SG10201808782SA - Plating apparatus and plating method - Google Patents

Plating apparatus and plating method

Info

Publication number
SG10201808782SA
SG10201808782SA SG10201808782SA SG10201808782SA SG10201808782SA SG 10201808782S A SG10201808782S A SG 10201808782SA SG 10201808782S A SG10201808782S A SG 10201808782SA SG 10201808782S A SG10201808782S A SG 10201808782SA SG 10201808782S A SG10201808782S A SG 10201808782SA
Authority
SG
Singapore
Prior art keywords
plating
paddle
magnet
substrate
end portion
Prior art date
Application number
SG10201808782SA
Inventor
Hua Chang Shao
masuda Yasuyuki
Fujikata Jumpei
Shimoyama Masashi
Nakada Tsutomu
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201808782SA publication Critical patent/SG10201808782SA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)

Abstract

PLATING APPARATUS AND PLATING METHOD A plating apparatus for plating a substrate is provided to reduce vibration of a paddle. The plating apparatus includes a plating bath configured to accommodate plating solution; a paddle that is arranged in the plating bath, and configured to move in a reciprocating direction along a surface of the substrate to stir the plating solution; a support member for supporting a first end portion of the paddle; a first magnet provided on the paddle; and a second magnet provided on the plating bath. The first magnet and the second magnet are configured to exert a magnetic force on each other so that a second end portion on an opposite side to the first end portion of the paddle is suppressed from vibrating in directions approaching and leaving the substrate while the paddle is moving. Representative drawing: Fig. 8
SG10201808782SA 2017-10-31 2018-10-04 Plating apparatus and plating method SG10201808782SA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017210618A JP6329681B1 (en) 2017-10-31 2017-10-31 Plating apparatus and plating method

Publications (1)

Publication Number Publication Date
SG10201808782SA true SG10201808782SA (en) 2019-05-30

Family

ID=62186839

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201808782SA SG10201808782SA (en) 2017-10-31 2018-10-04 Plating apparatus and plating method

Country Status (6)

Country Link
US (1) US10914019B2 (en)
JP (1) JP6329681B1 (en)
KR (1) KR102326731B1 (en)
CN (1) CN109722704B (en)
SG (1) SG10201808782SA (en)
TW (1) TWI748131B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI671435B (en) * 2018-06-08 2019-09-11 台灣創智成功科技有限公司 Plating device
JP7383441B2 (en) * 2019-10-07 2023-11-20 上村工業株式会社 Surface treatment equipment, surface treatment method and paddle
CN114855244A (en) * 2021-02-04 2022-08-05 盛美半导体设备(上海)股份有限公司 Electroplating device and electroplating method
JP7295354B1 (en) * 2022-12-09 2023-06-20 株式会社荏原製作所 Plating equipment
TWI838020B (en) * 2022-12-19 2024-04-01 日商荏原製作所股份有限公司 Coating equipment

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2693788A (en) * 1952-10-04 1954-11-09 Frawley Corp Magnetic desk pen set
JPS60112298A (en) * 1983-11-24 1985-06-18 Hitachi Ltd Rotating anode x-ray tube apparatus
JPH0217562U (en) * 1988-07-22 1990-02-05
JPH03294497A (en) * 1990-04-12 1991-12-25 C Uyemura & Co Ltd Surface treatment in small hole
JP2002121699A (en) * 2000-05-25 2002-04-26 Nippon Techno Kk Electroplating method using combination of vibrating flow and impulsive plating current of plating bath
JP4434948B2 (en) 2002-07-18 2010-03-17 株式会社荏原製作所 Plating apparatus and plating method
JP4057481B2 (en) * 2003-06-30 2008-03-05 Ｄｏｗａホールディングス株式会社 Wet processing mask equipment
CN2813528Y (en) * 2005-01-24 2006-09-06 区永辉 Crawler belt conveyer apparatus
US7671712B2 (en) * 2005-03-25 2010-03-02 Ellihay Corp Levitation of objects using magnetic force
JP4700406B2 (en) * 2005-05-13 2011-06-15 日本メクトロン株式会社 Sheet product plating method
US8177944B2 (en) * 2007-12-04 2012-05-15 Ebara Corporation Plating apparatus and plating method
JP5184308B2 (en) * 2007-12-04 2013-04-17 株式会社荏原製作所 Plating apparatus and plating method
KR20100074979A (en) * 2008-12-24 2010-07-02 재단법인 포항산업과학연구원 Apparatus for coolling a continuous galvanizing line
US8178987B2 (en) * 2009-05-20 2012-05-15 E-Net, Llc Wind turbine
JP5731917B2 (en) * 2011-06-30 2015-06-10 上村工業株式会社 Surface treatment equipment and plating tank
JP6100049B2 (en) * 2013-03-25 2017-03-22 株式会社荏原製作所 Plating equipment
KR101384140B1 (en) * 2013-12-23 2014-04-10 한국항공우주연구원 Vibration reduction apparatus using permanent magnet
JP6411943B2 (en) * 2014-05-26 2018-10-24 株式会社荏原製作所 Substrate electrolytic treatment apparatus and paddle used for the substrate electrolytic treatment apparatus

Also Published As

Publication number Publication date
TWI748131B (en) 2021-12-01
US10914019B2 (en) 2021-02-09
KR102326731B1 (en) 2021-11-17
KR20190049446A (en) 2019-05-09
JP6329681B1 (en) 2018-05-23
TW201923166A (en) 2019-06-16
CN109722704B (en) 2021-04-27
JP2019081932A (en) 2019-05-30
US20190127875A1 (en) 2019-05-02
CN109722704A (en) 2019-05-07

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