SG10201800618SA - Laser processing apparatus - Google Patents
Laser processing apparatusInfo
- Publication number
- SG10201800618SA SG10201800618SA SG10201800618SA SG10201800618SA SG10201800618SA SG 10201800618S A SG10201800618S A SG 10201800618SA SG 10201800618S A SG10201800618S A SG 10201800618SA SG 10201800618S A SG10201800618S A SG 10201800618SA SG 10201800618S A SG10201800618S A SG 10201800618SA
- Authority
- SG
- Singapore
- Prior art keywords
- laser processing
- chuck table
- processing apparatus
- line sensor
- unit
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/206—Laser sealing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3178—Coating or filling in grooves made in the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Abstract
LASER PROCESSING APPARATUS A laser processing apparatus includes: a chuck table that holds a packaged wafer by a holding surface; a laser processing unit that applies a laser beam to the packaged wafer to form a through-groove along each division line; an X-axis moving unit that moves the chuck table in an X-axis direction; and an examination unit. The chuck table includes: a holding member that forms the holding surface; and a light emitting body. The examination unit includes: a line sensor that extends in a Y-axis direction; and a control unit that determines the result of processing through reception by the line sensor of light from the light emitting body through the through-groove. The line sensor images the whole surface of the packaged wafer being held by the chuck table. (Figure 1)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017013501A JP2018121031A (en) | 2017-01-27 | 2017-01-27 | Laser processing device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201800618SA true SG10201800618SA (en) | 2018-08-30 |
Family
ID=62843051
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201800618SA SG10201800618SA (en) | 2017-01-27 | 2018-01-24 | Laser processing apparatus |
Country Status (7)
Country | Link |
---|---|
US (1) | US10807198B2 (en) |
JP (1) | JP2018121031A (en) |
KR (1) | KR20180088584A (en) |
CN (1) | CN108406105A (en) |
DE (1) | DE102018201156A1 (en) |
SG (1) | SG10201800618SA (en) |
TW (1) | TW201828341A (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210053150A1 (en) * | 2018-03-30 | 2021-02-25 | Tokyo Electron Limited | Laser processing device and laser processing method |
JP7368098B2 (en) * | 2019-04-17 | 2023-10-24 | 株式会社ディスコ | Wafer processing method |
JP7343293B2 (en) * | 2019-04-18 | 2023-09-12 | 株式会社ディスコ | Division processing device |
JP7325897B2 (en) * | 2019-04-18 | 2023-08-15 | 株式会社ディスコ | Machining device and machining method of workpiece |
JP7286464B2 (en) * | 2019-08-02 | 2023-06-05 | 株式会社ディスコ | Laser processing equipment |
JP7382762B2 (en) * | 2019-08-27 | 2023-11-17 | 株式会社ディスコ | How to judge the quality of processing results of laser processing equipment |
JP7370265B2 (en) | 2020-01-30 | 2023-10-27 | 株式会社ディスコ | Processing method and processing equipment |
CN111640695B (en) * | 2020-06-05 | 2023-04-11 | 深圳市长方集团股份有限公司 | Device and process for packaging UVC LED chip on wafer |
JP2022090272A (en) * | 2020-12-07 | 2022-06-17 | 株式会社ディスコ | Wafer manufacturing apparatus |
CN112992692B (en) * | 2021-05-19 | 2021-07-20 | 佛山市联动科技股份有限公司 | Method and system for full-automatic cutting of lead |
CN115458468B (en) * | 2022-11-11 | 2023-03-24 | 扬州韩思半导体科技有限公司 | Semiconductor wafer laser cutting device and method |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002100709A (en) | 2000-09-21 | 2002-04-05 | Hitachi Ltd | Semiconductor device and manufacturing method thereof |
JP2005064231A (en) * | 2003-08-12 | 2005-03-10 | Disco Abrasive Syst Ltd | Dividing method of plate-shaped article |
JP4684687B2 (en) * | 2005-03-11 | 2011-05-18 | 株式会社ディスコ | Wafer laser processing method and processing apparatus |
JP2008050219A (en) * | 2006-08-25 | 2008-03-06 | Shibaura Mechatronics Corp | Scribing groove forming apparatus, cutting apparatus and scribing groove forming method |
JP2008200694A (en) * | 2007-02-19 | 2008-09-04 | Disco Abrasive Syst Ltd | Method for machining wafer, and laser beam machining apparatus |
JP5140316B2 (en) * | 2007-05-18 | 2013-02-06 | 株式会社ディスコ | Inspection device |
JP4358889B1 (en) * | 2008-06-27 | 2009-11-04 | 日本エレクトロセンサリデバイス株式会社 | Wafer defect inspection equipment |
JP6108806B2 (en) * | 2012-12-10 | 2017-04-05 | 株式会社ディスコ | Processing equipment |
JP6393583B2 (en) * | 2014-10-30 | 2018-09-19 | 株式会社ディスコ | Protective film detection apparatus and protective film detection method |
JP2016120535A (en) * | 2014-12-24 | 2016-07-07 | 株式会社ディスコ | Processing apparatus |
JP6553940B2 (en) * | 2015-05-15 | 2019-07-31 | 株式会社ディスコ | Laser processing equipment |
-
2017
- 2017-01-27 JP JP2017013501A patent/JP2018121031A/en active Pending
-
2018
- 2018-01-22 KR KR1020180007542A patent/KR20180088584A/en not_active Application Discontinuation
- 2018-01-23 CN CN201810064024.1A patent/CN108406105A/en active Pending
- 2018-01-24 SG SG10201800618SA patent/SG10201800618SA/en unknown
- 2018-01-24 TW TW107102576A patent/TW201828341A/en unknown
- 2018-01-25 DE DE102018201156.7A patent/DE102018201156A1/en not_active Withdrawn
- 2018-01-26 US US15/880,846 patent/US10807198B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR20180088584A (en) | 2018-08-06 |
DE102018201156A1 (en) | 2018-08-02 |
TW201828341A (en) | 2018-08-01 |
CN108406105A (en) | 2018-08-17 |
JP2018121031A (en) | 2018-08-02 |
US10807198B2 (en) | 2020-10-20 |
US20180214986A1 (en) | 2018-08-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG10201800618SA (en) | Laser processing apparatus | |
SG10201800386QA (en) | Laser processing apparatus | |
MY179210A (en) | Laser processing apparatus | |
EP3552753A3 (en) | System for and method of processing transparent materials using laser beam focal lines adjustable in length and diameter | |
MY185737A (en) | Laser processing apparatus | |
LT3311947T (en) | Methods for laser processing transparent workpieces using non-axisymmetric beam spots | |
SG11201806983VA (en) | Exposure system, exposure device and exposure method | |
MY174992A (en) | Wafer processing method | |
EP3485855A3 (en) | Laser patterning apparatus of three-dimensional object to be processed and method thereof | |
MY177496A (en) | Laser processing apparatus | |
EP4275899A3 (en) | Dynamic optical assembly for laser-based additive manufacturing | |
GB2548666A (en) | Intergrated camera system having two dimensional image capture and three dimensional time-of-flight capture with movable illuminated region of interest | |
GB2540322A (en) | Metrology device and method of communicating with portable devices | |
MX360055B (en) | Vehicle-borne inspection system. | |
TW201614191A (en) | Surface profilometry device and method for monitoring wafers during processing | |
MY191252A (en) | Laser processing apparatus | |
EP3023942A3 (en) | Image processing apparatus and method | |
SG10201803285XA (en) | Plasma processing apparatus | |
SG10201803302PA (en) | Laser processing method | |
EP2837460A3 (en) | Laser irradiation apparatus | |
SG10201806895TA (en) | Cutting apparatus and groove detecting method | |
WO2016088721A8 (en) | Substrate monitoring device and substrate monitoring method | |
MX2020006931A (en) | Method, device and inspection line for determining the three-dimensional geometry of a container ring surface. | |
MX2019006806A (en) | Apparatus and method for printing roll cleaning. | |
MX2017013317A (en) | Method and apparatus for processing a fiber cushion body. |