SG10201913828UA - Continuous fluidic thermal interface material dispensing - Google Patents

Continuous fluidic thermal interface material dispensing

Info

Publication number
SG10201913828UA
SG10201913828UA SG10201913828UA SG10201913828UA SG10201913828UA SG 10201913828U A SG10201913828U A SG 10201913828UA SG 10201913828U A SG10201913828U A SG 10201913828UA SG 10201913828U A SG10201913828U A SG 10201913828UA SG 10201913828U A SG10201913828U A SG 10201913828UA
Authority
SG
Singapore
Prior art keywords
thermal interface
interface material
material dispensing
continuous fluidic
fluidic thermal
Prior art date
Application number
SG10201913828UA
Inventor
Samer Kabbani
Jerry Ihor Tustaniwskyj
James Wittman Babcock
Thomas Jones
Original Assignee
Delta Design Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Design Inc filed Critical Delta Design Inc
Publication of SG10201913828UA publication Critical patent/SG10201913828UA/en

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/30—Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature
    • G05D23/32—Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature with provision for adjustment of the effect of the auxiliary heating device, e.g. a function of time
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1902—Control of temperature characterised by the use of electric means characterised by the use of a variable reference value
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1919—Control of temperature characterised by the use of electric means characterised by the type of controller
    • G05D23/192—Control of temperature characterised by the use of electric means characterised by the type of controller using a modification of the thermal impedance between a source and the load
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
SG10201913828UA 2015-07-21 2016-07-14 Continuous fluidic thermal interface material dispensing SG10201913828UA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201562195049P 2015-07-21 2015-07-21

Publications (1)

Publication Number Publication Date
SG10201913828UA true SG10201913828UA (en) 2020-03-30

Family

ID=56686889

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201913828UA SG10201913828UA (en) 2015-07-21 2016-07-14 Continuous fluidic thermal interface material dispensing

Country Status (8)

Country Link
US (1) US20170027084A1 (en)
EP (1) EP3326043A1 (en)
JP (1) JP2018523122A (en)
KR (1) KR20180033223A (en)
CN (1) CN107924204A (en)
SG (1) SG10201913828UA (en)
TW (1) TW201712459A (en)
WO (1) WO2017015052A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180088193A (en) * 2017-01-26 2018-08-03 삼성전자주식회사 Apparatus and method of thermal management using adaptive thermal resistance and thermal capacity
US11493551B2 (en) 2020-06-22 2022-11-08 Advantest Test Solutions, Inc. Integrated test cell using active thermal interposer (ATI) with parallel socket actuation
US11549981B2 (en) 2020-10-01 2023-01-10 Advantest Test Solutions, Inc. Thermal solution for massively parallel testing
US11821913B2 (en) 2020-11-02 2023-11-21 Advantest Test Solutions, Inc. Shielded socket and carrier for high-volume test of semiconductor devices
US11808812B2 (en) 2020-11-02 2023-11-07 Advantest Test Solutions, Inc. Passive carrier-based device delivery for slot-based high-volume semiconductor test system
US20220155364A1 (en) 2020-11-19 2022-05-19 Advantest Test Solutions, Inc. Wafer scale active thermal interposer for device testing
US11609266B2 (en) 2020-12-04 2023-03-21 Advantest Test Solutions, Inc. Active thermal interposer device
US11573262B2 (en) 2020-12-31 2023-02-07 Advantest Test Solutions, Inc. Multi-input multi-zone thermal control for device testing
US11587640B2 (en) 2021-03-08 2023-02-21 Advantest Test Solutions, Inc. Carrier based high volume system level testing of devices with pop structures
US11656273B1 (en) 2021-11-05 2023-05-23 Advantest Test Solutions, Inc. High current device testing apparatus and systems

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4734872A (en) 1985-04-30 1988-03-29 Temptronic Corporation Temperature control for device under test
FR2631433B1 (en) * 1988-05-10 1990-08-24 Sagem IMPROVEMENTS IN OR RELATING TO DEVICES FOR ADJUSTING THE TEMPERATURE OF AN ELEMENT BY BLOWING A GAS TO THE APPROPRIATE TEMPERATURE
US5297621A (en) 1989-07-13 1994-03-29 American Electronic Analysis Method and apparatus for maintaining electrically operating device temperatures
US5104661A (en) 1989-08-14 1992-04-14 Technology Unlimited, Inc. Reverse loading of liposomes
US5001423A (en) * 1990-01-24 1991-03-19 International Business Machines Corporation Dry interface thermal chuck temperature control system for semiconductor wafer testing
US5309090A (en) 1990-09-06 1994-05-03 Lipp Robert J Apparatus for heating and controlling temperature in an integrated circuit chip
JP2544015Y2 (en) 1990-10-15 1997-08-13 株式会社アドバンテスト IC test equipment
US5164661A (en) 1991-05-31 1992-11-17 Ej Systems, Inc. Thermal control system for a semi-conductor burn-in
US5125656A (en) 1992-01-03 1992-06-30 Fabanich John P Bowling ball
US5205132A (en) 1992-06-12 1993-04-27 Thermonics Incorporated Computer-implemented method and system for precise temperature control of a device under test
US5420521A (en) 1992-10-27 1995-05-30 Ej Systems, Inc. Burn-in module
US6489793B2 (en) 1996-10-21 2002-12-03 Delta Design, Inc. Temperature control of electronic devices using power following feedback
US6476627B1 (en) 1996-10-21 2002-11-05 Delta Design, Inc. Method and apparatus for temperature control of a device during testing
US5864176A (en) * 1997-04-04 1999-01-26 Unisys Corporation Electro-mechnical subassembly having a greatly reduced thermal resistance between two mating faces by including a film of liquid, that evaporates without leaving any residue, between the faces
US5844208A (en) 1997-04-04 1998-12-01 Unisys Corporation Temperature control system for an electronic device in which device temperature is estimated from heater temperature and heat sink temperature
US5821505A (en) 1997-04-04 1998-10-13 Unisys Corporation Temperature control system for an electronic device which achieves a quick response by interposing a heater between the device and a heat sink
WO1998046059A1 (en) * 1997-04-04 1998-10-15 Unisys Corporation Temperature control system for an electronic device
US6389225B1 (en) 1998-07-14 2002-05-14 Delta Design, Inc. Apparatus, method and system of liquid-based, wide range, fast response temperature control of electronic device
JP2004507886A (en) * 2000-07-21 2004-03-11 テンプトロニック　コーポレイション Thermal platform for automatic testing with temperature control
US6771086B2 (en) * 2002-02-19 2004-08-03 Lucas/Signatone Corporation Semiconductor wafer electrical testing with a mobile chiller plate for rapid and precise test temperature control
US6825681B2 (en) 2002-07-19 2004-11-30 Delta Design, Inc. Thermal control of a DUT using a thermal control substrate
US6857283B2 (en) * 2002-09-13 2005-02-22 Isothermal Systems Research, Inc. Semiconductor burn-in thermal management system
US7114556B2 (en) * 2002-12-17 2006-10-03 Micro Control Company Burn-in oven heat exchanger having improved thermal conduction
JP3677767B1 (en) * 2004-06-07 2005-08-03 株式会社アドバンテスト Heater power control circuit and burn-in device using the same
WO2006076315A1 (en) 2005-01-14 2006-07-20 Delta Design, Inc. Heat sink pedestal with interface medium chamber
JP4667158B2 (en) * 2005-08-09 2011-04-06 パナソニック株式会社 Wafer level burn-in method
JP2007066923A (en) * 2005-08-29 2007-03-15 Matsushita Electric Ind Co Ltd Method and apparatus for burning in wafer level
US7567090B2 (en) * 2006-10-23 2009-07-28 International Business Machines Corporation Liquid recovery, collection method and apparatus in a non-recirculating test and burn-in application
US20080191729A1 (en) * 2007-02-09 2008-08-14 Richard Lidio Blanco Thermal interface for electronic chip testing
CN101017024A (en) * 2007-03-12 2007-08-15 河北工业大学 Air heater
US8178004B2 (en) 2008-06-27 2012-05-15 Aculon, Inc. Compositions for providing hydrophobic layers to metallic substrates
JP5242340B2 (en) * 2008-10-31 2013-07-24 住友電工デバイス・イノベーション株式会社 Device test apparatus and device test method
US9347987B2 (en) * 2009-11-06 2016-05-24 Intel Corporation Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same
US8410802B2 (en) * 2009-12-24 2013-04-02 Intel Corporation System including thermal control unit having conduit for dispense and removal of liquid thermal interface material
JP2012185184A (en) * 2012-07-02 2012-09-27 Seiko Epson Corp Temperature control apparatus of electronic component, and handler apparatus
US9791501B2 (en) * 2012-09-24 2017-10-17 Intel Corporation Compliant thermal contact device and method
US20150309112A1 (en) * 2012-12-12 2015-10-29 Marvelous Technology Pte Ltd Thermal head for device under test and method for controlling the temperature of device under test

Also Published As

Publication number Publication date
EP3326043A1 (en) 2018-05-30
WO2017015052A1 (en) 2017-01-26
KR20180033223A (en) 2018-04-02
US20170027084A1 (en) 2017-01-26
CN107924204A (en) 2018-04-17
JP2018523122A (en) 2018-08-16
TW201712459A (en) 2017-04-01

Similar Documents

Publication Publication Date Title
EP4086080C0 (en) Laser-induced material dispensing
SG10201913828UA (en) Continuous fluidic thermal interface material dispensing
ZA201807551B (en) Fluid dispenser
GB2566188B (en) Thermal interface material structures
GB2534320B (en) Temperature control material
ZA201803878B (en) Controlled turbulent breakup flow
GB201603487D0 (en) Catalytic material
GB2554577B (en) Coating material
PL3240684T3 (en) Construction material
EP3395436C0 (en) Microreactor
TWI561623B (en) Thermal interface material
GB201500753D0 (en) Sealant material
GB201412756D0 (en) Construction material
GB2543616B (en) Microfluidic arrangements
HK1212312A1 (en) Refillable material transfer system
GB201517259D0 (en) Material
HK1251356A1 (en) Connection material
SG11201605829YA (en) Refractory coating material
GB201620308D0 (en) Tharapeutic material
SG11201802942SA (en) Fluidic device
GB201601652D0 (en) Packaging material
SG10201607550RA (en) Thermal Interface Material
PL3287555T3 (en) Technical packaging material
PT3173214T (en) Extrusion nozzle for non-metallic molten materials
GB201500754D0 (en) Sealant material