SG10202005164YA - Cutting apparatus and method of changing consumable parts - Google Patents

Cutting apparatus and method of changing consumable parts

Info

Publication number
SG10202005164YA
SG10202005164YA SG10202005164YA SG10202005164YA SG10202005164YA SG 10202005164Y A SG10202005164Y A SG 10202005164YA SG 10202005164Y A SG10202005164Y A SG 10202005164YA SG 10202005164Y A SG10202005164Y A SG 10202005164YA SG 10202005164Y A SG10202005164Y A SG 10202005164YA
Authority
SG
Singapore
Prior art keywords
cutting apparatus
consumable parts
changing consumable
changing
parts
Prior art date
Application number
SG10202005164YA
Inventor
Terada Kazuki
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10202005164YA publication Critical patent/SG10202005164YA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
    • B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
    • B26D1/143—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a stationary axis
    • B26D1/15—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a stationary axis with vertical cutting member
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01—Means for holding or positioning work
    • B26D7/018—Holding the work by suction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2614—Means for mounting the cutting member
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2628—Means for adjusting the position of the cutting member
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q7/00—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting
    • B23Q7/04—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting by means of grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2614—Means for mounting the cutting member
    • B26D7/2621—Means for mounting the cutting member for circular cutters
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T483/00—Tool changing
    • Y10T483/17—Tool changing including machine tool or component
    • Y10T483/1733—Rotary spindle machine tool [e.g., milling machine, boring, machine, grinding machine, etc.]
    • Y10T483/1736—Tool having specific mounting or work treating feature
    • Y10T483/174—Abrading wheel

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Dicing (AREA)
  • Automatic Tool Replacement In Machine Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
SG10202005164YA 2019-06-18 2020-06-01 Cutting apparatus and method of changing consumable parts SG10202005164YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019113238A JP7313202B2 (en) 2019-06-18 2019-06-18 Cutting device and replacement method

Publications (1)

Publication Number Publication Date
SG10202005164YA true SG10202005164YA (en) 2021-01-28

Family

ID=73654372

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202005164YA SG10202005164YA (en) 2019-06-18 2020-06-01 Cutting apparatus and method of changing consumable parts

Country Status (7)

Country Link
US (1) US11224986B2 (en)
JP (1) JP7313202B2 (en)
KR (1) KR20200144469A (en)
CN (1) CN112092222B (en)
DE (1) DE102020207493A1 (en)
SG (1) SG10202005164YA (en)
TW (1) TWI849146B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7126749B2 (en) * 2018-03-19 2022-08-29 株式会社ディスコ cutting equipment
JP7285754B2 (en) * 2019-10-10 2023-06-02 株式会社ディスコ processing equipment
JP7430452B2 (en) * 2020-04-10 2024-02-13 株式会社ディスコ Cutting equipment, cutting blade replacement method, and board replacement method
JP7451039B2 (en) * 2020-04-10 2024-03-18 株式会社ディスコ Blade holding jig, cutting device, and cutting blade installation method
KR20220059186A (en) 2020-11-02 2022-05-10 주식회사 엘지에너지솔루션 Pouch-type Battery Cell Comprising Electrode Lead Capable of Maintaining Constant internal Pressure and Battery Pack Comprising the Same
JP7532265B2 (en) 2021-01-12 2024-08-13 株式会社ディスコ Assistive devices
CN114523505B (en) * 2021-12-25 2023-10-31 泰州台和纳米科技有限公司 Material production equipment
JP2023155541A (en) * 2022-04-11 2023-10-23 Ｔｏｗａ株式会社 Cutting device and manufacturing method of cut product
CN114871867A (en) * 2022-05-23 2022-08-09 扬州市职业大学(扬州开放大学) Numerical control grinding machine with grinding wheel self-dressing function

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4036915A1 (en) * 1990-11-20 1992-05-21 Chiron Werke Gmbh MACHINE TOOL AND METHOD FOR OPENING AND CLOSING A GRIPPER
JP2617876B2 (en) * 1994-02-04 1997-06-04 株式会社ディスコ Blade autochanger
JP2904414B1 (en) * 1998-05-22 1999-06-14 株式会社東京精密 Automatic blade replacement system
US6030326A (en) 1997-06-05 2000-02-29 Tokyo Seimitsu Co., Ltd. Automatic blade changing system
JP4452691B2 (en) * 2005-08-04 2010-04-21 リンテック株式会社 Sheet cutting device and cutting method
JP2007208114A (en) 2006-02-03 2007-08-16 Disco Abrasive Syst Ltd Cutting device
JP2007229843A (en) * 2006-02-28 2007-09-13 Disco Abrasive Syst Ltd Cutting device
DE112007000528B4 (en) * 2006-03-03 2016-03-31 Honda Motor Co., Ltd. machine tool
DE102011006811A1 (en) * 2011-04-05 2012-10-11 Deckel Maho Pfronten Gmbh Tool handling device for machine tools
JP6108999B2 (en) * 2013-07-18 2017-04-05 株式会社ディスコ Cutting equipment
JP6212331B2 (en) * 2013-08-29 2017-10-11 コマツＮｔｃ株式会社 Machine Tools
JP6246566B2 (en) * 2013-11-11 2017-12-13 株式会社ディスコ Dressing method
JP6656387B2 (en) * 2016-09-09 2020-03-04 マキノジェイ株式会社 Machine tool with display device
JP2019010698A (en) * 2017-06-29 2019-01-24 オークマ株式会社 Machine tool
JP7167631B2 (en) * 2018-10-30 2022-11-09 株式会社ジェイテクト Machine tool and gear machining method using machine tool
JP7157674B2 (en) * 2019-01-30 2022-10-20 株式会社ディスコ Blade exchange unit

Also Published As

Publication number Publication date
CN112092222A (en) 2020-12-18
TW202101643A (en) 2021-01-01
TWI849146B (en) 2024-07-21
JP2020203358A (en) 2020-12-24
CN112092222B (en) 2024-07-09
US11224986B2 (en) 2022-01-18
KR20200144469A (en) 2020-12-29
JP7313202B2 (en) 2023-07-24
DE102020207493A1 (en) 2020-12-24
US20200398452A1 (en) 2020-12-24

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