SG10201913821RA - Socket side thermal system - Google Patents

Socket side thermal system

Info

Publication number
SG10201913821RA
SG10201913821RA SG10201913821RA SG10201913821RA SG10201913821RA SG 10201913821R A SG10201913821R A SG 10201913821RA SG 10201913821R A SG10201913821R A SG 10201913821RA SG 10201913821R A SG10201913821R A SG 10201913821RA SG 10201913821R A SG10201913821R A SG 10201913821RA
Authority
SG
Singapore
Prior art keywords
thermal system
socket side
side thermal
socket
thermal
Prior art date
Application number
SG10201913821RA
Inventor
Jerry Ihor Tustaniwskyj
Original Assignee
Delta Design Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Design Inc filed Critical Delta Design Inc
Publication of SG10201913821RA publication Critical patent/SG10201913821RA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0458—Details related to environmental aspects, e.g. temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)
  • Storage Device Security (AREA)
SG10201913821RA 2017-01-09 2018-01-08 Socket side thermal system SG10201913821RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762444092P 2017-01-09 2017-01-09
US15/416,510 US10782316B2 (en) 2017-01-09 2017-01-26 Socket side thermal system

Publications (1)

Publication Number Publication Date
SG10201913821RA true SG10201913821RA (en) 2020-03-30

Family

ID=62782935

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201913821RA SG10201913821RA (en) 2017-01-09 2018-01-08 Socket side thermal system
SG11201906159XA SG11201906159XA (en) 2017-01-09 2018-01-08 Socket side thermal system

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG11201906159XA SG11201906159XA (en) 2017-01-09 2018-01-08 Socket side thermal system

Country Status (8)

Country Link
US (2) US10782316B2 (en)
EP (1) EP3566060B1 (en)
JP (3) JP2020505584A (en)
KR (1) KR102473364B1 (en)
CN (1) CN110268273A (en)
SG (2) SG10201913821RA (en)
TW (1) TWI723244B (en)
WO (1) WO2018129439A2 (en)

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* Cited by examiner, † Cited by third party
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KR102038232B1 (en) * 2018-10-24 2019-10-29 (주)에스티아이 Apparatus for Measuring Temperature of Substrate and the method thereof
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US12013432B1 (en) 2023-08-23 2024-06-18 Aem Singapore Pte. Ltd. Thermal control wafer with integrated heating-sensing elements
US12000885B1 (en) 2023-12-20 2024-06-04 Aem Singapore Pte. Ltd. Multiplexed thermal control wafer and coldplate

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Also Published As

Publication number Publication date
TWI723244B (en) 2021-04-01
KR20190100380A (en) 2019-08-28
CN110268273A (en) 2019-09-20
WO2018129439A3 (en) 2018-08-30
EP3566060A2 (en) 2019-11-13
US11879910B2 (en) 2024-01-23
JP2024023283A (en) 2024-02-21
KR102473364B1 (en) 2022-12-01
WO2018129439A2 (en) 2018-07-12
EP3566060B1 (en) 2023-03-08
US10782316B2 (en) 2020-09-22
JP2022188088A (en) 2022-12-20
US20210063436A1 (en) 2021-03-04
TW201837486A (en) 2018-10-16
JP2020505584A (en) 2020-02-20
SG11201906159XA (en) 2019-08-27
US20180196084A1 (en) 2018-07-12

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