TWI838020B - Coating equipment - Google Patents

Coating equipment Download PDF

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TWI838020B
TWI838020B TW111148693A TW111148693A TWI838020B TW I838020 B TWI838020 B TW I838020B TW 111148693 A TW111148693 A TW 111148693A TW 111148693 A TW111148693 A TW 111148693A TW I838020 B TWI838020 B TW I838020B
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magnet
magnet portion
coating
paddle
disposed
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TW111148693A
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Chinese (zh)
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関正也
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日商荏原製作所股份有限公司
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Abstract

本發明係在杯式之鍍覆裝置中抑制槳葉的中央部下垂。本發明係包含:用於收容鍍覆液之鍍覆槽410;配置於鍍覆槽410內之陽極;以在將被鍍覆面Wf-a朝向下方狀態下保持基板Wf之方式而構成的基板固持器;配置於陽極與基板Wf之間的槳葉460;以支撐槳葉460之基端部460A,並使槳葉460沿著基板Wf之被鍍覆面Wf-a而往返移動的方式構成之驅動機構462;設於槳葉460之第一磁鐵464;及以與第一磁鐵464相對之方式而設的第二磁鐵468;第一磁鐵464及第二磁鐵468係以在槳葉460之基端部460A與前端部460B之間的中央部460C接近基板Wf之被鍍覆面Wf-a的方式,而彼此帶來磁力之方式構成。The present invention is to suppress the central part of the paddle from sagging in a cup-type coating device. The present invention comprises: a coating tank 410 for containing a coating liquid; an anode disposed in the coating tank 410; a substrate holder configured to hold a substrate Wf with the coated surface Wf-a facing downward; a paddle 460 disposed between the anode and the substrate Wf; a base end 460A of the paddle 460 is supported, and the paddle 460 is moved back and forth along the coated surface Wf-a of the substrate Wf. a driving mechanism 462 constructed in a manner; a first magnet 464 provided on the paddle 460; and a second magnet 468 provided in a manner opposite to the first magnet 464; the first magnet 464 and the second magnet 468 are constructed in a manner such that a central portion 460C between a base end portion 460A and a front end portion 460B of the paddle 460 is close to a coated surface Wf-a of a substrate Wf, thereby bringing magnetic force to each other.

Description

鍍覆裝置Coating equipment

本發明係關於一種鍍覆裝置。The present invention relates to a coating device.

習知有用於在基板(例如半導體晶圓)之被鍍覆面形成導電膜的電解鍍覆裝置。例如專利文獻1中揭示有使基板以豎立狀態浸漬於鍍覆液來進行鍍覆處理之所謂浸漬式電解鍍覆裝置。另外,鍍覆裝置之一例亦習知有使基板以橫躺狀態浸漬於鍍覆液之所謂杯式的電解鍍覆裝置。Electrolytic plating apparatuses are known for forming a conductive film on a surface to be plated of a substrate (e.g., a semiconductor wafer). For example, Patent Document 1 discloses an immersion-type electrolytic plating apparatus in which a substrate is immersed in a plating solution in a vertical state to perform a plating process. In addition, a cup-type electrolytic plating apparatus is also known as an example of a plating apparatus in which a substrate is immersed in a plating solution in a horizontal state.

揭示於專利文獻1之浸漬式的電解鍍覆裝置係在基板之被鍍覆面附近配置槳葉,藉由使槳葉沿著基板之被鍍覆面往返移動來攪拌被鍍覆面附近的鍍覆液。該電解鍍覆裝置由於係支撐有槳葉之上端,而在攪拌鍍覆液時槳葉之下端會振動,因此係以分別在槳葉之下端與鍍覆槽設置磁鐵,藉由此等磁鐵之磁力來抑制槳葉下端振動的方式而構成。The immersion electrolytic coating device disclosed in Patent Document 1 is a device that arranges a paddle near the coating surface of the substrate, and stirs the coating liquid near the coating surface by moving the paddle back and forth along the coating surface of the substrate. Since the upper end of the paddle is supported, the lower end of the paddle vibrates when the coating liquid is stirred, so magnets are provided at the lower end of the paddle and the coating tank, respectively, and the magnetic force of the magnets is used to suppress the vibration of the lower end of the paddle.

[先前技術文獻] [專利文獻] [專利文獻1]專利6329681號公報 [Prior technical literature] [Patent literature] [Patent literature 1] Patent publication No. 6329681

(發明所欲解決之問題)(Invent the problem you want to solve)

欲將揭示於專利文獻1之技術適用於杯式的鍍覆裝置時,會發生槳葉之中央部下垂的新問題。When the technology disclosed in Patent Document 1 is applied to a cup-type coating device, a new problem of sagging of the central portion of the blade will occur.

亦即,在杯式之鍍覆裝置中,實際支撐槳葉之基端部,並且在槳葉之前端部及鍍覆槽設置磁鐵,藉由此等之磁力來支撐槳葉之前端部(抑制振動)時,槳葉之中央部可能因重力而下垂。當槳葉撓曲而中央部下垂時,可能槳葉會干擾到配置於槳葉下方之電阻器而產生微粒子,因此不適宜。That is, in a cup-type coating device, the base end of the paddle is actually supported, and magnets are provided at the front end of the paddle and the coating groove. When the front end of the paddle is supported by such magnetic force (to suppress vibration), the center of the paddle may sag due to gravity. When the paddle is bent and the center sags, the paddle may interfere with the resistor arranged under the paddle and generate particles, so it is not suitable.

因此,本申請案之1個目的為在杯式的鍍覆裝置中抑制槳葉之中央部下垂。 (解決問題之手段) Therefore, one of the purposes of this application is to suppress the sagging of the center portion of the blade in a cup-type coating device. (Means for solving the problem)

一個實施形態揭示一種鍍覆裝置,係包含:鍍覆槽,其係用於收容鍍覆液;陽極,其係配置於前述鍍覆槽內;基板固持器,其係以在將被鍍覆面朝向下方狀態下保持基板之方式而構成;槳葉,其係配置於前述陽極與前述基板之間;槳葉驅動機構,其係以支撐前述槳葉之基端部,使前述槳葉沿著前述基板之被鍍覆面而往返移動的方式而構成;第一磁鐵,其係設於前述槳葉;及第二磁鐵,其係與前述第一磁鐵相對而設;前述第一磁鐵及前述第二磁鐵係以前述槳葉之前述基端部與前端部之間的中央部接近前述基板之被鍍覆面的方式,且彼此帶來磁力之方式而構成。One embodiment discloses a coating device, comprising: a coating tank for containing a coating liquid; an anode disposed in the coating tank; a substrate holder configured to hold the substrate with the surface to be coated facing downward; a paddle disposed between the anode and the substrate; and a paddle driving mechanism for supporting the base end of the paddle so that the front end of the paddle is moved upward. The paddle is constructed in such a way that it moves back and forth along the coated surface of the substrate; the first magnet is arranged on the paddle; and the second magnet is arranged opposite to the first magnet; the first magnet and the second magnet are constructed in such a way that the central part between the base end and the front end of the paddle approaches the coated surface of the substrate and exerts magnetic force on each other.

以下,參照圖式說明本發明之實施形態。以下說明之圖式中,對相同或相當之構成元件註記相同符號,並省略重複之說明。 <鍍覆裝置之整體構成> The following is a description of the implementation of the present invention with reference to the drawings. In the drawings described below, the same or equivalent components are marked with the same symbols, and repeated descriptions are omitted. <Overall structure of the coating device>

圖1係顯示本實施形態之鍍覆裝置的整體構成之立體圖。圖2係顯示本實施形態之鍍覆裝置的整體構成之俯視圖。如圖1、2所示,鍍覆裝置1000具備:裝載埠100、搬送機器人110、對準器120、預濕模組200、預浸模組300、鍍覆模組400、清洗模組500、自旋沖洗乾燥機600、搬送裝置700、及控制模組800。FIG. 1 is a perspective view showing the overall structure of the coating device of this embodiment. FIG. 2 is a top view showing the overall structure of the coating device of this embodiment. As shown in FIGS. 1 and 2 , the coating device 1000 includes: a loading port 100, a transfer robot 110, an aligner 120, a pre-wetting module 200, a pre-preg module 300, a coating module 400, a cleaning module 500, a spin-rinse dryer 600, a transfer device 700, and a control module 800.

裝載埠100係用於搬入收納於鍍覆裝置1000中無圖示之FOUP等匣盒的基板,或從鍍覆裝置1000搬出基板至匣盒的模組。本實施形態係在水平方向排列配置4台裝載埠100,不過裝載埠100之數量及配置不拘。搬送機器人110係用於搬送基板之機器人,且係以在裝載埠100、對準器120、預濕模組200及自旋沖洗乾燥機600之間交接基板的方式而構成。搬送機器人110及搬送裝置700在搬送機器人110與搬送裝置700之間交接基板時,可經由無圖示之暫放台來進行基板的交接。The loading port 100 is a module for carrying in substrates stored in a cassette such as a FOUP (not shown) in the coating apparatus 1000, or carrying out substrates from the coating apparatus 1000 to a cassette. In this embodiment, four loading ports 100 are arranged in a horizontal direction, but the number and arrangement of the loading ports 100 are not limited. The transport robot 110 is a robot for transporting substrates, and is configured in a manner of transferring substrates between the loading port 100, the aligner 120, the pre-wetting module 200, and the spin rinse dryer 600. When the transport robot 110 and the transport device 700 transfer substrates between the transport robot 110 and the transport device 700, the transfer of substrates can be performed via a temporary stage (not shown).

對準器120係用於將基板之定向平面或凹槽等位置對準指定方向的模組。本實施形態係在水平方向排列配置2台對準器120,不過對準器120之數量及配置不拘。預濕模組200藉由以純水或脫氣水等處理液濕潤鍍覆處理前之基板的被鍍覆面,而將形成於基板表面之圖案內部的空氣替換成處理液。預濕模組200係以在鍍覆時藉由將圖案內部之處理液替換成鍍覆液,來實施容易在圖案內部供給鍍覆液之預濕處理的方式而構成。本實施形態係在上下方向排列配置2台預濕模組200,不過預濕模組200之數量及配置不拘。The aligner 120 is a module used to align the orientation plane or groove of the substrate in a specified direction. In this embodiment, two aligners 120 are arranged in a horizontal direction, but the number and arrangement of the aligners 120 are not limited. The prewet module 200 wets the coated surface of the substrate before the plating process with a processing liquid such as pure water or degassed water, thereby replacing the air inside the pattern formed on the surface of the substrate with the processing liquid. The prewet module 200 is constructed in a manner that the processing liquid inside the pattern is replaced with the plating liquid during plating, so as to implement a prewet treatment that easily supplies the plating liquid inside the pattern. In this embodiment, two prewet modules 200 are arranged in a vertical direction, but the number and arrangement of the prewet modules 200 are not limited.

預浸模組300例如係以硫酸或鹽酸等之處理液蝕刻除去存在於形成在鍍覆處理前之基板的被鍍覆面之種層表面等的電阻大之氧化膜,實施清洗或活化鍍覆基底表面之預浸處理的方式而構成。本實施形態係在上下方向排列配置2台預浸模組300,不過預浸模組300之數量及配置不拘。鍍覆模組400對基板實施鍍覆處理。本實施形態有2組在上下方向排列3台且在水平方向排列4排而配置之12台鍍覆模組400,合計設有24台鍍覆模組400,不過鍍覆模組400之數量及配置不拘。The pre-preg module 300 is constructed by etching away a high-resistance oxide film existing on the surface of the seed layer formed on the plated surface of the substrate before the plating treatment with a treatment solution such as sulfuric acid or hydrochloric acid, and performing a pre-preg treatment to clean or activate the surface of the plated substrate. In this embodiment, two pre-preg modules 300 are arranged in the vertical direction, but the number and arrangement of the pre-preg modules 300 are not limited. The plating module 400 performs a plating treatment on the substrate. In this embodiment, there are two groups of 12 plating modules 400 arranged in 3 rows in the vertical direction and 4 rows in the horizontal direction, and a total of 24 plating modules 400 are provided, but the number and arrangement of the plating modules 400 are not limited.

清洗模組500係以為了除去殘留於鍍覆處理後之基板的鍍覆液等,而對基板實施清洗處理之方式而構成。本實施形態係在上下方向排列配置2台清洗模組500,不過清洗模組500之數量及配置不拘。自旋沖洗乾燥機600係用於使清洗處理後之基板高速旋轉而乾燥的模組,本實施形態係在上下方向排列配置2台自旋沖洗乾燥機,不過自旋沖洗乾燥機之數量及配置不拘。搬送裝置700係用於在鍍覆裝置1000內之複數個模組間搬送基板的裝置。控制模組800係以控制鍍覆裝置1000之複數個模組的方式而構成。例如,可由具備與作業人員之間的輸入輸出介面之一般性電腦或專用電腦而構成。The cleaning module 500 is configured to perform a cleaning process on the substrate in order to remove the coating liquid and the like remaining on the substrate after the coating process. In this embodiment, two cleaning modules 500 are arranged in the vertical direction, but the number and arrangement of the cleaning modules 500 are not limited. The spin-rinse dryer 600 is a module used to spin the substrate after the cleaning process at high speed to dry it. In this embodiment, two spin-rinse dryers are arranged in the vertical direction, but the number and arrangement of the spin-rinse dryers are not limited. The transport device 700 is a device used to transport substrates between multiple modules in the coating device 1000. The control module 800 is configured to control multiple modules of the coating device 1000. For example, it can be composed of a general computer or a special-purpose computer equipped with an input and output interface between the operator.

說明鍍覆裝置1000之一連串鍍覆處理的一例。首先,將收納於匣盒之基板搬入裝載埠100。繼續,搬送機器人110從裝載埠100之匣盒取出基板,並將基板搬送至對準器120。對準器120將基板之定向平面或凹槽等之位置對準指定方向。搬送機器人110將經對準器120對準了方向之基板送交預濕模組200。An example of a continuous coating process of the coating device 1000 is described. First, the substrate stored in the cassette is moved into the loading port 100. Then, the transport robot 110 takes out the substrate from the cassette of the loading port 100 and transports the substrate to the aligner 120. The aligner 120 aligns the position of the orientation plane or groove of the substrate in a specified direction. The transport robot 110 delivers the substrate aligned by the aligner 120 to the pre-wetting module 200.

預濕模組200對基板實施預濕處理。搬送裝置700將實施了預濕處理之基板搬送至預浸模組300。預浸模組300對基板實施預浸處理。搬送裝置700將實施了預浸處理之基板搬送至鍍覆模組400。鍍覆模組400對基板實施鍍覆處理。The prewetting module 200 performs a prewetting process on the substrate. The transport device 700 transports the substrate that has been prewetted to the prepreg module 300. The prepreg module 300 performs a prepreg process on the substrate. The transport device 700 transports the substrate that has been prewetted to the coating module 400. The coating module 400 performs a coating process on the substrate.

搬送裝置700將實施了鍍覆處理之基板搬送至清洗模組500。清洗模組500對基板實施清洗處理。搬送裝置700將實施了清洗處理之基板搬送至自旋沖洗乾燥機600。自旋沖洗乾燥機600對基板實施乾燥處理。搬送機器人110從自旋沖洗乾燥機600接收基板,並將實施了乾燥處理之基板搬送至裝載埠100的匣盒。最後,從裝載埠100搬出收納有基板之匣盒。 <鍍覆模組之構成> The transport device 700 transports the substrate subjected to the coating process to the cleaning module 500. The cleaning module 500 performs a cleaning process on the substrate. The transport device 700 transports the substrate subjected to the cleaning process to the spin-rinsing dryer 600. The spin-rinsing dryer 600 performs a drying process on the substrate. The transport robot 110 receives the substrate from the spin-rinsing dryer 600 and transports the substrate subjected to the drying process to the cassette of the loading port 100. Finally, the cassette containing the substrate is unloaded from the loading port 100. <Structure of the coating module>

其次,說明鍍覆模組400之構成。由於本實施形態中之24台鍍覆模組400係相同構成,因此僅說明1台鍍覆模組400。圖3係概略顯示一個實施形態之鍍覆模組的構成之縱剖面圖。Next, the structure of the coating module 400 will be described. Since the 24 coating modules 400 in this embodiment have the same structure, only one coating module 400 will be described. FIG3 is a longitudinal cross-sectional view schematically showing the structure of a coating module of one embodiment.

如圖3所示,鍍覆模組400具備用於收容鍍覆液之鍍覆槽410。鍍覆模組400具備將鍍覆槽410之內部以上下方向隔開的隔膜420。鍍覆槽410之內部藉由隔膜420而隔開成陰極區域422與陽極區域424。As shown in FIG3 , the coating module 400 has a coating tank 410 for containing a coating liquid. The coating module 400 has a diaphragm 420 that separates the interior of the coating tank 410 in the vertical direction. The interior of the coating tank 410 is separated into a cathode region 422 and an anode region 424 by the diaphragm 420 .

在陰極區域422與陽極區域424中分別填充鍍覆液。鍍覆模組400具備朝向陰極區域422而開口之噴嘴426;及用於經由噴嘴426而在陰極區域422中供給鍍覆液之供給源428。鍍覆模組400關於陽極區域424亦同樣地具備用於在陽極區域424中供給鍍覆液之機構,不過省略圖示。在陽極區域424之鍍覆槽410的底面設置陽極430。在陰極區域422與隔膜420相對而配置電阻器450。電阻器450係用於謀求在基板Wf之被鍍覆面Wf-a均勻實施鍍覆處理的構件,且藉由形成有許多孔之板狀構件而構成。The cathode region 422 and the anode region 424 are filled with plating liquids, respectively. The plating module 400 has a nozzle 426 opened toward the cathode region 422, and a supply source 428 for supplying the plating liquid in the cathode region 422 through the nozzle 426. The plating module 400 also has a mechanism for supplying the plating liquid in the anode region 424, but the mechanism is omitted from the figure. An anode 430 is provided on the bottom surface of the plating groove 410 of the anode region 424. A resistor 450 is arranged in the cathode region 422 opposite to the diaphragm 420. The resistor 450 is a component for uniformly performing a plating process on the plating surface Wf-a of the substrate Wf, and is formed by a plate-like component having many holes.

此外,鍍覆模組400具備在將被鍍覆面Wf-a朝向下方之狀態用於保持基板Wf之基板固持器440。基板固持器440具備用於從無圖示之電源饋電至基板Wf的饋電接點。基板固持器440具備:用於支撐基板Wf之被鍍覆面Wf-a的外緣部之密封環固持器442;與用於將密封環固持器442保持於無圖示之基板固持器本體的框架446。此外,基板固持器440具備:用於按壓基板Wf之被鍍覆面Wf-a的背面之背面板444;與安裝於背面板444之基板按壓面的背面之軸桿448。In addition, the coating module 400 has a substrate holder 440 for holding the substrate Wf in a state where the coated surface Wf-a faces downward. The substrate holder 440 has a feeding contact for feeding power from a power source not shown to the substrate Wf. The substrate holder 440 has: a sealing ring holder 442 for supporting the outer edge of the coated surface Wf-a of the substrate Wf; and a frame 446 for holding the sealing ring holder 442 to the substrate holder body not shown. In addition, the substrate holder 440 has: a back panel 444 for pressing the back side of the coated surface Wf-a of the substrate Wf; and a shaft 448 mounted on the back side of the substrate pressing surface of the back panel 444.

鍍覆模組400具備:用於使基板固持器440升降之升降機構443;及以基板Wf在軸桿448之虛擬軸(在被鍍覆面Wf-a之中央垂直地延伸的虛擬之旋轉軸)周圍旋轉的方式用於使基板固持器440旋轉之旋轉機構447。升降機構443及旋轉機構447例如可藉由馬達等習知之機構來實現。鍍覆模組400係以使用升降機構443將基板Wf浸漬於陰極區域422之鍍覆液,並藉由在陽極430與基板Wf之間施加電壓,而在基板Wf之被鍍覆面Wf-a上實施鍍覆處理的方式而構成。The coating module 400 is provided with a lifting mechanism 443 for lifting and lowering a substrate holder 440, and a rotating mechanism 447 for rotating the substrate holder 440 in a manner that the substrate Wf rotates around a virtual axis of a shaft 448 (a virtual rotation axis extending vertically in the center of the coating surface Wf-a). The lifting mechanism 443 and the rotating mechanism 447 can be realized by a known mechanism such as a motor. The coating module 400 is configured in a manner that the substrate Wf is immersed in the coating liquid of the cathode region 422 using the lifting mechanism 443, and a voltage is applied between the anode 430 and the substrate Wf, thereby performing a coating process on the coating surface Wf-a of the substrate Wf.

此外,鍍覆模組400具備配置於陽極430與基板Wf之間,具體而言,係配置於電阻器450與基板Wf之間的槳葉460。槳葉460與基板Wf之被鍍覆面Wf-a相對而配置。鍍覆模組400具備實際支撐槳葉460之基端部460A,並且用於使槳葉460沿著基板Wf之被鍍覆面Wf-a往返移動的驅動機構462。驅動機構462例如可藉由馬達等習知之機構來實現。In addition, the coating module 400 has a paddle 460 disposed between the anode 430 and the substrate Wf, specifically, between the resistor 450 and the substrate Wf. The paddle 460 is disposed opposite to the coating surface Wf-a of the substrate Wf. The coating module 400 has a base end 460A that actually supports the paddle 460 and a driving mechanism 462 for moving the paddle 460 back and forth along the coating surface Wf-a of the substrate Wf. The driving mechanism 462 can be realized by a known mechanism such as a motor, for example.

圖4A及圖4B係概略顯示槳葉之構成的俯視圖。如圖4A所示,槳葉460可藉由係藉由格柵狀配置複數個棒狀構件460a而形成有許多孔460b之板構件而構成。槳葉460具有基端部460A;與基端部460A相反側之前端部460B;及在基端部460A與前端部460B之間的中央部460C而構成。此外,如圖4B所示,槳葉460亦可藉由形成有蜂巢狀之許多孔460c的板構件而構成。藉由驅動機構462使槳葉460往返移動,來攪拌基板Wf之被鍍覆面Wf-a附近的鍍覆液,可促進鍍覆處理。另外,圖4A及圖4B係俯視地顯示槳葉460係矩形形狀,不過不限於此,槳葉460之形狀不拘。FIG. 4A and FIG. 4B are top views schematically showing the structure of the paddle. As shown in FIG. 4A, the paddle 460 can be formed by a plate member having a plurality of rod-shaped members 460a arranged in a grid shape to form a plurality of holes 460b. The paddle 460 has a base end 460A; a front end 460B on the opposite side of the base end 460A; and a center portion 460C between the base end 460A and the front end 460B. In addition, as shown in FIG. 4B, the paddle 460 can also be formed by a plate member having a plurality of honeycomb-shaped holes 460c. The paddle 460 is moved back and forth by a driving mechanism 462 to stir the plating liquid near the coating surface Wf-a of the substrate Wf, thereby promoting the plating process. 4A and 4B are top views showing that the paddle blade 460 is in a rectangular shape, but the present invention is not limited thereto, and the paddle blade 460 may have any shape.

圖5係放大一個實施形態之鍍覆模組的構成之一部分而概略顯示的縱剖面圖。圖5放大圖3中之虛線α的部分而概略顯示。如圖5所示,鍍覆模組400具備:設於槳葉460之第一磁鐵464;及以與第一磁鐵464相對之方式而設的第二磁鐵468。FIG5 is a longitudinal cross-sectional view schematically showing a portion of the structure of a coating module of an embodiment by enlarging the portion of the dotted line α in FIG3 . As shown in FIG5 , the coating module 400 has: a first magnet 464 provided on the blade 460; and a second magnet 468 provided in a manner opposite to the first magnet 464.

更具體而言,第一磁鐵464包含設於槳葉460之前端部460B的前端磁鐵部464B。前端磁鐵部464B具有沿著槳葉460之延伸方向而配置的前端內側磁鐵部464B-1及前端外側磁鐵部464B-2。前端內側磁鐵部464B-1設於對應於槳葉460之最前端內側的位置,並在下部配置N極,在上部配置S極。前端外側磁鐵部464B-2設於對應於槳葉460之最前端的位置,並在下部配置N極,在上部配置S極。More specifically, the first magnet 464 includes a front end magnet portion 464B disposed at the front end portion 460B of the paddle 460. The front end magnet portion 464B has a front end inner magnet portion 464B-1 and a front end outer magnet portion 464B-2 disposed along the extension direction of the paddle 460. The front end inner magnet portion 464B-1 is disposed at a position corresponding to the inner side of the front end of the paddle 460, and has an N pole at the bottom and an S pole at the top. The front end outer magnet portion 464B-2 is disposed at a position corresponding to the front end of the paddle 460, and has an N pole at the bottom and an S pole at the top.

此外,第二磁鐵468係以與第一磁鐵464之下面相對的方式而設於鍍覆槽410。第二磁鐵468包含以帶來提高前端內側磁鐵部464B-1之磁力的方式而構成之第一內側磁鐵部468B-1。具體而言,第一內側磁鐵部468B-1將與前端內側磁鐵部464B-1之下部(N極)同極(N極)配置於上部,並將S極配置於下部。第一內側磁鐵部468B-1固定於鍍覆槽410,並藉由第一內側磁鐵部468B-1與前端內側磁鐵部464B-1互相排斥,而產生提高前端內側磁鐵部464B-1之磁力。In addition, the second magnet 468 is disposed in the coating groove 410 in a manner opposite to the lower surface of the first magnet 464. The second magnet 468 includes a first inner magnet portion 468B-1 configured to enhance the magnetic force of the front inner magnet portion 464B-1. Specifically, the first inner magnet portion 468B-1 is configured with the same pole (N pole) as the lower portion (N pole) of the front inner magnet portion 464B-1 at the upper portion, and the S pole is configured at the lower portion. The first inner magnet portion 468B-1 is fixed to the plating groove 410, and the first inner magnet portion 468B-1 and the front inner magnet portion 464B-1 repel each other, thereby generating a magnetic force that increases the front inner magnet portion 464B-1.

第二磁鐵468包含以帶來降低前端外側磁鐵部464B-2之磁力的方式而構成之第一外側磁鐵部468B-2。具體而言,第一外側磁鐵部468B-2將與前端外側磁鐵部464B-2之下部(N極)相反極(S極)配置於上部,並將N極配置於下部。第一外側磁鐵部468B-2固定於鍍覆槽410,藉由第一外側磁鐵部468B-2與前端外側磁鐵部464B-2互相吸引而產生降低第一外側磁鐵部468B-2之磁力。The second magnet 468 includes a first outer magnet portion 468B-2 configured to reduce the magnetic force of the front outer magnet portion 464B-2. Specifically, the first outer magnet portion 468B-2 is configured with a pole (S pole) opposite to the lower portion (N pole) of the front outer magnet portion 464B-2 at the upper portion, and the N pole is configured at the lower portion. The first outer magnet portion 468B-2 is fixed to the plating groove 410, and the first outer magnet portion 468B-2 and the front outer magnet portion 464B-2 attract each other to generate a magnetic force that reduces the first outer magnet portion 468B-2.

藉此,如圖5所示,由於產生降低槳葉460最前端之磁力,及提高最前端內側之磁力,因此產生抬起槳葉460的中央部460C之力。結果,可抑制槳葉460之中央部460C下垂至電阻器450側。亦即,由於槳葉460之厚度對從基端部460A至前端部460B的長度小,因此槳葉460容易藉由重力而撓曲。特別是槳葉460之材料使用剛性低的樹脂時,即使實際支撐槳葉460之基端部460A,且藉由磁力支撐前端部460B之下垂,中央部460C仍有可能下垂至電阻器450側。相對而言,本實施形態之第一磁鐵464與第二磁鐵468係以槳葉460之中央部460C接近基板Wf之被鍍覆面Wf-a的方式而彼此帶來磁力之方式構成。藉此,可抑制槳葉460之中央部460C下垂至電阻器450側,結果,可抑制槳葉460干擾到電阻器450而產生微粒子。As a result, as shown in FIG. 5 , since a magnetic force is generated to lower the front end of the paddle 460 and a magnetic force is generated to increase the inner side of the front end, a force is generated to lift the central portion 460C of the paddle 460. As a result, the central portion 460C of the paddle 460 can be suppressed from sagging to the side of the resistor 450. That is, since the thickness of the paddle 460 is small relative to the length from the base end 460A to the front end 460B, the paddle 460 is easily bent by gravity. In particular, when a resin with low rigidity is used as the material of the paddle 460, even if the base end 460A of the paddle 460 is actually supported and the front end 460B is supported to sag by the magnetic force, the central portion 460C may still sag to the side of the resistor 450. In contrast, the first magnet 464 and the second magnet 468 of the present embodiment are configured so that the central portion 460C of the paddle 460 is close to the coated surface Wf-a of the substrate Wf and exerts magnetic force on each other. This prevents the central portion 460C of the paddle 460 from sagging to the side of the resistor 450, and as a result, prevents the paddle 460 from interfering with the resistor 450 and generating particles.

抬起槳葉460的中央部460C之力取決於在第一磁鐵464與第二磁鐵468之間作用的磁力。藉由調整作用於兩者之磁力,而如圖5所示,可概略水平地保持槳葉460。此外,藉由進一步增強作用於兩者之磁力,而如圖5中之虛線β所示,槳葉460之中央部460C係以突出於基板Wf之被鍍覆面Wf-a側的方式可將槳葉460保持成弓形的形狀。藉此,由於槳葉460接近基板Wf之被鍍覆面Wf-a,因此可使在被鍍覆面Wf-a附近之鍍覆液的攪拌作用提高。特別是如本實施形態採用具有支撐被鍍覆面Wf-a之外緣部的密封環固持器442之基板固持器440時,使整個槳葉460接近被鍍覆面Wf-a時,會有槳葉460與密封環固持器442干擾的問題。關於這一點,如本實施形態藉由將槳葉460形成弓形形狀,可避免與密封環固持器442干擾而使槳葉460接近被鍍覆面Wf-a。The force that lifts the central portion 460C of the paddle 460 is determined by the magnetic force acting between the first magnet 464 and the second magnet 468. By adjusting the magnetic force acting on both, as shown in FIG5 , the paddle 460 can be maintained substantially horizontally. In addition, by further increasing the magnetic force acting on both, as shown by the dotted line β in FIG5 , the paddle 460 can be maintained in an arched shape in a manner that the central portion 460C of the paddle 460 protrudes from the coating surface Wf-a side of the substrate Wf. Thus, since the paddle 460 is close to the coating surface Wf-a of the substrate Wf, the stirring effect of the coating liquid near the coating surface Wf-a can be enhanced. In particular, when the present embodiment adopts the substrate holder 440 having the sealing ring holder 442 supporting the outer edge of the plated surface Wf-a, when the entire paddle 460 is brought close to the plated surface Wf-a, there is a problem of interference between the paddle 460 and the sealing ring holder 442. In this regard, the present embodiment forms the paddle 460 into an arched shape, thereby avoiding interference with the sealing ring holder 442 and bringing the paddle 460 close to the plated surface Wf-a.

其次,說明鍍覆模組400之變化例。圖6係放大一個實施形態之鍍覆模組的構成之一部分而概略顯示的縱剖面圖。圖6所示之鍍覆模組400具備與圖5所示之鍍覆模組400同樣的構成,而不同之處為進一步亦在槳葉460之基端部460A側設置磁鐵。就與圖5同樣之構成省略說明。Next, a variation of the coating module 400 will be described. FIG6 is a longitudinal cross-sectional view schematically showing a portion of the structure of a coating module of an embodiment by enlarging the structure. The coating module 400 shown in FIG6 has the same structure as the coating module 400 shown in FIG5, but the difference is that a magnet is further provided on the base end 460A side of the blade 460. The description of the same structure as FIG5 is omitted.

如圖6所示,第一磁鐵464進一步具備設於槳葉460之基端部460A的基端磁鐵部464A。基端磁鐵部464A具有沿著槳葉460之延伸方向而配置的基端內側磁鐵部464A-1及基端外側磁鐵部464A-2。基端內側磁鐵部464A-1設於對應於槳葉460之最基端內側的位置,在下部配置N極,並在上部配置S極。基端外側磁鐵部464A-2設於對應於槳葉460之最基端的位置,並在下部配置N極,在上部配置S極。As shown in FIG6 , the first magnet 464 further includes a base end magnet portion 464A provided at the base end portion 460A of the blade 460. The base end magnet portion 464A includes a base end inner side magnet portion 464A-1 and a base end outer side magnet portion 464A-2 arranged along the extending direction of the blade 460. The base end inner side magnet portion 464A-1 is provided at a position corresponding to the innermost base end of the blade 460, and has an N pole at the bottom and an S pole at the top. The base end outer side magnet portion 464A-2 is provided at a position corresponding to the basemost end of the blade 460, and has an N pole at the bottom and an S pole at the top.

此外,第二磁鐵468包含以帶來提高基端內側磁鐵部464A-1之磁力的方式而構成之第二內側磁鐵部468A-1。具體而言,第二內側磁鐵部468A-1將與基端內側磁鐵部464A-1之下部(N極)同極(N極)配置於上部,並將S極配置於下部。第二內側磁鐵部468A-1固定於鍍覆槽410,藉由第二內側磁鐵部468A-1與基端內側磁鐵部464A-1互相排斥,而產生提高第二內側磁鐵部468A-1之磁力。In addition, the second magnet 468 includes a second inner magnet portion 468A-1 configured to enhance the magnetic force of the base inner magnet portion 464A-1. Specifically, the second inner magnet portion 468A-1 is configured with the same pole (N pole) as the lower portion (N pole) of the base inner magnet portion 464A-1 at the upper portion, and the S pole is configured at the lower portion. The second inner magnet portion 468A-1 is fixed to the plating groove 410, and the second inner magnet portion 468A-1 and the base inner magnet portion 464A-1 repel each other, thereby generating a magnetic force that enhances the second inner magnet portion 468A-1.

第二磁鐵468包含以帶來降低基端外側磁鐵部464A-2之磁力的方式而構成之第二外側磁鐵部468A-2。具體而言,第二外側磁鐵部468A-2將與基端外側磁鐵部464A-2之下部(N極)相反極(S極)配置於上部,並將N極配置於下部。第二外側磁鐵部468A-2固定於鍍覆槽410,第二外側磁鐵部468A-2與基端外側磁鐵部464A-2互相吸引,而產生降低第二外側磁鐵部468A-2之磁力。The second magnet 468 includes a second outer magnet portion 468A-2 configured to reduce the magnetic force of the base outer magnet portion 464A-2. Specifically, the second outer magnet portion 468A-2 is configured with a pole (S pole) opposite to the lower portion (N pole) of the base outer magnet portion 464A-2 at the upper portion, and the N pole is configured at the lower portion. The second outer magnet portion 468A-2 is fixed to the plating groove 410, and the second outer magnet portion 468A-2 and the base outer magnet portion 464A-2 attract each other, thereby generating a magnetic force that reduces the second outer magnet portion 468A-2.

由於不僅槳葉460之前端部460B側,就連基端部460A側亦產生降低槳葉460之最基端的磁力、及提高最基端之內側的磁力,因此磁力係以將槳葉460之中央部460C接近基板Wf之被鍍覆面Wf-a的方式而作用。結果,可更強力抑制槳葉460之中央部460C下垂至電阻器450側。Since the magnetic force that lowers the most proximal end of the paddle 460 and increases the magnetic force on the inner side of the most proximal end is generated not only on the front end 460B side of the paddle 460 but also on the base end 460A side, the magnetic force acts to bring the central portion 460C of the paddle 460 closer to the plated surface Wf-a of the substrate Wf. As a result, the central portion 460C of the paddle 460 can be more strongly suppressed from sagging toward the resistor 450 side.

其次,說明鍍覆模組400之變化例。圖7係放大一個實施形態之鍍覆模組的構成之一部分而概略顯示的縱剖面圖。圖5及圖6所示之實施形態係將第二磁鐵468以與第一磁鐵464之下面相對的方式而設於鍍覆槽410,不過除此之外,亦可以與第一磁鐵464之上面相對的方式而設於鍍覆槽410。以下,說明這一點。Next, a variation of the coating module 400 will be described. FIG7 is a longitudinal cross-sectional view schematically showing a portion of the structure of a coating module of an embodiment in an enlarged manner. In the embodiments shown in FIG5 and FIG6 , the second magnet 468 is disposed in the coating groove 410 in a manner opposite to the lower surface of the first magnet 464. However, in addition to this, the second magnet 468 may be disposed in the coating groove 410 in a manner opposite to the upper surface of the first magnet 464. This point will be described below.

如圖7所示,本實施形態之前端內側磁鐵部464B-1係在下部配置S極,並在上部配置N極。前端外側磁鐵部464B-2係在下部配置N極,在上部配置S極。As shown in Fig. 7, the front inner magnet portion 464B-1 of this embodiment has an S pole at the bottom and an N pole at the top, while the front outer magnet portion 464B-2 has an N pole at the bottom and an S pole at the top.

此外,第二磁鐵468係以在上下方向夾著前端磁鐵部464B之方式,換言之,係與前端磁鐵部464B之上面及下面相對的方式而設於鍍覆槽410。具體而言,與前端內側磁鐵部464B-1之下面相對的第一內側磁鐵部468B-1將與前端內側磁鐵部464B-1之下部(S極)同極(S極)配置於上部,並將N極配置於下部。與前端內側磁鐵部464B-1之上面相對的第一內側磁鐵部468B-1’將與前端內側磁鐵部464B-1之上部(N極)相反極(S極)配置於下部,並將N極配置於上部。藉此,提高前端內側磁鐵部464B-1之磁力作用。In addition, the second magnet 468 is disposed in the plating groove 410 so as to sandwich the front end magnet portion 464B in the vertical direction, in other words, so as to face the upper and lower surfaces of the front end magnet portion 464B. Specifically, the first inner magnet portion 468B-1 facing the lower surface of the front end inner magnet portion 464B-1 has the same pole (S pole) as the lower portion (S pole) of the front end inner magnet portion 464B-1 at the upper portion, and has the N pole at the lower portion. The first inner magnet portion 468B-1' opposite to the upper surface of the front inner magnet portion 464B-1 is disposed at the lower portion with the opposite pole (S pole) to the upper portion (N pole) of the front inner magnet portion 464B-1, and the N pole is disposed at the upper portion. In this way, the magnetic force of the front inner magnet portion 464B-1 is enhanced.

此外,與前端外側磁鐵部464B-2之下面相對的第一外側磁鐵部468B-2將與前端外側磁鐵部464B-2之下部(N極)相反極(S極)配置於上部,並將N極配置於下部。與前端外側磁鐵部464B-2之上面相對的第一外側磁鐵部468B-2將與前端外側磁鐵部464B-2之上部(S極)同極(S極)配置於下部,並將N極配置於上部。藉此,降低前端外側磁鐵部464B-2之磁力作用。In addition, the first outer magnet portion 468B-2 opposite to the bottom of the front outer magnet portion 464B-2 is disposed at the upper portion with the opposite pole (S pole) to the bottom portion (N pole) of the front outer magnet portion 464B-2, and the N pole is disposed at the lower portion. The first outer magnet portion 468B-2 opposite to the top portion of the front outer magnet portion 464B-2 is disposed at the lower portion with the same pole (S pole) as the top portion (S pole) of the front outer magnet portion 464B-2, and the N pole is disposed at the upper portion. In this way, the magnetic force of the front outer magnet portion 464B-2 is reduced.

此外,本實施形態之基端內側磁鐵部464A-1係在下部配置S極,並在上部配置N極。基端外側磁鐵部464A-2係在下部配置N極,並在上部配置S極。In addition, the base end inner magnetic part 464A-1 of this embodiment has an S pole at the bottom and an N pole at the top, and the base end outer magnetic part 464A-2 has an N pole at the bottom and an S pole at the top.

第二磁鐵468係以在上下方向夾著基端磁鐵部464A之方式,換言之,係與基端磁鐵部464A之上面及下面相對的方式而設於鍍覆槽410。具體而言,與基端內側磁鐵部464A-1之下面相對的第二內側磁鐵部468A-1將與基端內側磁鐵部464A-1之下部(S極)同極(S極)配置於上部,並將N極配置於下部。與基端內側磁鐵部464A-1之上面相對的第二內側磁鐵部468A-1將與基端內側磁鐵部464A-1之上部(N極)相反極(S極)配置於下部,並將N極配置於上部。藉此,提高基端內側磁鐵部464A-1之磁力作用。The second magnet 468 is disposed in the plating groove 410 so as to sandwich the base end magnet portion 464A in the vertical direction, in other words, so as to face the upper and lower surfaces of the base end magnet portion 464A. Specifically, the second inner magnet portion 468A-1 facing the lower surface of the base end inner magnet portion 464A-1 has the same pole (S pole) as the lower portion (S pole) of the base end inner magnet portion 464A-1 at the upper portion, and has the N pole at the lower portion. The second inner magnet portion 468A-1 facing the upper surface of the base inner magnet portion 464A-1 has the opposite pole (S pole) to the upper portion (N pole) of the base inner magnet portion 464A-1 at the lower portion and the N pole at the upper portion, thereby enhancing the magnetic force of the base inner magnet portion 464A-1.

此外,與基端外側磁鐵部464A-2之下面相對的第一外側磁鐵部468A-2將與基端外側磁鐵部464A-2之下部(N極)相反極(S極)配置於上部,並將N極配置於下部。與基端外側磁鐵部464A-2之上面相對的第二外側磁鐵部468A-2將與基端外側磁鐵部464A-2之上部(S極)同極(S極)配置於下部,並將N極配置於上部。藉此,降低基端外側磁鐵部464A-2之磁力作用。In addition, the first outer magnet portion 468A-2 opposite to the bottom of the base outer magnet portion 464A-2 is disposed at the upper portion with the opposite pole (S pole) to the lower portion (N pole) of the base outer magnet portion 464A-2, and the N pole is disposed at the lower portion. The second outer magnet portion 468A-2 opposite to the top of the base outer magnet portion 464A-2 is disposed at the lower portion with the same pole (S pole) as the upper portion (S pole) of the base outer magnet portion 464A-2, and the N pole is disposed at the upper portion. In this way, the magnetic force of the base outer magnet portion 464A-2 is reduced.

如以上,採用本實施形態時,第二磁鐵468不僅配置於前端磁鐵部464B及基端磁鐵部464A的下部,亦配置於上部。因此,由於係以將槳葉460之中央部460C接近基板Wf之被鍍覆面Wf-a的方式而加強磁力作用,因此可更強力抑制槳葉460之中央部460C下垂至電阻器450側。As described above, in this embodiment, the second magnet 468 is disposed not only at the bottom of the tip magnet portion 464B and the base magnet portion 464A, but also at the top. Therefore, since the magnetic force is strengthened by bringing the center portion 460C of the paddle 460 close to the plated surface Wf-a of the substrate Wf, the center portion 460C of the paddle 460 can be more strongly suppressed from sagging to the resistor 450 side.

再者,本實施形態之第二磁鐵468包含在槳葉460之延伸方向與前端磁鐵部464B(前端外側磁鐵部464B-2)相對而設於鍍覆槽410的前端相對磁鐵部468C。前端相對磁鐵部468C係以對前端磁鐵部464B帶來排斥之磁力的方式而構成。具體而言,前端相對磁鐵部468C係在下部配置N極,並在上部配置S極。前端外側磁鐵部464B-2亦在下部配置N極,並在上部配置S極。因此,由於在前端相對磁鐵部468C與前端外側磁鐵部464B-2之間產生彼此排斥的磁力,因此,可促進將槳葉460形成弓形形狀之力。另外,前端相對磁鐵部468C不限於本實施形態,亦可適用於圖5、圖6、或圖8所示之實施形態。Furthermore, the second magnet 468 of this embodiment includes a front end opposing magnet portion 468C disposed in the coating groove 410 opposite to the front end magnet portion 464B (front end outer magnet portion 464B-2) in the extension direction of the blade 460. The front end opposing magnet portion 468C is configured in a manner to bring a repulsive magnetic force to the front end magnet portion 464B. Specifically, the front end opposing magnet portion 468C is configured with an N pole at the bottom and an S pole at the top. The front end outer magnet portion 464B-2 is also configured with an N pole at the bottom and an S pole at the top. Therefore, since a repulsive magnetic force is generated between the front end opposing magnet portion 468C and the front end outer magnet portion 464B-2, a force that forms the blade 460 into an arc shape can be promoted. In addition, the front end opposing magnet portion 468C is not limited to this embodiment, and can also be applied to the embodiments shown in Figures 5, 6, or 8.

其次,說明鍍覆模組400之變化例。圖8係放大一個實施形態之鍍覆模組的構成之一部分而概略顯示的縱剖面圖。Next, a modification of the coating module 400 will be described. Fig. 8 is a longitudinal cross-sectional view schematically showing a part of the structure of a coating module according to an embodiment by enlarging the part.

本實施形態係第一磁鐵464具有:設於槳葉460之前端部460B的前端磁鐵部464B;設於槳葉460之基端部460A的基端磁鐵部464A;及設於槳葉460之中央部460C的中央磁鐵部464C。具體而言,前端磁鐵部464B係在下部配置N極,並在上部配置S極。基端磁鐵部464A係在下部配置N極,並在上部配置S極。中央磁鐵部464C係在下部配置N極,並在上部配置S極。In this embodiment, the first magnet 464 has: a front end magnet portion 464B provided at the front end portion 460B of the blade 460; a base end magnet portion 464A provided at the base end portion 460A of the blade 460; and a central magnet portion 464C provided at the central portion 460C of the blade 460. Specifically, the front end magnet portion 464B is provided with an N pole at the bottom and an S pole at the top. The base end magnet portion 464A is provided with an N pole at the bottom and an S pole at the top. The central magnet portion 464C is provided with an N pole at the bottom and an S pole at the top.

第二磁鐵468具有以帶來降低前端磁鐵部464B之磁力的方式而設於鍍覆槽410之第一鍍覆槽磁鐵部468D。第一鍍覆槽磁鐵部468D係以與前端磁鐵部464B之上面相對的方式而配置於鍍覆槽410。第一鍍覆槽磁鐵部468D係將與前端磁鐵部464B之上部(S極)同極(S極)配置於下部,並將N極配置於上部。第一鍍覆槽磁鐵部468D固定於鍍覆槽410,並藉由第一鍍覆槽磁鐵部468D與前端磁鐵部464B互相排斥而產生降低前端磁鐵部464B之磁力。The second magnet 468 has a first slot-coated magnet portion 468D disposed in the coating groove 410 in such a manner as to reduce the magnetic force of the front end magnet portion 464B. The first slot-coated magnet portion 468D is disposed in the coating groove 410 in such a manner as to face the upper surface of the front end magnet portion 464B. The first slot-coated magnet portion 468D has the same pole (S pole) as the upper portion (S pole) of the front end magnet portion 464B disposed in the lower portion, and has the N pole disposed in the upper portion. The first slot-coated magnet portion 468D is fixed to the coating groove 410, and the magnetic force reducing the front end magnet portion 464B is generated by the mutual repulsion between the first slot-coated magnet portion 468D and the front end magnet portion 464B.

第二磁鐵468具有以帶來降低基端磁鐵部464A之磁力的方式而設於鍍覆槽410之第二鍍覆槽磁鐵部468E。第二鍍覆槽磁鐵部468E係以與基端磁鐵部464A之上面相對的方式而配置於鍍覆槽410。第二鍍覆槽磁鐵部468E將與基端磁鐵部464A之上部(S極)同極(S極)配置於下部,並將N極配置於上部。第二鍍覆槽磁鐵部468E固定於鍍覆槽410,藉由第二鍍覆槽磁鐵部468E與基端磁鐵部464A互相排斥而產生降低基端磁鐵部464A之磁力。The second magnet 468 has a second plated slot magnet portion 468E disposed in the plated slot 410 in such a manner as to reduce the magnetic force of the base end magnet portion 464A. The second plated slot magnet portion 468E is disposed in the plated slot 410 in such a manner as to face the upper surface of the base end magnet portion 464A. The second plated slot magnet portion 468E has the same pole (S pole) as the upper portion (S pole) of the base end magnet portion 464A disposed in the lower portion, and has the N pole disposed in the upper portion. The second plated slot magnet portion 468E is fixed to the plated slot 410, and the second plated slot magnet portion 468E and the base end magnet portion 464A repel each other, thereby generating a magnetic force that reduces the base end magnet portion 464A.

第二磁鐵468具有以帶來提高中央磁鐵部464C之磁力的方式而設於電阻器450之電阻器磁鐵部468F。電阻器磁鐵部468F係以與中央磁鐵部464C之下面相對的方式而配置於電阻器450。電阻器磁鐵部468F將與中央磁鐵部464C之下部(N極)同極(N極)配置於下部,並將S極配置於上部。電阻器磁鐵部468F固定於電阻器450,藉由電阻器磁鐵部468F與中央磁鐵部464C互相排斥,而產生提高中央磁鐵部464C之磁力。如此,藉由降低槳葉460之前端部460B及基端部460A,並提高中央部460C,可抑制槳葉460之中央部460C下垂至電阻器450側。The second magnet 468 has a resistor magnet portion 468F disposed on the resistor 450 in such a manner as to increase the magnetic force of the central magnet portion 464C. The resistor magnet portion 468F is disposed on the resistor 450 in such a manner as to face the lower surface of the central magnet portion 464C. The resistor magnet portion 468F is disposed at the lower portion with the same pole (N pole) as the lower portion (N pole) of the central magnet portion 464C, and the S pole is disposed at the upper portion. The resistor magnet portion 468F is fixed to the resistor 450, and the resistor magnet portion 468F and the central magnet portion 464C repel each other, thereby generating a magnetic force that increases the central magnet portion 464C. In this way, by lowering the front end portion 460B and the base end portion 460A of the paddle 460 and raising the center portion 460C, it is possible to suppress the center portion 460C of the paddle 460 from sagging toward the resistor 450 side.

此外,本實施形態如圖8所示,鍍覆裝置1000具備在槳葉460之延伸方向與槳葉460之前端部460B相對而設的檢測器480。檢測器480係以計測與槳葉460的前端部460B之間的距離之方式而構成的距離檢測器。檢測器480可使用光學式、電波式、或超音波式等習知的檢測器。In addition, as shown in FIG8 , the coating device 1000 of this embodiment has a detector 480 disposed opposite to the front end 460B of the blade 460 in the extending direction of the blade 460. The detector 480 is a distance detector configured to measure the distance to the front end 460B of the blade 460. The detector 480 may be a known detector such as an optical detector, a radio detector, or an ultrasonic detector.

鍍覆裝置1000在藉由檢測器480所計測之與槳葉460的前端部460B之間的距離比預設之臨限值大時,可發出警報。亦即,藉由設置第一磁鐵464與第二磁鐵468,產生抑制槳葉460之中央部460C下垂至電阻器450側的磁力,該磁力增強時如虛線β所示,槳葉460係以突出於上側之方式變成弓形。再者,隨著該磁力增強,槳葉460之前端部460B在從檢測器480離開之方向移動。換言之,檢測器480與槳葉460的前端部460B之間的距離,隨著槳葉460之中央部460C以突出於基板Wf之被鍍覆面Wf-a側的方式形成弓形而變大。超過預設之範圍而槳葉460變成弓形時,可能槳葉460會接觸基板Wf之被鍍覆面Wf-a。因此,鍍覆裝置1000若使檢測器480與槳葉460的前端部460B之間的距離比預設之臨限值大,藉由發出警報可督促作業員停止裝置及檢修等。另外,檢測器480不限於本實施形態,亦可適用於圖5~圖7所示之實施形態。The coating device 1000 can issue an alarm when the distance between the front end 460B of the blade 460 measured by the detector 480 is greater than a preset critical value. That is, by providing the first magnet 464 and the second magnet 468, a magnetic force is generated to suppress the central portion 460C of the blade 460 from drooping to the side of the resistor 450. When the magnetic force increases, as shown by the dotted line β, the blade 460 becomes an arch in a manner protruding from the upper side. Furthermore, as the magnetic force increases, the front end 460B of the blade 460 moves in a direction away from the detector 480. In other words, the distance between the detector 480 and the front end 460B of the paddle 460 increases as the central portion 460C of the paddle 460 forms an arch shape by protruding from the side of the coated surface Wf-a of the substrate Wf. When the paddle 460 becomes an arch shape beyond the preset range, the paddle 460 may contact the coated surface Wf-a of the substrate Wf. Therefore, if the coating device 1000 makes the distance between the detector 480 and the front end 460B of the paddle 460 larger than the preset critical value, an alarm can be issued to urge the operator to stop the device and perform maintenance. In addition, the detector 480 is not limited to this embodiment, and can also be applied to the embodiments shown in Figures 5 to 7.

其次,說明鍍覆模組400之變化例。圖9係放大一個實施形態之鍍覆模組的構成之一部分而概略顯示的縱剖面圖。Next, a modification of the coating module 400 will be described. Fig. 9 is a longitudinal cross-sectional view schematically showing a part of the structure of a coating module according to an embodiment by enlarging the part.

本實施形態係第一磁鐵464包含設於槳葉460之前端部460B的前端磁鐵部464B。具體而言,前端磁鐵部464B係在下部配置N極,並在上部配置S極。In this embodiment, the first magnet 464 includes a front end magnet portion 464B provided at the front end portion 460B of the blade 460. Specifically, the front end magnet portion 464B has an N pole at the bottom and an S pole at the top.

第二磁鐵468包含在槳葉460之延伸方向與前端磁鐵部464B相對而設於鍍覆槽410的第三鍍覆槽磁鐵部468G。第三鍍覆槽磁鐵部468G係以帶來與前端磁鐵部464B互相吸引之磁力的方式而構成。具體而言,第三鍍覆槽磁鐵部468G係在下部配置S極,並在上部配置N極。因此,在第三鍍覆槽磁鐵部468G與前端磁鐵部464B之間產生彼此互相吸引之磁力。由於第三鍍覆槽磁鐵部468G固定於鍍覆槽410,因此前端磁鐵部464B在接近第三鍍覆槽磁鐵部468G之方向吸引。結果,由於消除因重力造成槳葉460之撓曲,因此可抑制槳葉460之中央部460C下垂。The second magnet 468 includes a third clad slot magnet portion 468G disposed in the clad slot 410 opposite to the front end magnet portion 464B in the extension direction of the blade 460. The third clad slot magnet portion 468G is configured in a manner to bring about a magnetic force that attracts the front end magnet portion 464B. Specifically, the third clad slot magnet portion 468G is configured with an S pole at the bottom and an N pole at the top. Therefore, a magnetic force that attracts each other is generated between the third clad slot magnet portion 468G and the front end magnet portion 464B. Since the third clad slot magnet portion 468G is fixed to the clad slot 410, the front end magnet portion 464B is attracted in a direction approaching the third clad slot magnet portion 468G. As a result, since the deflection of the paddle 460 due to gravity is eliminated, the central portion 460C of the paddle 460 can be suppressed from sagging.

以上,說明了本發明之幾個實施形態,不過上述發明之實施形態係為了容易理解本發明者,而並非限定本發明者。本發明在不脫離其旨趣下可變更及改良,並且本發明中當然包含其等效物。此外,在可解決上述問題之至少一部分的範圍、或是可達成效果之至少一部分的範圍內,記載於申請專利範圍及說明書之各構成元件可任意組合或省略。Several embodiments of the present invention are described above, but the embodiments of the present invention are for easy understanding of the present invention and are not intended to limit the present invention. The present invention can be modified and improved without departing from its purpose, and the present invention naturally includes its equivalents. In addition, within the scope of solving at least part of the above-mentioned problems or achieving at least part of the effects, the various components described in the patent application and the specification can be arbitrarily combined or omitted.

本申請案之一個實施形態揭示一種鍍覆裝置,係包含:鍍覆槽,其係用於收容鍍覆液;陽極,其係配置於前述鍍覆槽內;基板固持器,其係以在將被鍍覆面朝向下方狀態下保持基板之方式而構成;槳葉,其係配置於前述陽極與前述基板之間;槳葉驅動機構,其係以支撐前述槳葉之基端部,使前述槳葉沿著前述基板之被鍍覆面而往返移動的方式而構成;第一磁鐵,其係設於前述槳葉;及第二磁鐵,其係與前述第一磁鐵相對而設;前述第一磁鐵及前述第二磁鐵係以前述槳葉之前述基端部與前端部之間的中央部接近前述基板之被鍍覆面的方式,且彼此帶來磁力之方式而構成。One embodiment of the present application discloses a coating device, comprising: a coating tank for containing a coating liquid; an anode disposed in the coating tank; a substrate holder configured to hold the substrate with the surface to be coated facing downward; a paddle disposed between the anode and the substrate; and a paddle driving mechanism for supporting the base end of the paddle. , so that the paddle moves back and forth along the coated surface of the substrate; the first magnet is provided on the paddle; and the second magnet is provided opposite to the first magnet; the first magnet and the second magnet are so constructed that the central portion between the base end and the front end of the paddle approaches the coated surface of the substrate and exerts magnetic force on each other.

再者,本申請案之一個實施形態揭示一種鍍覆裝置,其中前述第一磁鐵包含前端磁鐵部,其係設於前述槳葉之前述前端部,且具有沿著前述槳葉之延伸方向而配置之前端內側磁鐵部及前端外側磁鐵部,前述第二磁鐵包含:第一內側磁鐵部,其係以帶來提高前述前端內側磁鐵部之磁力的方式而設於前述鍍覆槽;及第一外側磁鐵部,其係以帶來降低前述前端外側磁鐵部之磁力的方式而設於前述鍍覆槽。Furthermore, an embodiment of the present application discloses a coating device, wherein the aforementioned first magnet includes a front end magnet portion, which is disposed at the aforementioned front end portion of the aforementioned blade, and has a front end inner magnet portion and a front end outer magnet portion arranged along the extension direction of the aforementioned blade, and the aforementioned second magnet includes: a first inner magnet portion, which is disposed in the aforementioned coating groove in a manner to increase the magnetic force of the aforementioned front end inner magnet portion; and a first outer magnet portion, which is disposed in the aforementioned coating groove in a manner to reduce the magnetic force of the aforementioned front end outer magnet portion.

再者,本申請案之一個實施形態揭示一種鍍覆裝置,其中前述第一磁鐵進一步包含基端磁鐵部,其係設於前述槳葉之前述基端部,且具有沿著前述槳葉之延伸方向而配置的基端內側磁鐵部及基端外側磁鐵部,前述第二磁鐵進一步包含:第二內側磁鐵部,其係以帶來提高前述基端內側磁鐵部之磁力的方式而設於前述鍍覆槽;及第二外側磁鐵部,其係以帶來降低前述基端外側磁鐵部之磁力的方式而設於前述鍍覆槽。Furthermore, an embodiment of the present application discloses a coating device, wherein the aforementioned first magnet further includes a base end magnet portion, which is disposed at the aforementioned base end portion of the aforementioned blade and has a base end inner magnet portion and a base end outer magnet portion arranged along the extension direction of the aforementioned blade, and the aforementioned second magnet further includes: a second inner magnet portion, which is disposed in the aforementioned coating groove in a manner to increase the magnetic force of the aforementioned base end inner magnet portion; and a second outer magnet portion, which is disposed in the aforementioned coating groove in a manner to reduce the magnetic force of the aforementioned base end outer magnet portion.

再者,本申請案之一個實施形態揭示一種鍍覆裝置,其中進一步包含電阻器,其係配置於前述陽極與前述槳葉之間,前述第一磁鐵具有:前端磁鐵部,其係設於前述槳葉之前述前端部;基端磁鐵部,其係設於前述槳葉之前述基端部;及中央磁鐵部,其係設於前述槳葉之前述中央部;前述第二磁鐵具有:第一鍍覆槽磁鐵部,其係以帶來降低前述前端磁鐵部之磁力的方式而設於前述鍍覆槽;第二鍍覆槽磁鐵部,其係以帶來降低前述基端磁鐵部之磁力的方式而設於前述鍍覆槽;及電阻器磁鐵部,其係以帶來提高前述中央磁鐵部之磁力的方式而設於前述電阻器。Furthermore, an embodiment of the present application discloses a coating device, which further includes a resistor, which is arranged between the anode and the blade, the first magnet having: a front end magnet portion, which is arranged at the front end portion of the blade; a base end magnet portion, which is arranged at the front base portion of the blade; and a central magnet portion, which is arranged at the front central portion of the blade; the second magnet having: a first coating slot magnet portion, which is arranged in the coating slot in a manner to reduce the magnetic force of the front end magnet portion; a second coating slot magnet portion, which is arranged in the coating slot in a manner to reduce the magnetic force of the base end magnet portion; and a resistor magnet portion, which is arranged in the resistor in a manner to increase the magnetic force of the central magnet portion.

再者,本申請案之一個實施形態揭示一種鍍覆裝置,其中前述第二磁鐵包含前端相對磁鐵部,其係在前述槳葉之延伸方向與前述前端磁鐵部相對而設於前述鍍覆槽,並以帶來對前述前端磁鐵部排斥之磁力的方式而構成。Furthermore, an embodiment of the present application discloses a coating device, wherein the second magnet includes a front end relative magnet portion, which is arranged in the coating groove opposite to the front end magnet portion in the extension direction of the blade and is constructed in a manner to bring about a magnetic force that repels the front end magnet portion.

再者,本申請案之一個實施形態揭示一種鍍覆裝置,其中進一步包含檢測器,其係在前述槳葉之延伸方向與前述槳葉之前述前端部相對而設,並以計測與前述槳葉的前述前端部之間的距離之方式而構成。Furthermore, an embodiment of the present application discloses a coating device, which further includes a detector, which is arranged opposite to the aforementioned front end portion of the aforementioned paddle in the extension direction of the aforementioned paddle and is constructed in a manner to measure the distance between the aforementioned paddle and the aforementioned front end portion of the aforementioned paddle.

再者,本申請案之一個實施形態揭示一種鍍覆裝置,其中前述第一磁鐵包含前端磁鐵部,其係設於前述槳葉之前述前端部, 前述第二磁鐵包含第三鍍覆槽磁鐵部,其係在前述槳葉之延伸方向與前述前端磁鐵部相對而設於前述鍍覆槽,並以帶來與前述前端磁鐵部互相吸引之磁力的方式而構成。 Furthermore, one embodiment of the present application discloses a coating device, wherein the first magnet includes a front end magnet portion, which is disposed at the front end portion of the blade, and the second magnet includes a third coating slot magnet portion, which is disposed in the coating slot opposite to the front end magnet portion in the extension direction of the blade and is constructed in a manner to bring about a magnetic force that attracts the front end magnet portion.

100:裝載埠 110:搬送機器人 120:對準器 200:預濕模組 300:預浸模組 400:鍍覆模組 410:鍍覆槽 420:隔膜 422:陰極區域 424:陽極區域 426:噴嘴 428:供給源 430:陽極 440:基板固持器 442:密封環固持器 443:升降機構 444:背面板 446:框架 447:旋轉機構 448:軸桿 450:電阻器 460:槳葉 460a:棒狀構件 460b,460c:孔 460A:基端部 460B:前端部 460C:中央部 462:驅動機構 464:第一磁鐵 464A:基端磁鐵部 464A-1:基端內側磁鐵部 464A-2:基端外側磁鐵部 464B:前端磁鐵部 464B-1:前端內側磁鐵部 464B-2:前端外側磁鐵部 464C:中央磁鐵部 468:第二磁鐵 468A-1:第二內側磁鐵部 468A-2:第二外側磁鐵部 468B:第一磁鐵部 468B-1:第一內側磁鐵部 468B-2:第一外側磁鐵部 468C:前端相對磁鐵部 468D:第一鍍覆槽磁鐵部 468E:第二鍍覆槽磁鐵部 468F:電阻器磁鐵部 468G:第三鍍覆槽磁鐵部 480:檢測器 500:清洗模組 600:自旋沖洗乾燥機 700:搬送裝置 800:控制模組 1000:鍍覆裝置 Wf:基板 Wf-a:被鍍覆面 100: Loading port 110: Transfer robot 120: Alignment device 200: Pre-wetting module 300: Pre-preg module 400: Plating module 410: Plating tank 420: Diaphragm 422: Cathode area 424: Anode area 426: Nozzle 428: Supply source 430: Anode 440: Substrate holder 442: Sealing ring holder 443: Lifting mechanism 444: Back panel 446: Frame 447: Rotation mechanism 448: Shaft 450: Resistor 460: Paddle 460a: Rod-shaped member 460b, 460c: Hole 460A: Base end 460B: Front end 460C: Central part 462: Driving mechanism 464: First magnet 464A: Base end magnet 464A-1: Base end inner magnet 464A-2: Base end outer magnet 464B: Front end magnet 464B-1: Front end inner magnet 464B-2: Front end outer magnet 464C: Central magnet 468: Second magnet 468A-1: Second inner magnet 468A-2: Second outer magnet 468B: First magnet 468B-1: First inner magnet 468B-2: First outer magnet 468C: Front end opposite magnet 468D: First plated groove magnet 468E: Second plated groove magnet 468F: Resistor magnet 468G: Third plated groove magnet 480: Detector 500: Cleaning module 600: Spin wash dryer 700: Transport device 800: Control module 1000: Plated device Wf: Substrate Wf-a: Plated surface

圖1係顯示本實施形態之鍍覆裝置的整體構成之立體圖。 圖2係顯示本實施形態之鍍覆裝置的整體構成之俯視圖。 圖3係概略顯示一個實施形態之鍍覆模組的構成之縱剖面圖。 圖4A係概略顯示槳葉之構成的俯視圖。 圖4B係概略顯示槳葉之構成的俯視圖。 圖5係放大一個實施形態之鍍覆模組的構成之一部分而概略顯示的縱剖面圖。 圖6係放大一個實施形態之鍍覆模組的構成之一部分而概略顯示的縱剖面圖。 圖7係放大一個實施形態之鍍覆模組的構成之一部分而概略顯示的縱剖面圖。 圖8係放大一個實施形態之鍍覆模組的構成之一部分而概略顯示的縱剖面圖。 圖9係放大一個實施形態之鍍覆模組的構成之一部分而概略顯示的縱剖面圖。 FIG. 1 is a perspective view showing the overall structure of the coating device of the present embodiment. FIG. 2 is a top view showing the overall structure of the coating device of the present embodiment. FIG. 3 is a longitudinal sectional view schematically showing the structure of a coating module of the present embodiment. FIG. 4A is a top view schematically showing the structure of a propeller blade. FIG. 4B is a top view schematically showing the structure of a propeller blade. FIG. 5 is a longitudinal sectional view schematically showing a part of the structure of a coating module of the present embodiment by enlarging it. FIG. 6 is a longitudinal sectional view schematically showing a part of the structure of a coating module of the present embodiment by enlarging it. FIG. 7 is a longitudinal sectional view schematically showing a part of the structure of a coating module of the present embodiment by enlarging it. FIG8 is a longitudinal cross-sectional view schematically showing a part of the structure of a coating module in an enlarged form. FIG9 is a longitudinal cross-sectional view schematically showing a part of the structure of a coating module in an enlarged form.

410:鍍覆槽 410: Plated groove

442:密封環固持器 442: Sealing ring holder

444:背面板 444: Back panel

450:電阻器 450: Resistor

460:槳葉 460: Oar blade

460A:基端部 460A: Base end

460B:前端部 460B: front end

460C:中央部 460C: Central area

462:驅動機構 462: Driving mechanism

464:第一磁鐵 464: The first magnet

464B:前端磁鐵部 464B: Front magnet part

464B-1:前端內側磁鐵部 464B-1: Front inner magnet part

464B-2:前端外側磁鐵部 464B-2: Front outer magnet part

468:第二磁鐵 468: Second magnet

468B:第一磁鐵部 468B: First magnet part

468B-1:第一內側磁鐵部 468B-1: First inner magnet part

468B-2:第一外側磁鐵部 468B-2: First outer magnet part

Wf:基板 Wf: Substrate

Wf-a:被鍍覆面 Wf-a: coated

Claims (7)

一種杯式的鍍覆裝置,係包含:鍍覆槽,其係用於收容鍍覆液;陽極,其係配置於前述鍍覆槽內;基板固持器,其係以在將被鍍覆面朝向下方狀態下保持基板之方式而構成;槳葉,其係配置於前述陽極與前述基板之間;槳葉驅動機構,其係以支撐前述槳葉之基端部,使前述槳葉沿著前述基板之被鍍覆面而往返移動的方式而構成;第一磁鐵,其係設於前述槳葉;及第二磁鐵,其係與前述第一磁鐵相對而設;前述第一磁鐵及前述第二磁鐵係以前述槳葉之前述基端部與前端部之間的中央部接近前述基板之被鍍覆面的方式,且彼此帶來磁力之方式而構成。 A cup-type coating device includes: a coating tank for containing coating liquid; an anode disposed in the coating tank; a substrate holder configured to hold the substrate with the coated surface facing downward; a paddle disposed between the anode and the substrate; a paddle driving mechanism configured to support the base end of the paddle so that the paddle moves back and forth along the coated surface of the substrate; a first magnet disposed on the paddle; and a second magnet disposed opposite to the first magnet; the first magnet and the second magnet are configured so that the center portion between the base end and the front end of the paddle approaches the coated surface of the substrate and exerts magnetic force on each other. 如請求項1之杯式的鍍覆裝置,其中前述第一磁鐵包含前端磁鐵部,其係設於前述槳葉之前述前端部,且具有沿著前述槳葉之延伸方向而配置之前端內側磁鐵部及前端外側磁鐵部,前述第二磁鐵包含:第一內側磁鐵部,其係以帶來提高前述前端內側磁鐵部之磁力的方式而設於前述鍍覆槽;及第一外側磁鐵部,其係以帶來降低前述前端外側磁鐵部之磁力的方式而設於前述鍍覆槽。 The cup-type coating device of claim 1, wherein the first magnet includes a front end magnet portion, which is disposed at the front end portion of the blade, and has a front end inner magnet portion and a front end outer magnet portion arranged along the extension direction of the blade, and the second magnet includes: a first inner magnet portion, which is disposed in the coating groove in a manner to increase the magnetic force of the front end inner magnet portion; and a first outer magnet portion, which is disposed in the coating groove in a manner to reduce the magnetic force of the front end outer magnet portion. 如請求項2之杯式的鍍覆裝置,其中前述第一磁鐵進一步包含基端磁鐵部,其係設於前述槳葉之前述基端部,且具有沿著前述槳葉之延伸方向而配置的基端內側磁鐵部及基端外側磁鐵部,前述第二磁鐵進一步包含:第二內側磁鐵部,其係以帶來提高前述基端內側磁鐵部之磁力的方式而設於前述鍍覆槽;及第二外側磁鐵部,其係以帶來降低前述基端外側磁鐵部之磁力的方式而設於前述鍍覆槽。 The cup-type coating device of claim 2, wherein the first magnet further comprises a base end magnet portion, which is disposed at the aforementioned base end portion of the blade, and has a base end inner magnet portion and a base end outer magnet portion arranged along the extension direction of the blade, and the second magnet further comprises: a second inner magnet portion, which is disposed in the coating groove in a manner to increase the magnetic force of the base end inner magnet portion; and a second outer magnet portion, which is disposed in the coating groove in a manner to reduce the magnetic force of the base end outer magnet portion. 如請求項1之杯式的鍍覆裝置,其中進一步包含電阻器,其係配置於前述陽極與前述槳葉之間,前述第一磁鐵具有:前端磁鐵部,其係設於前述槳葉之前述前端部;基端磁鐵部,其係設於前述槳葉之前述基端部;及中央磁鐵部,其係設於前述槳葉之前述中央部;前述第二磁鐵具有:第一鍍覆槽磁鐵部,其係以帶來降低前述前端磁鐵部之磁力的方式而設於前述鍍覆槽;第二鍍覆槽磁鐵部,其係以帶來降低前述基端磁鐵部之磁力的方式而設於前述鍍覆槽;及電阻器磁鐵部,其係以帶來提高前述中央磁鐵部之磁力的方式而設於前述電阻器。 The cup-type coating device of claim 1 further comprises a resistor, which is arranged between the anode and the blade, wherein the first magnet comprises: a front end magnet portion, which is arranged at the front end portion of the blade; a base end magnet portion, which is arranged at the front base portion of the blade; and a central magnet portion, which is arranged at the front central portion of the blade; the second magnet comprises: a first coating slot magnet portion, which is arranged at the coating slot in a manner to reduce the magnetic force of the front end magnet portion; a second coating slot magnet portion, which is arranged at the coating slot in a manner to reduce the magnetic force of the base end magnet portion; and a resistor magnet portion, which is arranged at the resistor in a manner to increase the magnetic force of the central magnet portion. 如請求項2~4中任一項之杯式的鍍覆裝置,其中前述第二磁鐵包含前端相對磁鐵部,其係在前述槳葉之延伸方向與前述前端磁鐵部相對而設於前述鍍覆槽,並以帶來對前述前端磁鐵部排斥之磁力的方式而構成。 A cup-type coating device as in any one of claims 2 to 4, wherein the second magnet includes a front end opposing magnet portion, which is disposed in the coating groove opposite to the front end magnet portion in the extension direction of the blade, and is constructed in a manner to bring about a magnetic force that repels the front end magnet portion. 如請求項2~4中任一項之杯式的鍍覆裝置,其中進一步包含檢測器,其係在前述槳葉之延伸方向與前述槳葉之前述前端部相對而設,並以計測與前述槳葉的前述前端部之間的距離之方式而構成。 A cup-type coating device as in any one of claims 2 to 4, further comprising a detector, which is arranged opposite to the aforementioned front end of the aforementioned blade in the extension direction of the aforementioned blade, and is constructed in a manner to measure the distance between the aforementioned front end of the aforementioned blade. 如請求項1之杯式的鍍覆裝置,其中前述第一磁鐵包含前端磁鐵部,其係設於前述槳葉之前述前端部,前述第二磁鐵包含第三鍍覆槽磁鐵部,其係在前述槳葉之延伸方向與前述前端磁鐵部相對而設於前述鍍覆槽,並以帶來與前述前端磁鐵部互相吸引之磁力的方式而構成。 The cup-type coating device of claim 1, wherein the first magnet includes a front end magnet portion, which is disposed at the front end portion of the blade, and the second magnet includes a third coating slot magnet portion, which is disposed in the coating slot opposite to the front end magnet portion in the extension direction of the blade, and is constructed in a manner to bring about a magnetic force that attracts the front end magnet portion.
TW111148693A 2022-12-19 Coating equipment TWI838020B (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080017503A1 (en) 2006-07-18 2008-01-24 Atsushi Nagashima Electroplating apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080017503A1 (en) 2006-07-18 2008-01-24 Atsushi Nagashima Electroplating apparatus

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