SG10201803749SA - Reflectance detection method and reflectance detection apparatus - Google Patents
Reflectance detection method and reflectance detection apparatusInfo
- Publication number
- SG10201803749SA SG10201803749SA SG10201803749SA SG10201803749SA SG10201803749SA SG 10201803749S A SG10201803749S A SG 10201803749SA SG 10201803749S A SG10201803749S A SG 10201803749SA SG 10201803749S A SG10201803749S A SG 10201803749SA SG 10201803749S A SG10201803749S A SG 10201803749SA
- Authority
- SG
- Singapore
- Prior art keywords
- reflectance
- detection
- workpiece
- laser beam
- light amount
- Prior art date
Links
- 238000001514 detection method Methods 0.000 title abstract 8
- 230000001678 irradiating effect Effects 0.000 abstract 2
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
- G01N21/4738—Diffuse reflection, e.g. also for testing fluids, fibrous materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/009—Working by laser beam, e.g. welding, cutting or boring using a non-absorbing, e.g. transparent, reflective or refractive, layer on the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/005—Testing of reflective surfaces, e.g. mirrors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
- G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
- G01N21/3563—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing solids; Preparation of samples therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/55—Specular reflectivity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/0007—Applications not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/0014—Monitoring arrangements not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/28—Investigating the spectrum
- G01J3/42—Absorption spectrometry; Double beam spectrometry; Flicker spectrometry; Reflection spectrometry
- G01J2003/425—Reflectance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
- G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
- G01N21/3563—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing solids; Preparation of samples therefor
- G01N2021/3568—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing solids; Preparation of samples therefor applied to semiconductors, e.g. Silicon
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
- G01N2021/4735—Solid samples, e.g. paper, glass
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- Electromagnetism (AREA)
- General Health & Medical Sciences (AREA)
- Pathology (AREA)
- Immunology (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Mechanical Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Combustion & Propulsion (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Laser Beam Processing (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
- Switches Operated By Changes In Physical Conditions (AREA)
- Geophysics And Detection Of Objects (AREA)
Abstract
REFLECTANCE DETECTION METHOD AND REFLECTANCE DETECTION APPARATUS There is provided a reflectance detection method in which a workpiece is irradiated with a laser beam and reflectance is detected. The reflectance detection method includes a first detection step of irradiating, with a light amount H0, the workpiece with a laser beam with a first wavelength X1 shorter than a detection-target wavelength X regarding which reflectance is desired to be detected and detecting a light amount H1 of reflected return light, a second detection step of irradiating the workpiece with a laser beam with a second wavelength X2 longer than the detection-target wavelength X with the light amount H0 and detecting a light amount H2 of reflected return light, and a reflectance calculation step of employing H calculated based on an expression shown below as the light amount of return light obtained when the workpiece is irradiated with a laser beam with the detection-target wavelength X and calculating reflectance obtained when the workpiece is irradiated with the laser beam with the detection-target wavelength X based on H/H0. H = H1 + (H2 − H1) × (X − X1)/(X2 − X1) (Figure 2)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017101638A JP7076951B2 (en) | 2017-05-23 | 2017-05-23 | Reflectance detector |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201803749SA true SG10201803749SA (en) | 2018-12-28 |
Family
ID=64400878
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201803749SA SG10201803749SA (en) | 2017-05-23 | 2018-05-03 | Reflectance detection method and reflectance detection apparatus |
Country Status (7)
Country | Link |
---|---|
US (1) | US10471536B2 (en) |
JP (1) | JP7076951B2 (en) |
KR (1) | KR102298469B1 (en) |
CN (1) | CN108931501B (en) |
MY (1) | MY190868A (en) |
SG (1) | SG10201803749SA (en) |
TW (1) | TWI785048B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109374571A (en) * | 2018-12-07 | 2019-02-22 | 中国科学技术大学 | A kind of optical detection integrated system |
JP7253396B2 (en) * | 2019-01-25 | 2023-04-06 | 株式会社ディスコ | inspection equipment |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5155546A (en) * | 1991-06-03 | 1992-10-13 | Texas Wesleyan University, Inc. | Method for quantitative detection of organic materials in rocks and sediments using visible light spectra |
JPH08247935A (en) * | 1995-03-13 | 1996-09-27 | Omron Corp | Optical device and detection device |
JPH10305420A (en) | 1997-03-04 | 1998-11-17 | Ngk Insulators Ltd | Method for fabricating matrix made up of oxide single crystal and method for manufacturing functional device |
JPH10253528A (en) * | 1997-03-07 | 1998-09-25 | Seibutsukei Tokutei Sangyo Gijutsu Kenkyu Suishin Kiko | Method for spectral reflection factor measurement of plant body, and apparatus therefor |
JP2000046525A (en) * | 1998-07-24 | 2000-02-18 | Dainippon Screen Mfg Co Ltd | Film thickness measuring instrument |
JP4150506B2 (en) * | 2000-02-16 | 2008-09-17 | 富士フイルム株式会社 | Image capturing apparatus and distance measuring method |
JP3408805B2 (en) | 2000-09-13 | 2003-05-19 | 浜松ホトニクス株式会社 | Cutting origin region forming method and workpiece cutting method |
JP2007139632A (en) * | 2005-11-21 | 2007-06-07 | Olympus Corp | Reflectivity measuring instrument and reflectivity measuring method |
JPWO2009078291A1 (en) * | 2007-12-14 | 2011-04-28 | コニカミノルタオプト株式会社 | Optical pickup device |
JP5267143B2 (en) * | 2008-03-27 | 2013-08-21 | 富士フイルム株式会社 | Imaging apparatus and program |
JP5117920B2 (en) * | 2008-04-28 | 2013-01-16 | 株式会社ディスコ | Laser processing equipment |
JP5273667B2 (en) * | 2009-03-19 | 2013-08-28 | 国立大学法人東京工業大学 | Object identification device |
US8804125B2 (en) * | 2010-03-12 | 2014-08-12 | Konica Minolta, Inc. | Detection method for intermolecular interaction and detection device thereof |
JP2012063321A (en) * | 2010-09-17 | 2012-03-29 | Hamamatsu Photonics Kk | Reflectivity measurement device, reflectivity measurement method, film thickness measurement device, and film thickness measurement method |
JP5902529B2 (en) * | 2012-03-28 | 2016-04-13 | 株式会社ディスコ | Laser processing method |
JP6425368B2 (en) * | 2012-04-27 | 2018-11-21 | 株式会社ディスコ | Laser processing apparatus and laser processing method |
JP6151557B2 (en) | 2013-05-13 | 2017-06-21 | 株式会社ディスコ | Laser processing method |
JP2015029048A (en) * | 2013-07-05 | 2015-02-12 | 富士フイルム株式会社 | Laser device and photoacoustic measurement device |
-
2017
- 2017-05-23 JP JP2017101638A patent/JP7076951B2/en active Active
-
2018
- 2018-05-03 SG SG10201803749SA patent/SG10201803749SA/en unknown
- 2018-05-03 MY MYPI2018701765A patent/MY190868A/en unknown
- 2018-05-15 KR KR1020180055541A patent/KR102298469B1/en active IP Right Grant
- 2018-05-18 CN CN201810478064.0A patent/CN108931501B/en active Active
- 2018-05-21 TW TW107117300A patent/TWI785048B/en active
- 2018-05-22 US US15/985,821 patent/US10471536B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
TWI785048B (en) | 2022-12-01 |
JP2018197665A (en) | 2018-12-13 |
US20180339362A1 (en) | 2018-11-29 |
CN108931501A (en) | 2018-12-04 |
US10471536B2 (en) | 2019-11-12 |
KR102298469B1 (en) | 2021-09-03 |
JP7076951B2 (en) | 2022-05-30 |
TW201901774A (en) | 2019-01-01 |
KR20180128346A (en) | 2018-12-03 |
MY190868A (en) | 2022-05-13 |
CN108931501B (en) | 2022-06-24 |
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