SG10201902956WA - Cleaning liquid supplying system, substrate processing apparatus and substrate processing system - Google Patents

Cleaning liquid supplying system, substrate processing apparatus and substrate processing system

Info

Publication number
SG10201902956WA
SG10201902956WA SG10201902956WA SG10201902956WA SG 10201902956W A SG10201902956W A SG 10201902956WA SG 10201902956W A SG10201902956W A SG 10201902956WA SG 10201902956W A SG10201902956W A SG 10201902956WA
Authority
SG
Singapore
Prior art keywords
cleaning liquid
substrate processing
circulation line
liquid supplying
processing apparatus
Prior art date
Application number
Inventor
Mitsuru Miyazaki
Akira Imamura
Takuya Inoue
Shozo Takahashi
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201902956WA publication Critical patent/SG10201902956WA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • B08B9/02—Cleaning pipes or tubes or systems of pipes or tubes
    • B08B9/027—Cleaning the internal surfaces; Removal of blockages
    • B08B9/032—Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing
    • B08B9/0321—Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing using pressurised, pulsating or purging fluid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • B08B9/02—Cleaning pipes or tubes or systems of pipes or tubes
    • B08B9/027—Cleaning the internal surfaces; Removal of blockages
    • B08B9/032—Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing
    • B08B9/0321—Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing using pressurised, pulsating or purging fluid
    • B08B9/0325—Control mechanisms therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • B08B9/02—Cleaning pipes or tubes or systems of pipes or tubes
    • B08B9/027—Cleaning the internal surfaces; Removal of blockages
    • B08B9/032—Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing
    • B08B9/0321—Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing using pressurised, pulsating or purging fluid
    • B08B9/0328—Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing using pressurised, pulsating or purging fluid by purging the pipe with a gas or a mixture of gas and liquid
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D16/00—Control of fluid pressure
    • G05D16/20—Control of fluid pressure characterised by the use of electric means
    • G05D16/2006—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means
    • G05D16/2013—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using throttling means as controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
    • B08B2203/0217—Use of a detergent in high pressure cleaners; arrangements for supplying the same
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
    • B08B2203/0282—Safety devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Automation & Control Theory (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

CLEANING LIQUID SUPPLYING SYSTEM, SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING SYSTEM According to one embodiment, provided is a cleaning liquid supplying system including: a circulation line in which cleaning liquid flows, first end of the circulation line being connected to a supply port of a cleaning liquid supplying apparatus, second end of the circulation line being connected to a collection port of the cleaning liquid supplying apparatus; a branch pipe branched from the circulation line and connected to a substrate cleaning unit; a valve provided on the branch pipe and configured to control supply of cleaning liquid from the circulation line to the substrate cleaning unit; and a flow rate adjuster configured to adjust a flow rate of the cleaning liquid flowing in the circulation line. Figure 1
SG10201902956W 2018-04-05 2019-04-02 Cleaning liquid supplying system, substrate processing apparatus and substrate processing system SG10201902956WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018072976A JP7019494B2 (en) 2018-04-05 2018-04-05 Cleaning liquid supply system, substrate processing equipment and substrate processing system

Publications (1)

Publication Number Publication Date
SG10201902956WA true SG10201902956WA (en) 2019-11-28

Family

ID=68096301

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201902956W SG10201902956WA (en) 2018-04-05 2019-04-02 Cleaning liquid supplying system, substrate processing apparatus and substrate processing system

Country Status (6)

Country Link
US (1) US11090692B2 (en)
JP (1) JP7019494B2 (en)
KR (1) KR102646049B1 (en)
CN (1) CN110340055B (en)
SG (1) SG10201902956WA (en)
TW (1) TWI786285B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210138369A (en) 2020-05-12 2021-11-19 무진전자 주식회사 Flow control system
CN113198785B (en) * 2021-05-13 2023-10-13 北京北方华创微电子装备有限公司 Semiconductor cleaning equipment and cleaning fluid distribution mechanism thereof
JP2023007053A (en) * 2021-07-01 2023-01-18 株式会社Sumco Cleaning device, cleaning method, cleaning method of wafer, and manufacturing method of silicon wafer

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003249476A (en) * 2002-02-22 2003-09-05 Matsushita Electric Ind Co Ltd Wafer washing method
JP2007207941A (en) 2006-01-31 2007-08-16 Matsushita Electric Ind Co Ltd Method and device for cleaning substrate, and method of fabricating electronic device employing same
CN102247955B (en) * 2011-04-01 2013-03-27 北京七星华创电子股份有限公司 Treating fluid supply and pipeline washing system
JP5726784B2 (en) * 2012-02-24 2015-06-03 東京エレクトロン株式会社 Processing liquid exchange method and substrate processing apparatus
US20130260569A1 (en) 2012-03-30 2013-10-03 Lam Research Ag Apparatus and method for liquid treatment of wafer-shaped articles
CN104718151B (en) * 2012-11-16 2016-08-17 大日本印刷株式会社 The purification method of beverage filling device
JP6059087B2 (en) * 2013-05-31 2017-01-11 東京エレクトロン株式会社 Liquid processing apparatus, liquid processing method, and storage medium
JP5752210B2 (en) 2013-11-01 2015-07-22 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing equipment
JP6385714B2 (en) * 2014-05-16 2018-09-05 東京エレクトロン株式会社 Substrate liquid processing apparatus, cleaning method for substrate liquid processing apparatus, and storage medium
JP6223906B2 (en) 2014-05-19 2017-11-01 東京エレクトロン株式会社 Treatment liquid exchange method and liquid treatment apparatus
JP6359925B2 (en) 2014-09-18 2018-07-18 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing equipment
JP6810567B2 (en) 2016-09-23 2021-01-06 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing equipment and substrate processing method

Also Published As

Publication number Publication date
CN110340055A (en) 2019-10-18
US11090692B2 (en) 2021-08-17
CN110340055B (en) 2023-02-28
KR102646049B1 (en) 2024-03-12
JP2019186320A (en) 2019-10-24
KR20190116921A (en) 2019-10-15
JP7019494B2 (en) 2022-02-15
TW201944483A (en) 2019-11-16
TWI786285B (en) 2022-12-11
US20190308223A1 (en) 2019-10-10

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