SG10201908033QA - Tape, tape attaching method, and tape expanding method - Google Patents
Tape, tape attaching method, and tape expanding methodInfo
- Publication number
- SG10201908033QA SG10201908033QA SG10201908033QA SG10201908033QA SG10201908033QA SG 10201908033Q A SG10201908033Q A SG 10201908033QA SG 10201908033Q A SG10201908033Q A SG 10201908033QA SG 10201908033Q A SG10201908033Q A SG 10201908033QA SG 10201908033Q A SG10201908033Q A SG 10201908033QA
- Authority
- SG
- Singapore
- Prior art keywords
- tape
- expanding
- attaching
- attaching method
- expanding method
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/04—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring tension in flexible members, e.g. ropes, cables, wires, threads, belts or bands
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
Landscapes
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Auxiliary Devices For And Details Of Packaging Control (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018164512A JP7189705B2 (en) | 2018-09-03 | 2018-09-03 | Tape sticking method and tape expansion method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201908033QA true SG10201908033QA (en) | 2020-04-29 |
Family
ID=69526977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201908033QA SG10201908033QA (en) | 2018-09-03 | 2019-08-30 | Tape, tape attaching method, and tape expanding method |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11222806B2 (en) |
| JP (1) | JP7189705B2 (en) |
| KR (1) | KR102655558B1 (en) |
| CN (1) | CN110875233A (en) |
| DE (1) | DE102019213328A1 (en) |
| SG (1) | SG10201908033QA (en) |
| TW (1) | TWI804674B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3705862B1 (en) * | 2019-03-05 | 2023-07-05 | Infineon Technologies AG | Method and device for monitoring a dicing tape tension |
| JP2022120735A (en) * | 2021-02-05 | 2022-08-18 | 株式会社東京精密 | Apparatus and method for detecting abnormal tension of dicing tape |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63108090A (en) * | 1986-10-24 | 1988-05-12 | Hitachi Ltd | Tacky adhesive tape |
| JP4585164B2 (en) | 2002-07-18 | 2010-11-24 | 日東電工株式会社 | UV curable adhesive sheet |
| AU2004252148A1 (en) * | 2003-06-23 | 2005-01-06 | The Procter & Gamble Company | Process for producing highly registered printed images and embossment patterns on stretchable substrates |
| JP2005079151A (en) | 2003-08-28 | 2005-03-24 | Seiko Epson Corp | Dicing tape, pickup device, and process for manufacturing semiconductor device |
| US20100285398A1 (en) * | 2007-05-18 | 2010-11-11 | 3M Innovative Properties Company | Tamper indicating article |
| KR20100122110A (en) | 2008-03-07 | 2010-11-19 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Dicing tape and die attach adhesive with patterned backing |
| JP5329833B2 (en) | 2008-04-08 | 2013-10-30 | リンテック株式会社 | Adhesive sheet for semiconductor wafer processing, adjustment method for semiconductor wafer processing apparatus using the same, and evaluation method for adhesive sheet |
| JP5507088B2 (en) | 2009-01-28 | 2014-05-28 | リンテック株式会社 | Protective film forming sheet for chip and semiconductor chip with protective film |
| JP5791866B2 (en) | 2009-03-06 | 2015-10-07 | 株式会社ディスコ | Work dividing device |
| JP5918025B2 (en) | 2012-05-22 | 2016-05-18 | 株式会社ディスコ | Protective member and protective tape attaching method |
| BR112015031314A2 (en) * | 2013-06-13 | 2017-07-25 | 3M Innovative Properties Co | tape including microporous film |
| JP6682389B2 (en) | 2016-07-05 | 2020-04-15 | 株式会社ディスコ | Expansion device and expansion method |
-
2018
- 2018-09-03 JP JP2018164512A patent/JP7189705B2/en active Active
-
2019
- 2019-08-09 CN CN201910732942.1A patent/CN110875233A/en active Pending
- 2019-08-22 KR KR1020190103109A patent/KR102655558B1/en active IP Right Grant
- 2019-08-23 US US16/549,094 patent/US11222806B2/en active Active
- 2019-08-30 SG SG10201908033QA patent/SG10201908033QA/en unknown
- 2019-09-02 TW TW108131487A patent/TWI804674B/en active
- 2019-09-03 DE DE102019213328.2A patent/DE102019213328A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2020038872A (en) | 2020-03-12 |
| US11222806B2 (en) | 2022-01-11 |
| JP7189705B2 (en) | 2022-12-14 |
| CN110875233A (en) | 2020-03-10 |
| US20200075387A1 (en) | 2020-03-05 |
| KR102655558B1 (en) | 2024-04-05 |
| TWI804674B (en) | 2023-06-11 |
| TW202010809A (en) | 2020-03-16 |
| DE102019213328A1 (en) | 2020-03-05 |
| KR20200026710A (en) | 2020-03-11 |
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