SG10202100810QA - Processing method and processing apparatus - Google Patents
Processing method and processing apparatusInfo
- Publication number
- SG10202100810QA SG10202100810QA SG10202100810QA SG10202100810QA SG10202100810QA SG 10202100810Q A SG10202100810Q A SG 10202100810QA SG 10202100810Q A SG10202100810Q A SG 10202100810QA SG 10202100810Q A SG10202100810Q A SG 10202100810QA SG 10202100810Q A SG10202100810Q A SG 10202100810QA
- Authority
- SG
- Singapore
- Prior art keywords
- processing
- processing apparatus
- processing method
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D5/007—Control means comprising cameras, vision or image processing systems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/22—Safety devices specially adapted for cutting machines
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020013520A JP7370265B2 (en) | 2020-01-30 | 2020-01-30 | Processing method and processing equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202100810QA true SG10202100810QA (en) | 2021-08-30 |
Family
ID=76853734
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202100810QA SG10202100810QA (en) | 2020-01-30 | 2021-01-26 | Processing method and processing apparatus |
Country Status (7)
Country | Link |
---|---|
US (1) | US20210237297A1 (en) |
JP (1) | JP7370265B2 (en) |
KR (1) | KR20210097619A (en) |
CN (1) | CN113199651A (en) |
DE (1) | DE102021200656B4 (en) |
SG (1) | SG10202100810QA (en) |
TW (1) | TW202128345A (en) |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5539514A (en) * | 1991-06-26 | 1996-07-23 | Hitachi, Ltd. | Foreign particle inspection apparatus and method with front and back illumination |
JP3183046B2 (en) * | 1994-06-06 | 2001-07-03 | キヤノン株式会社 | Foreign particle inspection apparatus and method for manufacturing semiconductor device using the same |
US5515167A (en) * | 1994-09-13 | 1996-05-07 | Hughes Aircraft Company | Transparent optical chuck incorporating optical monitoring |
US5978078A (en) * | 1996-12-17 | 1999-11-02 | Texas Instruments Incorporated | System and method for detecting particles on substrate-supporting chucks of photolithography equipment |
JP3330089B2 (en) * | 1998-09-30 | 2002-09-30 | 株式会社大協精工 | Inspection method and apparatus for rubber products |
JP2000216227A (en) | 1999-01-25 | 2000-08-04 | Disco Abrasive Syst Ltd | Chuck table inspection method |
US6134014A (en) * | 1999-02-08 | 2000-10-17 | Taiwan Semiconductor Manufacturing Company | Apparatus and method of inspecting phase shift masks using comparison of a mask die image to the mask image database |
US6836560B2 (en) * | 2000-11-13 | 2004-12-28 | Kla - Tencor Technologies Corporation | Advanced phase shift inspection method |
JP2008109015A (en) * | 2006-10-27 | 2008-05-08 | Disco Abrasive Syst Ltd | Method and apparatus for dividing semiconductor wafer |
JP2009130287A (en) | 2007-11-27 | 2009-06-11 | Toshiba Corp | Apparatus and method for manufacturing semiconductor device |
JP5198203B2 (en) * | 2008-09-30 | 2013-05-15 | 株式会社ディスコ | Processing equipment |
JP5274966B2 (en) * | 2008-09-30 | 2013-08-28 | 株式会社ディスコ | Processing equipment |
US8934091B2 (en) * | 2012-09-09 | 2015-01-13 | Kla-Tencor Corp. | Monitoring incident beam position in a wafer inspection system |
JP6672053B2 (en) * | 2016-04-18 | 2020-03-25 | 株式会社ディスコ | Wafer processing method |
JP6692578B2 (en) * | 2016-06-30 | 2020-05-13 | 株式会社ディスコ | Wafer processing method |
JP2018121031A (en) | 2017-01-27 | 2018-08-02 | 株式会社ディスコ | Laser processing device |
JP2018176320A (en) * | 2017-04-07 | 2018-11-15 | 株式会社ディスコ | Processing device |
JP7017949B2 (en) * | 2018-03-02 | 2022-02-09 | 株式会社ディスコ | Processing equipment |
JP7126849B2 (en) * | 2018-04-13 | 2022-08-29 | 株式会社ディスコ | processing equipment |
JP7217165B2 (en) * | 2019-02-14 | 2023-02-02 | 株式会社ディスコ | Chuck table and inspection device |
JP7282461B2 (en) * | 2019-04-16 | 2023-05-29 | 株式会社ディスコ | Inspection equipment and processing equipment |
JP7325897B2 (en) * | 2019-04-18 | 2023-08-15 | 株式会社ディスコ | Machining device and machining method of workpiece |
-
2020
- 2020-01-30 JP JP2020013520A patent/JP7370265B2/en active Active
-
2021
- 2021-01-06 KR KR1020210001554A patent/KR20210097619A/en unknown
- 2021-01-22 US US17/155,522 patent/US20210237297A1/en active Pending
- 2021-01-26 SG SG10202100810QA patent/SG10202100810QA/en unknown
- 2021-01-26 DE DE102021200656.6A patent/DE102021200656B4/en active Active
- 2021-01-28 CN CN202110117492.2A patent/CN113199651A/en active Pending
- 2021-01-28 TW TW110103205A patent/TW202128345A/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW202128345A (en) | 2021-08-01 |
CN113199651A (en) | 2021-08-03 |
US20210237297A1 (en) | 2021-08-05 |
DE102021200656B4 (en) | 2024-05-23 |
JP7370265B2 (en) | 2023-10-27 |
DE102021200656A1 (en) | 2021-08-05 |
JP2021120166A (en) | 2021-08-19 |
KR20210097619A (en) | 2021-08-09 |
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