SG10201800620XA - Determining method, measuring apparatus and adhesive tape attaching apparatus - Google Patents

Determining method, measuring apparatus and adhesive tape attaching apparatus

Info

Publication number
SG10201800620XA
SG10201800620XA SG10201800620XA SG10201800620XA SG10201800620XA SG 10201800620X A SG10201800620X A SG 10201800620XA SG 10201800620X A SG10201800620X A SG 10201800620XA SG 10201800620X A SG10201800620X A SG 10201800620XA SG 10201800620X A SG10201800620X A SG 10201800620XA
Authority
SG
Singapore
Prior art keywords
adhesive tape
determining method
tape attaching
measuring apparatus
determining
Prior art date
Application number
SG10201800620XA
Inventor
Inoue Atsushi
Sakaguchi Hiroyuki
Onishi Kenta
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201800620XA publication Critical patent/SG10201800620XA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
    • G01N3/14—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces generated by dead weight, e.g. pendulum; generated by springs tension
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/04—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring tension in flexible members, e.g. ropes, cables, wires, threads, belts or bands
    • G01L5/047—Specific indicating or recording arrangements, e.g. for remote indication, for indicating overload or underload
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
    • B65H35/0006—Article or web delivery apparatus incorporating cutting or line-perforating devices
    • B65H35/002—Hand-held or table apparatus
    • B65H35/0026—Hand-held or table apparatus for delivering pressure-sensitive adhesive tape
    • B65H35/0033—Hand-held or table apparatus for delivering pressure-sensitive adhesive tape and affixing it to a surface
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/04—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring tension in flexible members, e.g. ropes, cables, wires, threads, belts or bands
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/04—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring tension in flexible members, e.g. ropes, cables, wires, threads, belts or bands
    • G01L5/06—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring tension in flexible members, e.g. ropes, cables, wires, threads, belts or bands using mechanical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M99/00—Subject matter not provided for in other groups of this subclass
    • G01M99/007—Subject matter not provided for in other groups of this subclass by applying a load, e.g. for resistance or wear testing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0014—Type of force applied
    • G01N2203/0016—Tensile or compressive
    • G01N2203/0017—Tensile
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/003—Generation of the force
    • G01N2203/0032—Generation of the force using mechanical means
    • G01N2203/0033—Weight
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/003—Generation of the force
    • G01N2203/0032—Generation of the force using mechanical means
    • G01N2203/0039—Hammer or pendulum
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02—Details not specific for a particular testing method
    • G01N2203/026—Specifications of the specimen
    • G01N2203/0262—Shape of the specimen
    • G01N2203/0278—Thin specimens
    • G01N2203/0282—Two dimensional, e.g. tapes, webs, sheets, strips, disks or membranes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Coating Apparatus (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Automobile Manufacture Line, Endless Track Vehicle, Trailer (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)

Abstract

DETERMINING METHOD, MEASURING APPARATUS, AND ADHESIVE TAPE ATTACHING APPARATUS A determining method for determining whether or not the tension of an adhesive tape constituting a frame unit is proper, in which a plate-shaped workpiece and an annular frame are attached to the adhesive tape to form the frame unit, is provided. The adhesive tape is composed of a base layer and an adhesive layer formed on the base layer. The determining method includes a supporting step, a downward amount measuring step, and a determining step. (Figure 5B)
SG10201800620XA 2017-01-31 2018-01-24 Determining method, measuring apparatus and adhesive tape attaching apparatus SG10201800620XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017015094A JP6779579B2 (en) 2017-01-31 2017-01-31 Judgment method, measuring device, and adhesive tape sticking device

Publications (1)

Publication Number Publication Date
SG10201800620XA true SG10201800620XA (en) 2018-08-30

Family

ID=62977156

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201800620XA SG10201800620XA (en) 2017-01-31 2018-01-24 Determining method, measuring apparatus and adhesive tape attaching apparatus

Country Status (7)

Country Link
US (1) US10294062B2 (en)
JP (1) JP6779579B2 (en)
KR (1) KR102309434B1 (en)
CN (1) CN108376654B (en)
MY (1) MY181955A (en)
SG (1) SG10201800620XA (en)
TW (1) TWI753998B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7281873B2 (en) 2018-05-14 2023-05-26 株式会社ディスコ Wafer processing method
JP7166718B2 (en) * 2018-10-17 2022-11-08 株式会社ディスコ Wafer processing method
EP3705862B1 (en) * 2019-03-05 2023-07-05 Infineon Technologies AG Method and device for monitoring a dicing tape tension
CN114735510B (en) * 2020-12-25 2024-02-13 无锡市迦南胶粘科技有限公司 Application method of adhesive tape viscosity detection system

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2751784A (en) * 1952-06-20 1956-06-26 Gershberg Solomon Apparatus for testing adhesive tape
JPH01219609A (en) * 1988-02-29 1989-09-01 Oji Paper Co Ltd Method and apparatus for measuring elongation of wound product
JPH01158948U (en) * 1988-04-22 1989-11-02
JPH04198381A (en) * 1990-11-28 1992-07-17 Kanzaki Paper Mfg Co Ltd Tacky sheet
JPH05126652A (en) * 1991-10-31 1993-05-21 Kowa Co Noncontact tension measuring device
JPH0712710A (en) * 1993-06-28 1995-01-17 Resuka:Kk Adhesiveness testing device
KR100302311B1 (en) * 1994-01-03 2001-11-30 조민호 Jig apparatus for measuring adhesive property
KR970048398A (en) * 1995-12-27 1997-07-29 김태구 Adhesion time measuring device of double sided tape
KR100278137B1 (en) * 1997-09-04 2001-01-15 가나이 쓰도무 Method of mounting semiconductor device and system thereof, method of manufacturing semiconductor device isolator and IC card
EP1193487A4 (en) * 2000-04-04 2011-10-26 Lintec Corp Device and method for measuring adhesive strength
JP4444619B2 (en) * 2003-10-10 2010-03-31 リンテック株式会社 MOUNTING DEVICE AND MOUNTING METHOD
JP4316392B2 (en) 2004-01-16 2009-08-19 株式会社リコー Peel strength measuring device
JP4341431B2 (en) 2004-03-04 2009-10-07 凸版印刷株式会社 Thin film adhesion strength evaluation method and apparatus
JP4880293B2 (en) * 2005-11-24 2012-02-22 リンテック株式会社 Sheet sticking device and sticking method
JP4360684B2 (en) * 2006-02-22 2009-11-11 日東電工株式会社 Adhesive tape pasting method for semiconductor wafer and apparatus using the same
KR100795105B1 (en) * 2006-03-08 2008-01-17 (주) 기배이앤티 Test equipment for adhesive tape
JP2009076773A (en) 2007-09-21 2009-04-09 Disco Abrasive Syst Ltd Chuck table mechanism
JP5203744B2 (en) * 2008-02-21 2013-06-05 株式会社ディスコ Breaking method of adhesive film mounted on backside of wafer
JP5113599B2 (en) * 2008-04-08 2013-01-09 リンテック株式会社 Sheet sticking device and sticking method
JP5171944B2 (en) * 2008-05-09 2013-03-27 日東電工株式会社 Peel test apparatus and method for evaluating impact peel characteristics of adhesive tape
JP5324399B2 (en) * 2009-11-10 2013-10-23 リンテック株式会社 Sheet sticking device and sticking method
JP4568374B1 (en) * 2010-03-15 2010-10-27 大宮工業株式会社 Pasting device and pasting method
TWM411562U (en) 2010-09-16 2011-09-11 Tung-Yuan Tsaur System for measuring peeling force of adhesives
JP5261534B2 (en) * 2011-05-18 2013-08-14 リンテック株式会社 Inspection device
CN103245608A (en) 2012-02-14 2013-08-14 鸿富锦精密工业（深圳）有限公司 Double faced adhesive tape adhesive force detecting device
US9016136B1 (en) * 2013-03-12 2015-04-28 Shurtape Technologies, Llc Apparatus for testing adhesion of an adhesive tape to a bonding surface under a load applied to the tape
JP6234161B2 (en) * 2013-10-24 2017-11-22 株式会社ディスコ Adhesive tape sticking device
JP6178724B2 (en) * 2013-12-26 2017-08-09 株式会社ディスコ Wafer dividing method
KR102544982B1 (en) * 2016-09-02 2023-06-20 삼성디스플레이 주식회사 Apparatus and method for manufacturing a display apparatus

Also Published As

Publication number Publication date
JP6779579B2 (en) 2020-11-04
KR20200067239A (en) 2020-06-12
CN108376654A (en) 2018-08-07
CN108376654B (en) 2023-04-11
MY181955A (en) 2021-01-15
TW201840959A (en) 2018-11-16
KR102309434B1 (en) 2021-10-05
TWI753998B (en) 2022-02-01
US10294062B2 (en) 2019-05-21
US20180215571A1 (en) 2018-08-02
JP2018123211A (en) 2018-08-09

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