SG10201809507XA - Solid state drive apparatus and data storage system having the same - Google Patents
Solid state drive apparatus and data storage system having the sameInfo
- Publication number
- SG10201809507XA SG10201809507XA SG10201809507XA SG10201809507XA SG10201809507XA SG 10201809507X A SG10201809507X A SG 10201809507XA SG 10201809507X A SG10201809507X A SG 10201809507XA SG 10201809507X A SG10201809507X A SG 10201809507XA SG 10201809507X A SG10201809507X A SG 10201809507XA
- Authority
- SG
- Singapore
- Prior art keywords
- solid state
- housing
- state drive
- drive apparatus
- side wall
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
- G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/187—Mounting of fixed and removable disk drives
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/02—Cabinets; Cases; Stands; Disposition of apparatus therein or thereon
- G11B33/04—Cabinets; Cases; Stands; Disposition of apparatus therein or thereon modified to store record carriers
- G11B33/0405—Cabinets; Cases; Stands; Disposition of apparatus therein or thereon modified to store record carriers for storing discs
- G11B33/0411—Single disc boxes
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
- G11B33/1406—Reducing the influence of the temperature
- G11B33/1413—Reducing the influence of the temperature by fluid cooling
- G11B33/142—Reducing the influence of the temperature by fluid cooling by air cooling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0021—Side-by-side or stacked arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20127—Natural convection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10159—Memory
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10522—Adjacent components
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Electromagnetism (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Connection Or Junction Boxes (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
OF THE DISCLOSURE A solid state drive apparatus includes a housing having an inner space and a plurality of vent channels penetrating a first side wall at a first side of the housing and a connector opening penetrating a second side wall at a second side of the housing opposite the first side of the housing, and a package substrate module in the inner space and having a package base substrate and a plurality of semiconductor chips mounted on the package base substrate. Each of the plurality of vent channels extends inwardly from an outer surface of the first side wall to an inner surface of the first side wall such that a vertical level of at least a portion of each of the plurality of vent channels varies between the outer surface and the inner surface. FIG. 1A
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020180001683A KR102613515B1 (en) | 2018-01-05 | 2018-01-05 | Solid state drive apparatus and data storage system having the same |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201809507XA true SG10201809507XA (en) | 2019-08-27 |
Family
ID=64082977
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201809507XA SG10201809507XA (en) | 2018-01-05 | 2018-10-26 | Solid state drive apparatus and data storage system having the same |
Country Status (6)
Country | Link |
---|---|
US (1) | US10638625B2 (en) |
EP (1) | EP3508945B1 (en) |
JP (1) | JP7282509B2 (en) |
KR (1) | KR102613515B1 (en) |
CN (1) | CN110010165B (en) |
SG (1) | SG10201809507XA (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10477705B1 (en) * | 2019-03-28 | 2019-11-12 | Apacer Technology Inc. | Storage device |
US11429163B2 (en) * | 2019-05-20 | 2022-08-30 | Western Digital Technologies, Inc. | Hot spot cooling for data storage system |
CN110381690A (en) * | 2019-08-02 | 2019-10-25 | 北京智芯微电子科技有限公司 | The in-vehicle device shell of high environmental suitability |
US11317540B2 (en) * | 2019-09-20 | 2022-04-26 | Samsung Electronics Co., Ltd. | Solid state drive apparatus and data storage apparatus including the same |
USD934859S1 (en) * | 2019-11-26 | 2021-11-02 | Geotab Inc. | Car share electronic communication device |
US11099618B1 (en) * | 2020-01-27 | 2021-08-24 | Seagate Technology Llc | Compact portable data storage device |
US11275414B2 (en) * | 2020-06-30 | 2022-03-15 | Dell Products L.P. | Heat dissipation wall system |
Family Cites Families (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6185097B1 (en) * | 1997-09-10 | 2001-02-06 | Inclose Design, Inc. | Convectively cooled memory storage device housing |
JP2991172B2 (en) * | 1997-10-24 | 1999-12-20 | 日本電気株式会社 | Semiconductor device |
US6437945B1 (en) * | 1999-12-28 | 2002-08-20 | Read-Rite Corporation | Airflow assisted ramp loading and unloading of sliders in hard disk drives |
US7301776B1 (en) * | 2004-11-16 | 2007-11-27 | Super Talent Electronics, Inc. | Light-weight flash hard drive with plastic frame |
JP2001196770A (en) * | 2000-01-12 | 2001-07-19 | Omron Corp | Control unit |
KR100541654B1 (en) * | 2003-12-02 | 2006-01-12 | 삼성전자주식회사 | Wiring substrate and solid-state imaging apparatus using thereof |
DE112004002722T5 (en) * | 2004-02-11 | 2007-06-21 | Infineon Technologies Ag | Semiconductor package with perforated substrate |
US7606029B2 (en) * | 2005-11-14 | 2009-10-20 | Nuventix, Inc. | Thermal management system for distributed heat sources |
JP2007155776A (en) * | 2005-11-30 | 2007-06-21 | Fujifilm Corp | Lens barrel |
TWI328997B (en) * | 2006-08-21 | 2010-08-11 | Delta Electronics Inc | Cooling module for use with a projection apparatus |
US8659641B2 (en) * | 2007-05-18 | 2014-02-25 | 3M Innovative Properties Company | Stereoscopic 3D liquid crystal display apparatus with black data insertion |
JP2009015385A (en) * | 2007-06-29 | 2009-01-22 | Fujitsu Ltd | Electronic equipment |
KR101456975B1 (en) * | 2007-09-27 | 2014-10-31 | 삼성전자 주식회사 | Cooling unit and display apparatus having the same |
US9084375B2 (en) * | 2007-11-26 | 2015-07-14 | Seagate Technology Llc | Airflow module and data storage device enclosure |
KR101407614B1 (en) * | 2008-01-30 | 2014-06-13 | 삼성전자주식회사 | Printed circuit board, semiconductor package, card and system |
CN101568247B (en) * | 2008-04-25 | 2012-09-05 | 深圳迈瑞生物医疗电子股份有限公司 | Shielding insulating radiating system |
JP5353534B2 (en) * | 2008-08-29 | 2013-11-27 | 東芝ライテック株式会社 | Electrical equipment, discharge lamp lighting device and lighting fixture |
CN101739090A (en) * | 2008-11-20 | 2010-06-16 | 英业达股份有限公司 | Ventilation panel structure |
CN101739089B (en) * | 2008-11-20 | 2011-12-14 | 英业达股份有限公司 | Ventilation plate structure |
CN101754652B (en) * | 2008-12-04 | 2013-03-20 | 鸿富锦精密工业(深圳)有限公司 | Air volume adjuster |
US8934255B2 (en) * | 2009-03-10 | 2015-01-13 | Samsung Electronics Co., Ltd. | Super capacitor casing and supercapacitor embedded device |
JP5378863B2 (en) * | 2009-04-02 | 2013-12-25 | 株式会社ソニー・コンピュータエンタテインメント | Electronics |
CN201533475U (en) * | 2009-10-16 | 2010-07-21 | 太空医疗仪器(苏州)有限公司 | Radiating mechanism on patient monitor main machine |
US9399999B2 (en) * | 2009-10-23 | 2016-07-26 | Sunonwealth Electric Machine Industry Co., Ltd. | Heat dissipating fan |
US20110108250A1 (en) * | 2009-11-09 | 2011-05-12 | Alex Horng | Heat Dissipating device |
JP2011170566A (en) * | 2010-02-17 | 2011-09-01 | Toshiba Corp | Semiconductor storage device and electronic device |
JP4751475B1 (en) * | 2010-04-09 | 2011-08-17 | 株式会社東芝 | TV connection device, cooling module, electronic equipment |
WO2011146117A2 (en) * | 2010-05-20 | 2011-11-24 | Iosafe, Inc., A Nevada Corporation | Low cost rugged portable data storage device and docking station |
KR101362398B1 (en) * | 2012-07-10 | 2014-02-13 | 앰코 테크놀로지 코리아 주식회사 | Semiconductor package and manufacturing method thereof |
DK177109B1 (en) * | 2011-03-10 | 2011-10-03 | Venetian Solar Aps | Window code unit for mounting externally on a building |
US8338236B1 (en) * | 2011-06-15 | 2012-12-25 | Freescale Semiconductor, Inc. | Vented substrate for semiconductor device |
CN103874882A (en) * | 2011-10-10 | 2014-06-18 | 普司科Led股份有限公司 | Optical semiconductor-based lighting apparatus |
TWI505073B (en) * | 2012-03-22 | 2015-10-21 | Compal Electronics Inc | Electronic device |
JP5882818B2 (en) * | 2012-04-13 | 2016-03-09 | 株式会社ソニー・コンピュータエンタテインメント | Electronics |
JP5790610B2 (en) * | 2012-09-10 | 2015-10-07 | 日立金属株式会社 | Semiconductor device and communication device |
US9173331B2 (en) | 2012-11-20 | 2015-10-27 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Variable thickness EMI shield with variable cooling channel size |
KR102046985B1 (en) * | 2012-11-26 | 2019-12-03 | 삼성전자 주식회사 | secondary memory device |
US9123686B2 (en) | 2013-04-12 | 2015-09-01 | Western Digital Technologies, Inc. | Thermal management for solid-state drive |
KR102252555B1 (en) * | 2013-08-09 | 2021-05-17 | 양태허 | Heat dissipation device having lateral-spreading heat dissipating and shunting heat conductive structure |
US9141153B2 (en) * | 2013-09-11 | 2015-09-22 | Dell Products Lp | Hard disk drive assemblies with open side wall areas |
CN103889192B (en) * | 2014-03-26 | 2016-08-17 | 同方计算机有限公司 | Outer casing of power supply |
CN203966027U (en) * | 2014-07-11 | 2014-11-26 | 浙江财经大学 | A kind of Dustproof cabinet |
US9777999B2 (en) * | 2014-10-10 | 2017-10-03 | Cisco Technology, Inc. | Methods and systems for providing protection from projectiles |
CN204203944U (en) * | 2014-11-26 | 2015-03-11 | 苏州普福斯信息科技有限公司 | There is the SAS interface solid hard disk of power-off protection function |
US20160153648A1 (en) * | 2014-12-02 | 2016-06-02 | Posco Led Company, Ltd. | Optical semiconductor lighting apparatus |
US9609739B2 (en) * | 2015-03-10 | 2017-03-28 | Kabushiki Kaisha Toshiba | Electronic device |
KR102361637B1 (en) * | 2015-08-25 | 2022-02-10 | 삼성전자주식회사 | Solid state drive apparatus |
GB2542778A (en) * | 2015-09-28 | 2017-04-05 | Barco Nv | Front lit reflective display |
JP6072947B1 (en) * | 2016-02-01 | 2017-02-01 | 三菱電機株式会社 | Waterproof control device |
-
2018
- 2018-01-05 KR KR1020180001683A patent/KR102613515B1/en active IP Right Grant
- 2018-07-25 US US16/045,045 patent/US10638625B2/en active Active
- 2018-10-26 SG SG10201809507XA patent/SG10201809507XA/en unknown
- 2018-10-29 EP EP18203160.9A patent/EP3508945B1/en active Active
- 2018-11-13 CN CN201811345352.5A patent/CN110010165B/en active Active
- 2018-12-07 JP JP2018229630A patent/JP7282509B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP7282509B2 (en) | 2023-05-29 |
EP3508945B1 (en) | 2021-03-24 |
JP2019121789A (en) | 2019-07-22 |
KR20190083799A (en) | 2019-07-15 |
CN110010165B (en) | 2022-11-08 |
EP3508945A1 (en) | 2019-07-10 |
US20190215972A1 (en) | 2019-07-11 |
KR102613515B1 (en) | 2023-12-13 |
CN110010165A (en) | 2019-07-12 |
US10638625B2 (en) | 2020-04-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG10201809507XA (en) | Solid state drive apparatus and data storage system having the same | |
MY192137A (en) | Transceiver assembly array with fixed heatsink and floating transceivers | |
US10355146B2 (en) | Glue bleeding prevention cap for optical sensor packages | |
JP2019121789A5 (en) | ||
TW200707698A (en) | Semiconductor device, manufacturing method for semiconductor device, and electronic equipment | |
US9831216B2 (en) | Chip packaging module | |
US8779578B2 (en) | Multi-chip socket | |
SG10201808209UA (en) | Stacked memory device, a system including the same and an associated method | |
TW201614781A (en) | Semiconductor package assembly | |
SG11201901073XA (en) | Electrical element mounting package, array package, and electrical device | |
CN110064132A8 (en) | Substrate for light irradiation | |
TW200507029A (en) | Three-dimensionally mounted semiconductor module and three-dimensionally mounted semiconductor system | |
TW200733344A (en) | Multiple chip module and package stacking method for storage devices | |
MY202351A (en) | Composite stacked interconnects for high-speed applications and methods of assembling same | |
SG10201804119SA (en) | Non-volatile memory devices and methods of fabricating the same | |
SG10201805091VA (en) | Semiconductor package and method of manufacturing the same | |
US20160035593A1 (en) | Devices and methods related to support for packaging substrate panel having cavities | |
TW200727416A (en) | Method of forming a semiconductor device and structure therefor | |
US20190319157A1 (en) | Electronic device comprising electronic chips | |
US20200185251A1 (en) | Chip transferring method and a chip transferring device | |
SG10201803447TA (en) | Semiconductor Device | |
EP3032582A3 (en) | Structure and formation method of chip package structure | |
EP3514794A3 (en) | Semiconductor package with clock sharing and electronic system including the same | |
TW200729312A (en) | Method and device for extracting an electronic chip from a silicon wafer and transportine the chip to its installation location on an electronic device | |
US20150334869A1 (en) | Frequency up converter having compact size and enhanced heat emission characteristics |