SG10201901038UA - Tool set for use in position adjustment of positioning pins - Google Patents
Tool set for use in position adjustment of positioning pinsInfo
- Publication number
- SG10201901038UA SG10201901038UA SG10201901038UA SG10201901038UA SG10201901038UA SG 10201901038U A SG10201901038U A SG 10201901038UA SG 10201901038U A SG10201901038U A SG 10201901038UA SG 10201901038U A SG10201901038U A SG 10201901038UA SG 10201901038U A SG10201901038U A SG 10201901038UA
- Authority
- SG
- Singapore
- Prior art keywords
- position adjustment
- positioning pins
- tool set
- yft14
- rafirm
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/18—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for positioning only
- B23Q3/186—Aligning devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/24—Measuring arrangements characterised by the use of mechanical techniques for measuring angles or tapers; for testing the alignment of axes
- G01B5/25—Measuring arrangements characterised by the use of mechanical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
- Heterocyclic Carbon Compounds Containing A Hetero Ring Having Nitrogen And Oxygen As The Only Ring Hetero Atoms (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018019032A JP6936161B2 (ja) | 2018-02-06 | 2018-02-06 | 位置決めピンの位置調整に使用される治具セット |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201901038UA true SG10201901038UA (en) | 2019-09-27 |
Family
ID=67475320
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201901038UA SG10201901038UA (en) | 2018-02-06 | 2019-02-07 | Tool set for use in position adjustment of positioning pins |
Country Status (3)
Country | Link |
---|---|
US (1) | US11059137B2 (es) |
JP (1) | JP6936161B2 (es) |
SG (1) | SG10201901038UA (es) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6936161B2 (ja) * | 2018-02-06 | 2021-09-15 | 株式会社荏原製作所 | 位置決めピンの位置調整に使用される治具セット |
USD954567S1 (en) * | 2019-06-25 | 2022-06-14 | Ebara Corporation | Measurement jig |
CN113834400B (zh) * | 2020-06-23 | 2022-11-15 | 长鑫存储技术有限公司 | 位置检测判断装置、校准装置、方法及系统 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5035062A (en) * | 1990-04-06 | 1991-07-30 | Intel Corporation | Apparatus and method for aligning automated loading and unloading arms |
JP3011401B2 (ja) | 1996-08-29 | 2000-02-21 | 日本電産リード株式会社 | 上側治具位置決め機構付きプリント基板検査装置および上側治具位置決め方法 |
US6032512A (en) * | 1998-06-02 | 2000-03-07 | Taiwan Semiconductor Manufacturing Co. Ltd. | Wafer centering device and method of using |
US6146463A (en) * | 1998-06-12 | 2000-11-14 | Applied Materials, Inc. | Apparatus and method for aligning a substrate on a support member |
US6463782B1 (en) * | 2000-01-13 | 2002-10-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Self-centering calibration tool and method of calibrating |
US20030051364A1 (en) * | 2001-08-14 | 2003-03-20 | Bernardo Donoso | Method and apparatus for positioning a wafer chuck |
US6530157B1 (en) * | 2001-09-04 | 2003-03-11 | Process Integration | Precise positioning device for workpieces |
US9146090B2 (en) * | 2013-11-14 | 2015-09-29 | Globalfoundries Inc. | Nozzle alignment tool for a fluid dispensing apparatus |
JP6936161B2 (ja) * | 2018-02-06 | 2021-09-15 | 株式会社荏原製作所 | 位置決めピンの位置調整に使用される治具セット |
-
2018
- 2018-02-06 JP JP2018019032A patent/JP6936161B2/ja active Active
-
2019
- 2019-02-04 US US16/266,495 patent/US11059137B2/en active Active
- 2019-02-07 SG SG10201901038UA patent/SG10201901038UA/en unknown
Also Published As
Publication number | Publication date |
---|---|
US20190240794A1 (en) | 2019-08-08 |
US11059137B2 (en) | 2021-07-13 |
JP2019136778A (ja) | 2019-08-22 |
JP6936161B2 (ja) | 2021-09-15 |
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