SG10201800618SA - Laser processing apparatus - Google Patents

Laser processing apparatus

Info

Publication number
SG10201800618SA
SG10201800618SA SG10201800618SA SG10201800618SA SG10201800618SA SG 10201800618S A SG10201800618S A SG 10201800618SA SG 10201800618S A SG10201800618S A SG 10201800618SA SG 10201800618S A SG10201800618S A SG 10201800618SA SG 10201800618S A SG10201800618S A SG 10201800618SA
Authority
SG
Singapore
Prior art keywords
laser processing
chuck table
processing apparatus
line sensor
unit
Prior art date
Application number
SG10201800618SA
Inventor
Ban Yuri
Yoshida Yuta
Odanaka Kentaro
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201800618SA publication Critical patent/SG10201800618SA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/206—Laser sealing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3178—Coating or filling in grooves made in the semiconductor body

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)

Abstract

LASER PROCESSING APPARATUS A laser processing apparatus includes: a chuck table that holds a packaged wafer by a holding surface; a laser processing unit that applies a laser beam to the packaged wafer to form a through-groove along each division line; an X-axis moving unit that moves the chuck table in an X-axis direction; and an examination unit. The chuck table includes: a holding member that forms the holding surface; and a light emitting body. The examination unit includes: a line sensor that extends in a Y-axis direction; and a control unit that determines the result of processing through reception by the line sensor of light from the light emitting body through the through-groove. The line sensor images the whole surface of the packaged wafer being held by the chuck table. (Figure 1)
SG10201800618SA 2017-01-27 2018-01-24 Laser processing apparatus SG10201800618SA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017013501A JP2018121031A (en) 2017-01-27 2017-01-27 Laser processing device

Publications (1)

Publication Number Publication Date
SG10201800618SA true SG10201800618SA (en) 2018-08-30

Family

ID=62843051

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201800618SA SG10201800618SA (en) 2017-01-27 2018-01-24 Laser processing apparatus

Country Status (7)

Country Link
US (1) US10807198B2 (en)
JP (1) JP2018121031A (en)
KR (1) KR20180088584A (en)
CN (1) CN108406105A (en)
DE (1) DE102018201156A1 (en)
SG (1) SG10201800618SA (en)
TW (1) TW201828341A (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210053150A1 (en) * 2018-03-30 2021-02-25 Tokyo Electron Limited Laser processing device and laser processing method
JP7368098B2 (en) * 2019-04-17 2023-10-24 株式会社ディスコ Wafer processing method
JP7343293B2 (en) * 2019-04-18 2023-09-12 株式会社ディスコ Division processing device
JP7325897B2 (en) * 2019-04-18 2023-08-15 株式会社ディスコ Machining device and machining method of workpiece
JP7286464B2 (en) * 2019-08-02 2023-06-05 株式会社ディスコ Laser processing equipment
JP7382762B2 (en) * 2019-08-27 2023-11-17 株式会社ディスコ How to judge the quality of processing results of laser processing equipment
JP7370265B2 (en) 2020-01-30 2023-10-27 株式会社ディスコ Processing method and processing equipment
CN111640695B (en) * 2020-06-05 2023-04-11 深圳市长方集团股份有限公司 Device and process for packaging UVC LED chip on wafer
JP2022090272A (en) * 2020-12-07 2022-06-17 株式会社ディスコ Wafer manufacturing apparatus
CN112992692B (en) * 2021-05-19 2021-07-20 佛山市联动科技股份有限公司 Method and system for full-automatic cutting of lead
CN115458468B (en) * 2022-11-11 2023-03-24 扬州韩思半导体科技有限公司 Semiconductor wafer laser cutting device and method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002100709A (en) 2000-09-21 2002-04-05 Hitachi Ltd Semiconductor device and manufacturing method thereof
JP2005064231A (en) * 2003-08-12 2005-03-10 Disco Abrasive Syst Ltd Dividing method of plate-shaped article
JP4684687B2 (en) * 2005-03-11 2011-05-18 株式会社ディスコ Wafer laser processing method and processing apparatus
JP2008050219A (en) * 2006-08-25 2008-03-06 Shibaura Mechatronics Corp Scribing groove forming apparatus, cutting apparatus and scribing groove forming method
JP2008200694A (en) * 2007-02-19 2008-09-04 Disco Abrasive Syst Ltd Method for machining wafer, and laser beam machining apparatus
JP5140316B2 (en) * 2007-05-18 2013-02-06 株式会社ディスコ Inspection device
JP4358889B1 (en) * 2008-06-27 2009-11-04 日本エレクトロセンサリデバイス株式会社 Wafer defect inspection equipment
JP6108806B2 (en) * 2012-12-10 2017-04-05 株式会社ディスコ Processing equipment
JP6393583B2 (en) * 2014-10-30 2018-09-19 株式会社ディスコ Protective film detection apparatus and protective film detection method
JP2016120535A (en) * 2014-12-24 2016-07-07 株式会社ディスコ Processing apparatus
JP6553940B2 (en) * 2015-05-15 2019-07-31 株式会社ディスコ Laser processing equipment

Also Published As

Publication number Publication date
KR20180088584A (en) 2018-08-06
DE102018201156A1 (en) 2018-08-02
TW201828341A (en) 2018-08-01
CN108406105A (en) 2018-08-17
JP2018121031A (en) 2018-08-02
US10807198B2 (en) 2020-10-20
US20180214986A1 (en) 2018-08-02

Similar Documents

Publication Publication Date Title
SG10201800618SA (en) Laser processing apparatus
SG10201800386QA (en) Laser processing apparatus
MY179210A (en) Laser processing apparatus
EP3552753A3 (en) System for and method of processing transparent materials using laser beam focal lines adjustable in length and diameter
MY185737A (en) Laser processing apparatus
LT3311947T (en) Methods for laser processing transparent workpieces using non-axisymmetric beam spots
SG11201806983VA (en) Exposure system, exposure device and exposure method
MY174992A (en) Wafer processing method
EP3485855A3 (en) Laser patterning apparatus of three-dimensional object to be processed and method thereof
MY177496A (en) Laser processing apparatus
EP4275899A3 (en) Dynamic optical assembly for laser-based additive manufacturing
GB2548666A (en) Intergrated camera system having two dimensional image capture and three dimensional time-of-flight capture with movable illuminated region of interest
GB2540322A (en) Metrology device and method of communicating with portable devices
MX360055B (en) Vehicle-borne inspection system.
TW201614191A (en) Surface profilometry device and method for monitoring wafers during processing
MY191252A (en) Laser processing apparatus
EP3023942A3 (en) Image processing apparatus and method
SG10201803285XA (en) Plasma processing apparatus
SG10201803302PA (en) Laser processing method
EP2837460A3 (en) Laser irradiation apparatus
SG10201806895TA (en) Cutting apparatus and groove detecting method
WO2016088721A8 (en) Substrate monitoring device and substrate monitoring method
MX2020006931A (en) Method, device and inspection line for determining the three-dimensional geometry of a container ring surface.
MX2019006806A (en) Apparatus and method for printing roll cleaning.
MX2017013317A (en) Method and apparatus for processing a fiber cushion body.