2020013918A (en) | 2018-07-19 | 2020-01-23 | 株式会社荏原製作所 | Polishing apparatus and polishing method for polishing peripheral portion of substrate |
-
2020
- 2020-03-19 JP JP2020048666A patent/JP7390945B2/en active Active
-
2021
- 2021-03-16 KR KR1020210033736A patent/KR20210117954A/en active Search and Examination
- 2021-03-17 CN CN202110285164.3A patent/CN113492356A/en active Pending
- 2021-03-17 SG SG10202102724V patent/SG10202102724VA/en unknown
- 2021-03-18 US US17/205,344 patent/US11897078B2/en active Active
- 2021-03-19 TW TW110110019A patent/TW202135979A/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW202135979A (en) | 2021-10-01 |
US20210291312A1 (en) | 2021-09-23 |
JP7390945B2 (en) | 2023-12-04 |
JP2021150474A (en) | 2021-09-27 |
KR20210117954A (en) | 2021-09-29 |
US11897078B2 (en) | 2024-02-13 |
CN113492356A (en) | 2021-10-12 |
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